TW200843930A - Method of compression molding for electronic part and apparatus therefor - Google Patents
Method of compression molding for electronic part and apparatus therefor Download PDFInfo
- Publication number
- TW200843930A TW200843930A TW097108668A TW97108668A TW200843930A TW 200843930 A TW200843930 A TW 200843930A TW 097108668 A TW097108668 A TW 097108668A TW 97108668 A TW97108668 A TW 97108668A TW 200843930 A TW200843930 A TW 200843930A
- Authority
- TW
- Taiwan
- Prior art keywords
- resin
- release film
- resin material
- cavity
- electronic component
- Prior art date
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
- B29C37/0003—Discharging moulded articles from the mould
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
- B29C37/0067—Using separating agents during or after moulding; Applying separating agents on preforms or articles, e.g. to prevent sticking to each other
- B29C37/0075—Using separating agents during or after moulding; Applying separating agents on preforms or articles, e.g. to prevent sticking to each other using release sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
- B29C43/183—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles the preformed layer being a lining, e.g. shaped in the mould before compression moulding, or a preformed shell adapted to the shape of the mould
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/34—Feeding the material to the mould or the compression means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/58—Measuring, controlling or regulating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
- H01L21/566—Release layers for moulds, e.g. release layers, layers against residue during moulding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/34—Feeding the material to the mould or the compression means
- B29C2043/3405—Feeding the material to the mould or the compression means using carrying means
- B29C2043/3427—Feeding the material to the mould or the compression means using carrying means hopper, vessel, chute, tube, conveying screw, for material in discrete form, e.g. particles or powder or fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
- B29C43/183—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles the preformed layer being a lining, e.g. shaped in the mould before compression moulding, or a preformed shell adapted to the shape of the mould
- B29C43/184—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles the preformed layer being a lining, e.g. shaped in the mould before compression moulding, or a preformed shell adapted to the shape of the mould shaped by the compression of the material during moulding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01075—Rhenium [Re]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007063336A JP4855307B2 (ja) | 2007-03-13 | 2007-03-13 | 電子部品の圧縮成形方法 |
JP2007097346A JP2008254266A (ja) | 2007-04-03 | 2007-04-03 | 電子部品の圧縮成形方法及び装置 |
JP2007122957A JP4855329B2 (ja) | 2007-05-08 | 2007-05-08 | 電子部品の圧縮成形方法及び装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200843930A true TW200843930A (en) | 2008-11-16 |
TWI355325B TWI355325B (ko) | 2012-01-01 |
Family
ID=39863685
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW097108668A TW200843930A (en) | 2007-03-13 | 2008-03-12 | Method of compression molding for electronic part and apparatus therefor |
Country Status (5)
Country | Link |
---|---|
KR (3) | KR101245393B1 (ko) |
MY (3) | MY154681A (ko) |
SG (2) | SG161252A1 (ko) |
TW (1) | TW200843930A (ko) |
WO (1) | WO2008126527A1 (ko) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102971127A (zh) * | 2010-07-08 | 2013-03-13 | 东和株式会社 | 树脂密封电子器件的制造方法以及电子器件的树脂密封装置 |
CN103295921A (zh) * | 2012-02-28 | 2013-09-11 | 东和株式会社 | 树脂密封装置以及树脂密封体的制造方法 |
US10847480B2 (en) | 2018-11-28 | 2020-11-24 | Shiann-Tsong Tsai | Semiconductor package with in-package compartmental shielding and fabrication method thereof |
US10896880B2 (en) | 2018-11-28 | 2021-01-19 | Shiann-Tsong Tsai | Semiconductor package with in-package compartmental shielding and fabrication method thereof |
US10923435B2 (en) | 2018-11-28 | 2021-02-16 | Shiann-Tsong Tsai | Semiconductor package with in-package compartmental shielding and improved heat-dissipation performance |
CN112706347A (zh) * | 2019-10-25 | 2021-04-27 | 东和株式会社 | 粉粒体供给装置、树脂成形装置及树脂成形品的制造方法 |
US11211340B2 (en) | 2018-11-28 | 2021-12-28 | Shiann-Tsong Tsai | Semiconductor package with in-package compartmental shielding and active electro-magnetic compatibility shielding |
TWI816472B (zh) * | 2021-09-28 | 2023-09-21 | 日商山田尖端科技股份有限公司 | 樹脂密封裝置以及樹脂密封方法 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010162710A (ja) * | 2009-01-13 | 2010-07-29 | Sumitomo Heavy Ind Ltd | 樹脂封止装置及び樹脂封止方法 |
JP6039198B2 (ja) * | 2012-03-07 | 2016-12-07 | Towa株式会社 | 樹脂封止電子部品の製造方法及び樹脂封止電子部品の製造装置 |
JP6310773B2 (ja) * | 2014-05-22 | 2018-04-11 | Towa株式会社 | 樹脂成形装置及び樹脂成形方法 |
JP6525580B2 (ja) * | 2014-12-24 | 2019-06-05 | Towa株式会社 | 樹脂成形装置及び樹脂成形方法 |
JP6672103B2 (ja) * | 2016-08-01 | 2020-03-25 | Towa株式会社 | 樹脂成形装置及び樹脂成形品製造方法 |
JP7428384B2 (ja) * | 2020-10-06 | 2024-02-06 | アピックヤマダ株式会社 | 樹脂封止装置及び樹脂封止方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3900947B2 (ja) * | 2002-01-30 | 2007-04-04 | 大日本インキ化学工業株式会社 | 燃料電池用セパレータの製造方法、燃料電池セパレータおよび燃料電池 |
JP4262468B2 (ja) * | 2002-10-30 | 2009-05-13 | アピックヤマダ株式会社 | 樹脂モールド方法、樹脂モールド装置およびこれに用いる支持治具 |
JP4052939B2 (ja) * | 2002-12-17 | 2008-02-27 | Towa株式会社 | 電子部品の樹脂封止成形方法及び装置 |
JP4336499B2 (ja) * | 2003-01-09 | 2009-09-30 | Towa株式会社 | 電子部品の樹脂封止成形方法及び装置 |
JP4373237B2 (ja) | 2004-02-13 | 2009-11-25 | Towa株式会社 | 半導体チップの樹脂封止成形方法および樹脂封止成形用金型 |
JP4469755B2 (ja) * | 2005-05-23 | 2010-05-26 | 株式会社松井製作所 | 圧縮成形加工における粉粒体材料の充填装置 |
-
2008
- 2008-03-06 MY MYPI20092598A patent/MY154681A/en unknown
- 2008-03-06 KR KR1020127010489A patent/KR101245393B1/ko active IP Right Grant
- 2008-03-06 WO PCT/JP2008/054026 patent/WO2008126527A1/ja active Application Filing
- 2008-03-06 KR KR1020117011977A patent/KR101162460B1/ko active IP Right Grant
- 2008-03-06 SG SG201002433-9A patent/SG161252A1/en unknown
- 2008-03-06 KR KR1020097014160A patent/KR101107843B1/ko active IP Right Grant
- 2008-03-06 MY MYPI2014002351A patent/MY182097A/en unknown
- 2008-03-06 SG SG2012062972A patent/SG184703A1/en unknown
- 2008-03-06 MY MYPI2014002352A patent/MY182099A/en unknown
- 2008-03-12 TW TW097108668A patent/TW200843930A/zh unknown
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102971127A (zh) * | 2010-07-08 | 2013-03-13 | 东和株式会社 | 树脂密封电子器件的制造方法以及电子器件的树脂密封装置 |
CN102971127B (zh) * | 2010-07-08 | 2016-01-20 | 东和株式会社 | 树脂密封电子器件的制造方法以及电子器件的树脂密封装置 |
CN103295921A (zh) * | 2012-02-28 | 2013-09-11 | 东和株式会社 | 树脂密封装置以及树脂密封体的制造方法 |
CN103295921B (zh) * | 2012-02-28 | 2016-05-04 | 东和株式会社 | 树脂密封装置以及树脂密封体的制造方法 |
US10847480B2 (en) | 2018-11-28 | 2020-11-24 | Shiann-Tsong Tsai | Semiconductor package with in-package compartmental shielding and fabrication method thereof |
US10896880B2 (en) | 2018-11-28 | 2021-01-19 | Shiann-Tsong Tsai | Semiconductor package with in-package compartmental shielding and fabrication method thereof |
US10923435B2 (en) | 2018-11-28 | 2021-02-16 | Shiann-Tsong Tsai | Semiconductor package with in-package compartmental shielding and improved heat-dissipation performance |
US11211340B2 (en) | 2018-11-28 | 2021-12-28 | Shiann-Tsong Tsai | Semiconductor package with in-package compartmental shielding and active electro-magnetic compatibility shielding |
CN112706347A (zh) * | 2019-10-25 | 2021-04-27 | 东和株式会社 | 粉粒体供给装置、树脂成形装置及树脂成形品的制造方法 |
CN112706347B (zh) * | 2019-10-25 | 2022-12-30 | 东和株式会社 | 粉粒体供给装置、树脂成形装置及树脂成形品的制造方法 |
TWI816472B (zh) * | 2021-09-28 | 2023-09-21 | 日商山田尖端科技股份有限公司 | 樹脂密封裝置以及樹脂密封方法 |
Also Published As
Publication number | Publication date |
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KR101162460B1 (ko) | 2012-07-04 |
MY154681A (en) | 2015-07-15 |
KR101107843B1 (ko) | 2012-02-09 |
KR20120048047A (ko) | 2012-05-14 |
KR20090097910A (ko) | 2009-09-16 |
SG161252A1 (en) | 2010-05-27 |
TWI355325B (ko) | 2012-01-01 |
KR20110081309A (ko) | 2011-07-13 |
SG184703A1 (en) | 2012-10-30 |
MY182099A (en) | 2021-01-18 |
KR101245393B1 (ko) | 2013-03-19 |
MY182097A (en) | 2021-01-18 |
WO2008126527A1 (ja) | 2008-10-23 |
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