TW200842347A - Pattern checking device and pattern checking mehtod - Google Patents

Pattern checking device and pattern checking mehtod Download PDF

Info

Publication number
TW200842347A
TW200842347A TW096139041A TW96139041A TW200842347A TW 200842347 A TW200842347 A TW 200842347A TW 096139041 A TW096139041 A TW 096139041A TW 96139041 A TW96139041 A TW 96139041A TW 200842347 A TW200842347 A TW 200842347A
Authority
TW
Taiwan
Prior art keywords
pattern
substrate
illumination
light
illumination light
Prior art date
Application number
TW096139041A
Other languages
English (en)
Chinese (zh)
Inventor
Kentaro Nomoto
Ryozo Matsuda
Hiroki Hayashi
Original Assignee
Ushio Electric Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ushio Electric Inc filed Critical Ushio Electric Inc
Publication of TW200842347A publication Critical patent/TW200842347A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Wire Bonding (AREA)
TW096139041A 2007-04-17 2007-10-18 Pattern checking device and pattern checking mehtod TW200842347A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007107879A JP2008267851A (ja) 2007-04-17 2007-04-17 パターン検査装置およびパターン検査方法

Publications (1)

Publication Number Publication Date
TW200842347A true TW200842347A (en) 2008-11-01

Family

ID=40034651

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096139041A TW200842347A (en) 2007-04-17 2007-10-18 Pattern checking device and pattern checking mehtod

Country Status (4)

Country Link
JP (1) JP2008267851A (ja)
KR (1) KR20080093850A (ja)
CN (1) CN101290296A (ja)
TW (1) TW200842347A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI485393B (zh) * 2010-06-30 2015-05-21 Daiichi Jitsugyo Viswill Co Ltd Ｌｅｄ晶片檢測裝置

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG158782A1 (en) 2008-07-28 2010-02-26 Chan Sok Leng Method and system for detecting micro-cracks in wafers
SG158787A1 (en) 2008-07-28 2010-02-26 Chan Sok Leng Apparatus for detecting micro-cracks in wafers and method therefor
EP2351073B8 (en) * 2008-11-25 2018-11-07 Applied Materials, Inc. Apparatus for detecting micro-cracks in wafers
JP5481908B2 (ja) * 2009-04-02 2014-04-23 セイコーエプソン株式会社 画像読取装置およびその制御装置、プログラム、制御方法
JP5255551B2 (ja) * 2009-11-16 2013-08-07 日東電工株式会社 検査装置および配線回路基板の検査方法
JP5559644B2 (ja) * 2010-09-03 2014-07-23 株式会社トプコン 検査装置
US8766192B2 (en) * 2010-11-01 2014-07-01 Asm Assembly Automation Ltd Method for inspecting a photovoltaic substrate
CN102914266B (zh) * 2012-11-15 2015-04-22 深圳市华星光电技术有限公司 一种线宽量测装置
JP2014157086A (ja) * 2013-02-15 2014-08-28 Dainippon Screen Mfg Co Ltd パターン検査装置
JP6496159B2 (ja) * 2015-02-23 2019-04-03 株式会社Ｓｃｒｅｅｎホールディングス パターン検査装置およびパターン検査方法
JP6408654B1 (ja) * 2017-06-16 2018-10-17 株式会社オプトン 検査装置
US11340284B2 (en) * 2019-07-23 2022-05-24 Kla Corporation Combined transmitted and reflected light imaging of internal cracks in semiconductor devices

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI485393B (zh) * 2010-06-30 2015-05-21 Daiichi Jitsugyo Viswill Co Ltd Ｌｅｄ晶片檢測裝置

Also Published As

Publication number Publication date
CN101290296A (zh) 2008-10-22
JP2008267851A (ja) 2008-11-06
KR20080093850A (ko) 2008-10-22

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