KR20080087724A - 스테이지장치 - Google Patents

스테이지장치 Download PDF

Info

Publication number
KR20080087724A
KR20080087724A KR1020080027701A KR20080027701A KR20080087724A KR 20080087724 A KR20080087724 A KR 20080087724A KR 1020080027701 A KR1020080027701 A KR 1020080027701A KR 20080027701 A KR20080027701 A KR 20080027701A KR 20080087724 A KR20080087724 A KR 20080087724A
Authority
KR
South Korea
Prior art keywords
gantry
divided
stage
base
base frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020080027701A
Other languages
English (en)
Korean (ko)
Inventor
야스히토 나카모리
다츠야 요시다
Original Assignee
스미도모쥬기가이고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 스미도모쥬기가이고교 가부시키가이샤 filed Critical 스미도모쥬기가이고교 가부시키가이샤
Publication of KR20080087724A publication Critical patent/KR20080087724A/ko
Ceased legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Landscapes

  • Machine Tool Units (AREA)
KR1020080027701A 2007-03-27 2008-03-26 스테이지장치 Ceased KR20080087724A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007081987A JP4328364B2 (ja) 2007-03-27 2007-03-27 ステージ装置
JPJP-P-2007-00081987 2007-03-27

Publications (1)

Publication Number Publication Date
KR20080087724A true KR20080087724A (ko) 2008-10-01

Family

ID=39114853

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020080027701A Ceased KR20080087724A (ko) 2007-03-27 2008-03-26 스테이지장치

Country Status (4)

Country Link
JP (1) JP4328364B2 (https=)
KR (1) KR20080087724A (https=)
CN (1) CN101274407A (https=)
TW (1) TW200844020A (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4964853B2 (ja) * 2008-09-24 2012-07-04 住友重機械工業株式会社 ステージ装置
JP5550255B2 (ja) * 2009-04-28 2014-07-16 株式会社日立製作所 ペースト塗布装置及び塗布方法
JP5380225B2 (ja) * 2009-09-24 2014-01-08 株式会社日立ハイテクノロジーズ ガラス基板の検査装置
JP6025516B2 (ja) * 2012-11-15 2016-11-16 三菱重工業株式会社 取付加工機および加工方法
JP2014195805A (ja) * 2014-05-19 2014-10-16 芝浦メカトロニクス株式会社 ペースト塗布装置
CN111715943A (zh) * 2019-03-22 2020-09-29 江苏中朕智能工程有限公司 一种停车场道闸管理系统闸杆裁剪用切割机

Also Published As

Publication number Publication date
JP4328364B2 (ja) 2009-09-09
TW200844020A (en) 2008-11-16
CN101274407A (zh) 2008-10-01
JP2008023698A (ja) 2008-02-07

Similar Documents

Publication Publication Date Title
KR100852876B1 (ko) 스테이지장치
KR100993473B1 (ko) 스테이지장치
KR20080087724A (ko) 스테이지장치
JP2012520184A (ja) 工作機械用ガイドキャリッジ・アセンブリ
US20100243617A1 (en) Printed circuit board via drilling stage assembly
CN101459104B (zh) 台装置
JP4150411B2 (ja) ステージ装置
KR20080069927A (ko) 스테이지장치의 이동체
WO2021229782A1 (ja) コンベアテーブル移載装置、搬送システムおよびコンベアテーブル移載方法
TWI260646B (en) X-Y axis stage device
JP4964853B2 (ja) ステージ装置
JP2940663B2 (ja) ステージの縦横移動旋回支持機構
JP2009147291A (ja) ステージ装置
JP5260914B2 (ja) 単軸ロボット
JP4116167B2 (ja) 静圧空気軸受直線案内装置
KR100541461B1 (ko) 스테이지장치
JP2005302838A (ja) 位置決め装置
JP7301655B2 (ja) 基板作業装置およびその製造方法
JP7127114B2 (ja) 作業機
JP2021010956A (ja) パレット搬送装置及びパレット搬送方法
JP7603677B2 (ja) コンベアテーブル移載装置、搬送システムおよびコンベアテーブル移載方法
KR20090124217A (ko) 중량물 탑재용 이송 장치
CN103369945A (zh) 部件安装装置及方法
EP3413446B1 (en) Movable coil type linear motor
JPS62182692A (ja) Ｘｙステ−ジ

Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

D14-X000 Search report completed

St.27 status event code: A-1-2-D10-D14-srh-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

E601 Decision to refuse application
PE0601 Decision on rejection of patent

St.27 status event code: N-2-6-B10-B15-exm-PE0601

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000