KR20080093850A - 패턴 검사 장치 및 패턴 검사 방법 - Google Patents

패턴 검사 장치 및 패턴 검사 방법 Download PDF

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Publication number
KR20080093850A
KR20080093850A KR1020070115409A KR20070115409A KR20080093850A KR 20080093850 A KR20080093850 A KR 20080093850A KR 1020070115409 A KR1020070115409 A KR 1020070115409A KR 20070115409 A KR20070115409 A KR 20070115409A KR 20080093850 A KR20080093850 A KR 20080093850A
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KR
South Korea
Prior art keywords
substrate
pattern
illumination
light
board
Prior art date
Application number
KR1020070115409A
Other languages
English (en)
Korean (ko)
Inventor
겐타로 노모토
료조 마쯔다
히로키 하야시
Original Assignee
우시오덴키 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 우시오덴키 가부시키가이샤 filed Critical 우시오덴키 가부시키가이샤
Publication of KR20080093850A publication Critical patent/KR20080093850A/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Wire Bonding (AREA)
KR1020070115409A 2007-04-17 2007-11-13 패턴 검사 장치 및 패턴 검사 방법 KR20080093850A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2007-00107879 2007-04-17
JP2007107879A JP2008267851A (ja) 2007-04-17 2007-04-17 パターン検査装置およびパターン検査方法

Publications (1)

Publication Number Publication Date
KR20080093850A true KR20080093850A (ko) 2008-10-22

Family

ID=40034651

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020070115409A KR20080093850A (ko) 2007-04-17 2007-11-13 패턴 검사 장치 및 패턴 검사 방법

Country Status (4)

Country Link
JP (1) JP2008267851A (ja)
KR (1) KR20080093850A (ja)
CN (1) CN101290296A (ja)
TW (1) TW200842347A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140103027A (ko) * 2013-02-15 2014-08-25 다이니폰 스크린 세이조우 가부시키가이샤 패턴 검사 장치 및 패턴 검사 방법

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG158782A1 (en) 2008-07-28 2010-02-26 Chan Sok Leng Method and system for detecting micro-cracks in wafers
SG158787A1 (en) 2008-07-28 2010-02-26 Chan Sok Leng Apparatus for detecting micro-cracks in wafers and method therefor
EP2351073B8 (en) * 2008-11-25 2018-11-07 Applied Materials, Inc. Apparatus for detecting micro-cracks in wafers
JP5481908B2 (ja) * 2009-04-02 2014-04-23 セイコーエプソン株式会社 画像読取装置およびその制御装置、プログラム、制御方法
JP5255551B2 (ja) * 2009-11-16 2013-08-07 日東電工株式会社 検査装置および配線回路基板の検査方法
JP5563388B2 (ja) * 2010-06-30 2014-07-30 第一実業ビスウィル株式会社 チップｌｅｄ検査装置
JP5559644B2 (ja) * 2010-09-03 2014-07-23 株式会社トプコン 検査装置
US8766192B2 (en) * 2010-11-01 2014-07-01 Asm Assembly Automation Ltd Method for inspecting a photovoltaic substrate
CN102914266B (zh) * 2012-11-15 2015-04-22 深圳市华星光电技术有限公司 一种线宽量测装置
JP6496159B2 (ja) * 2015-02-23 2019-04-03 株式会社Ｓｃｒｅｅｎホールディングス パターン検査装置およびパターン検査方法
JP6408654B1 (ja) * 2017-06-16 2018-10-17 株式会社オプトン 検査装置
US11340284B2 (en) * 2019-07-23 2022-05-24 Kla Corporation Combined transmitted and reflected light imaging of internal cracks in semiconductor devices

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140103027A (ko) * 2013-02-15 2014-08-25 다이니폰 스크린 세이조우 가부시키가이샤 패턴 검사 장치 및 패턴 검사 방법

Also Published As

Publication number Publication date
CN101290296A (zh) 2008-10-22
TW200842347A (en) 2008-11-01
JP2008267851A (ja) 2008-11-06

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