200842347 九、發明說明 【發明所屬之技術領域】 本發明是關於圖案檢查裝置及圖案檢查方法，尤其 是，檢查有無產生於形成在TAB(Tape Automated Bonding) 膠帶等的光透射性的基板的配線圖案等的圖案表面的凹坑 (穴）的圖案的圖案檢查裝置及圖案檢查方法。 【先前技術】 習知，在配線圖案的檢查中，區別附著於基板表面或 背面的灰塵（異物）與配線圖案的缺陷，防止誤檢查的方法 或裝置，例如被提案在專利文獻1或專利文獻2。在上述 公報記載著比較顯像來自形成有配線圖案的基板的反射照 明光所得到的反射照射畫像，及顯像來自形成有配線圖案 的基板背面側的透射照明光所得到的透射照明畫像，將其 通於兩者的畫像所出現的不良作爲配線圖案的缺陷的情 形。 專利文獻1 :日本特開2004-61491號公報 專利文獻2:日本特開2005-24386號公報 【發明內容】 第11圖是表示具有稱爲形成於基板101上的凹坑 103的凹陷（穴）或突起104的配線圖案102的局部斷面 圖。 一般’形成於基板1 〇 1上的配線圖案1 〇 2的表面是平 -5- 200842347 坦。但是，如第1 1 (a)圖所示地，在形成於基板1 〇 1上的 配線圖案102的表面產生凹坑103，或是，如第11(b)圖 所示地，在形成於基板上的配線圖案102的表面產生 突起104的情形。又，在此些圖式中，極端地很大的表示 對於基板1 〇 1的配線圖案1 〇2的大小。 在配線圖案102的表面產生凹坑103時，則在檢查工 程中必須檢測作爲不良，因爲，僅其部分會使配線變細之 故，因而有產生斷線之虞。尤其是，形成在被使用於進行 折彎之部分的可撓式基板的圖案時，若重複折彎，則在凹 坑部分會發生斷線的情形。對於此，在配線圖案1 〇2的表 面產生突起104時，即使折彎也不會有斷線之虞，尤其 是，不會成爲問題。但是，在配線圖案檢查裝置中，產生 無法區別產生於配線圖案102表面的凹坑103與突起104 的區別的問題。 使用第11圖來說明該問題。在圖案檢查裝置中，檢 查配線圖案是依據攝影藉照光所照明的領域的畫像來進 行，惟使用反射照明光的情形，對於基板1 〇 1，照明手段 是配置於形成有配線圖案1 02之一側，而攝影配線圖案 102的攝影手段也位於相同一側。當在配線圖案102照射 照明光，則被照射於配線圖案1 02表面的照明光，是表面 平坦，則照明光是被反射，而被入射於攝影手段。被照射 在配線圖案1 02以外的部分的照射光，是透射基板1 〇 1或 被吸收在基板1 〇 1，而不會於攝影手段。因此，在攝影手 段中，配線圖案1 02的表面是明亮地照出來，而基板1 〇 1 -6- 200842347 是黑黑地照出來。 如第1 1(a)圖所示地，若在配線圖案102的表面有凹 坑103，則被照射在該凹坑103的部分的照明光，是在凹 坑1 03中重複反射而減弱，光線是不會入射至攝影手段。 如此地，產生凹坑103的部分是變暗。但是如第1 1(b)圖 所示地，即使產生在配線圖案102的表面者爲突起104， 被照射到突起1 04的照明光，是也被反射到突起1 04的外 壁（斜面），而在攝影手段不會入射有光。因此，突起104 的部分也變暗。所以，在攝影手段，凹坑1 03的部分或突 起1 04的部分被顯示黑暗，而無法區別兩者。如此地，依 反射照明光的檢查，可檢測在配線圖案表面產生凹坑1 03 或突起104的部分，惟無法區別凹坑103與突起104的區 別，如上述地凹坑1 03是必須檢測作爲不良，惟突起1 〇4 的情形是沒有必要。若將在配線圖案1 02的表面產生黑暗 部分都作爲不良，則本來不是不良的突起1 04的配線圖案 1 02也成爲不良的可能性，而降低生產性。 一方面，在依透射照明光的配線圖案的檢查，對於基 板，照明手段是配置於與形成有配線圖案的一側的相反 側，而攝影手段是配置於形成有配線圖案的一側。所以， 配線圖案的表面是成爲配線圖案的黑暗，而無法檢測有無 凹坑1 03。 本發明的目的是鑑於上述的問題，提供可利用反射照 明光與透射照明光，來區別產生於圖案的表面的凹坑與突 起，僅凹坑檢測作爲不良的圖案檢查裝置。 -7- 200842347 本發明是爲了解決上述的課題，採用下述手段。 第一手段爲一種圖案檢查裝置，屬於在形成於光透射 性的基板上的圖案照射照明光，依據攝影該照明光所照射 的領域的畫像來判定上述圖案的良否的圖案檢查裝置，其 特徵爲：具備：從形成於上述基板上的圖案側，照射中心 光線對於上述基板大約正交的照明光的第一照明手段；及 在與形成於上述基板上的圖案側相反側，從將藉由上述第 一照明手段所照明的領域對於上述基板朝法線方向投影的 領域外，對於上述基板照射照明光的第二照明手段，及 對於上述基板，設於與依上述第一照明手段的照明光的照 射方向相同方向的攝影手段；及控制上述第一照明手段與 上述第二照明手段的控制手段，上述控制手段是對於上述 基板，同時也進行依上述第一照明手段的照明與依上述第 二照明手段的照明，上述攝影手段是攝影藉由上述第一照 明手段與上述第二照明手段同時地被照明的圖案。 第二手段是一種圖案檢查方法，屬於在形成於光透射 性的基板上的圖案照射照明光，依據攝影該照明光所照射 的領域的畫像來判定上述圖案的良否的圖案檢查方法，其 特徵爲：同時地進行依從形成於上述基板上的圖案側，照 射中心光線對於上述基板大約正交的照明光的第一照明手 段的照明；及依在與形成於上述基板上的圖案側相反側， 從將藉由上述第一照明手段所照明的領域對於上述基板朝 法線方向投影的領域外，對於上述基板照射照明光的第二 照明手段的照明，對於上述基板，藉由設於與依上述第一 -8-[Technical Field] The present invention relates to a pattern inspection device and a pattern inspection method, and in particular, to check whether or not a wiring pattern generated on a light transmissive substrate formed on a TAB (Tape Automated Bonding) tape or the like is inspected. A pattern inspection device and a pattern inspection method for a pattern of pits (holes) on the surface of the pattern. [Prior Art] A method or apparatus for distinguishing between a dust (foreign matter) and a wiring pattern adhered to a surface or a back surface of a substrate to prevent erroneous inspection, for example, in Patent Document 1 or Patent Document 2. In the above publication, a reflection illumination image obtained by relatively reflecting the reflected illumination light from the substrate on which the wiring pattern is formed, and a transmission illumination image obtained by transmitting the illumination light from the back side of the substrate on which the wiring pattern is formed are described. This is a case in which the defects appearing in the portraits of the two are defects of the wiring pattern. [Patent Document 1] Japanese Laid-Open Patent Publication No. Hei. No. 2005-61491. SUMMARY OF THE INVENTION FIG. 11 is a view showing a recess (hole) having a pit 103 formed on a substrate 101. Or a partial cross-sectional view of the wiring pattern 102 of the protrusions 104. Generally, the surface of the wiring pattern 1 〇 2 formed on the substrate 1 〇 1 is flat -5 - 200842347. However, as shown in Fig. 1 (a), pits 103 are formed on the surface of the wiring pattern 102 formed on the substrate 1A, or as shown in Fig. 11(b). A case where the protrusion 104 is generated on the surface of the wiring pattern 102 on the substrate. Further, in these drawings, the size of the wiring pattern 1 〇 2 for the substrate 1 〇 1 is extremely large. When the pits 103 are formed on the surface of the wiring pattern 102, it is necessary to detect the defect in the inspection process, because only a part thereof may cause the wiring to be thinned, and thus the wire may be broken. In particular, when the pattern of the flexible substrate used in the portion to be bent is formed, if the bending is repeated, the wire may be broken at the pit portion. In this case, when the projection 104 is formed on the surface of the wiring pattern 1 〇 2, there is no possibility of disconnection even if the bending is performed, and in particular, it does not become a problem. However, in the wiring pattern inspection device, there is a problem that the difference between the pit 103 and the projection 104 which are generated on the surface of the wiring pattern 102 cannot be distinguished. Use Figure 11 to illustrate the problem. In the pattern inspection device, the inspection wiring pattern is performed based on the image of the area illuminated by the photography borrowing light, but in the case of using the reflected illumination light, for the substrate 1 〇1, the illumination means is disposed in one of the wiring patterns 102 formed. On the side, the photographing means of the photographing wiring pattern 102 are also located on the same side. When the illumination light is applied to the wiring pattern 102, the illumination light that is irradiated on the surface of the wiring pattern 012 has a flat surface, and the illumination light is reflected and incident on the imaging means. The irradiation light that is irradiated on a portion other than the wiring pattern 012 is transmitted through the substrate 1 〇 1 or absorbed on the substrate 1 〇 1 without being photographed. Therefore, in the photographing means, the surface of the wiring pattern 102 is brightly illuminated, and the substrate 1 〇 1 -6 - 200842347 is black and black. As shown in Fig. 1(a), when the pit 103 is provided on the surface of the wiring pattern 102, the illumination light irradiated to the portion of the pit 103 is repeatedly reflected and weakened in the pit 103. Light is not incident on the means of photography. As such, the portion where the pit 103 is generated is darkened. However, as shown in Fig. 1(b), even if the surface of the wiring pattern 102 is the protrusion 104, the illumination light that is irradiated onto the protrusion 104 is reflected to the outer wall (bevel) of the protrusion 104. In the means of photography, there is no incident light. Therefore, the portion of the protrusion 104 also becomes dark. Therefore, in the photographic means, the portion of the pit 103 or the portion of the bulge 104 is displayed dark, and it is impossible to distinguish the two. Thus, according to the inspection of the reflected illumination light, the portion where the pits 103 or the protrusions 104 are generated on the surface of the wiring pattern can be detected, but the difference between the pits 103 and the protrusions 104 cannot be distinguished, as the above-described pits 103 must be detected as Bad, but the situation of protrusion 1 〇 4 is not necessary. When the dark portion is generated on the surface of the wiring pattern 012 as a defect, the wiring pattern 102 which is not originally defective is also defective, and the productivity is lowered. On the other hand, in the inspection of the wiring pattern of the transmitted illumination light, the illumination means is disposed on the side opposite to the side on which the wiring pattern is formed, and the imaging means is disposed on the side on which the wiring pattern is formed. Therefore, the surface of the wiring pattern is the darkness of the wiring pattern, and it is impossible to detect the presence or absence of the pit 103. SUMMARY OF THE INVENTION An object of the present invention is to provide a pattern inspection device which can be distinguished from a surface of a pattern by using reflected illumination light and transmission illumination light to distinguish pits and projections generated on the surface of the pattern. -7- 200842347 The present invention has been made in order to solve the above problems. The first method is a pattern inspection device, and is a pattern inspection device that illuminates illumination light on a pattern formed on a light-transmissive substrate, and determines whether the pattern is good or not based on an image of a field illuminated by the illumination light. Providing: a first illumination means for illuminating an illumination light having a center ray approximately orthogonal to the substrate from a pattern side formed on the substrate; and a side opposite to a pattern side formed on the substrate, The field illuminated by the first illumination means is a second illumination means for illuminating the substrate with the illumination light, and the illumination means for the illumination of the first illumination means. a photographing means having the same direction of the illumination direction; and a control means for controlling the first illumination means and the second illumination means, wherein the control means performs illumination by the first illumination means and the second illumination on the substrate The illumination of the means, the photographing means is photography by the first illumination means and the above The two illumination means are simultaneously illuminated patterns. The second method is a pattern inspection method, and is a pattern inspection method for determining whether the pattern is good or not based on an image of a field on which the illumination light is irradiated, by irradiating the illumination light on the pattern formed on the light-transmitting substrate. Simultaneously illuminating the pattern side formed on the substrate, illuminating the first illumination means for illuminating light of the center light to be approximately orthogonal to the substrate, and illuminating the side opposite to the pattern side formed on the substrate The illumination of the second illuminating means for illuminating the substrate by the field illuminated by the first illumination means for the substrate projected in the normal direction, and the substrate is provided by One-8-
200842347 照明手段的照明光的照射方向相同方向的攝影 上述基板的圖案，依據所攝影的畫像，檢測有 的凹坑。 依照本發明，可利用反射照明光與透射照 別產生於圖案的表面的凹坑與突起，僅凹坑 良。 【實施方式】 使用第1圖至第10圖來說明本發明的實5 第1圖是表示本實施形態的發明的圖案檢 體構成的方塊圖。 在同圖中，1是聚醯亞胺（樹脂）等所成的 的光透射性的基板，2是形成於基板1上的銅 配線圖案等的圖案，3是檢查部，3 1是從形成 的圖案2的一側通過照明光的光束中心的中心 對於基板1的檢查領域成爲大約正交的反射! 一照明手段），3 1 1是半反射鏡，3 1 2是在與形 上的圖案2的一側相反側，將藉由基板1上的 段所照射的領域，對於基板1朝法線方向投影 射照明光的兩個透射照明手段（第二照明手段） 手段，34是透鏡，4是控制部，5是膠帶搬運 送出捲軸，52是捲取捲軸，53是時序記號部 領域。在此，檢查領域6是指照明光被照射， 手段3 3被攝影的領域。 手段，攝影 無圖案表面 明光，來區 檢測作爲不 I形態。 查裝置的整 TAB膠帶等 等所成爲的 有基板1上 光線照射成 療明手段（第 ;成有基板1 第一照明手 的領域外照 ，3 3是攝影 機構，51是 ，6是檢查 而藉由攝影 -9- 200842347 在時序記號部53，對於與判定爲不良的圖案2，以目 視就可確認其部分爲不良品般地施以沖孔的穿孔或塗色等 的標記。又，控制部4事先輸入有作爲圖案檢查的基準的 基準圖案，比較所攝影的圖案2與基準圖案，判定製品的 良否，而且控制檢查部3，時序記號部53，及膠帶搬運部 5的動作。又，基準圖案是攝影作爲判定爲良品的實際圖 案的畫像也可以，或利用CAD資料者也可以。 • 第2圖是表示於第1圖的檢查部3的擴大圖。 在同圖中，透射照明手段（第二照明手段）32的光源 321，是適當選擇透射TAB膠帶的樹脂薄脂所成的基板 1，而放射在圖案2所反射的波長者。來自反射照明手段 (第一照明手段）31的照明光，是從複數個LED所成的光 源3 1 1出射，藉由透鏡3 1 3被收歛，其光的中心光線照射 成對於基板1上的檢查領域6成爲正交或大約正交，又來 自透射照明手段（第二照明手段）32的照明光，是從複數個 ^ LED所成的光源3 2 1出射，而從基板1的背側對於檢查領 域6(亦即，藉由第一照明手段所照明的領域），照射成斜 斜地入射。 . 攝影手段33是使用在上述照明光的波長具有受光感 度的例如CCD線感測器或是區域感測器，設置於對於 TAB膠帶所成的基板1而與依反射照明手段（第一照明手 段）3 1的照明光相同的正上方方向，攝影來自基板1上的 圖案2的圖案像。又’在攝影手段3 3的光入射側，設有 將進行TAB膠帶所成的基板1的圖案像2的檢查的領域 -10- 200842347 予以擴大並投影的透鏡34，透鏡34是組合複數透鏡而被 收納於鏡筒。 反射照明手段（第一照明手段）31是必須將對於TAB 膠帶所成的基板1照射照明光的方向，與攝影手段3 3攝 影圖案像的方向作成一致。所以，使用半反射鏡3 1 2 ’將 令反射照明光照射TAB膠帶所成的基板1的光路’及從 圖案2所反射而入射於攝影手段33的光的光路成爲一 致。具體上，將來自反射照明手段（第一照明手段）3 1的光 在半反射鏡312折回90°，而從TAB膠帶所成的基板1的 正上方照射。藉由圖案2所反射的光是通過半反射鏡3 1 2 而入射於攝影手段3 3。 以下，使用第3圖來說明本發明的圖案檢查裝置的凹 坑檢測的原理。 第3(a)圖是表示具有稱爲形成於TAB膠帶所成的基 板1上的凹坑21的凹陷（穴）的圖案2的局部斷面圖，第 3(b)圖是表示具有形成於TAB膠帶所成的基板1上的突起 22的圖案2的局部斷面圖。又，在此些圖中，將對於基 板1的圖案2的大小表示極端地大。又，反射照明與透射 照明光是僅表示中心光線。 藉由反射照明手段（第一照明手段）31，將照明光對於 圖案2從正上方會照明光的中心光線對於基板1成爲正交 或大約正交般地照射，則若圖案2的表面爲平坦，照明光 是被反射，入射於設置於與依反射照明手段（第一照明手 段）3 1的照明光所照射的方向相同的方向的攝影手段3 3。 -11 - 200842347 被照射於圖案2以外的部分的照明光，透射基板 收在基板1，而未入射於攝影手段3 3。又，若在 表面有凹坑或突起2 2，則如上述地被照射於其 明光，是未入射在攝影手段3 3。 但是，在此從基板1的相反側，藉由透射 (第二照明手段）32，中心光線對於基板1照射從 射的透過照明光，則如第3 (b)圖所示地，存在於 突起22時，透射照明光反射於突起22的斜面而 影手段33，突起22的部分，是與表面爲平坦的 地明亮地被照出。一方面，如第3(a)圖所示地， 面者爲凹坑21時，透射照明光是直接通過而未 影手段3 3，而凹坑2 1的部分是仍爲黑暗。 亦即，依照本圖案檢查裝置，在圖案2上 22時，則在攝影手段3 3與表面平坦的狀態同樣 明亮的畫像，而在圖案2上具有凹坑21時，則 段3 3照出黑暗，僅可檢測凹坑2 1的存在。 以下，使用第1圖及第2圖來說明圖案檢查 查動作。 在TAB膠帶所成的基板1連續地製作相同 線圖案2，控制部4是驅動膠帶搬運部5 ’而將 所成的基板1搬運到檢查部3，當TAB膠帶所尽 上的成爲檢查對象的檢查圖案2藉由膠帶搬運部 到檢查部3的所定位置，則在其位置上’ TAB所 1是停止。控制部4是點亮反射照明手段（第 1或被吸 圖案2的 部分的照 照明手段 斜方向入 表面者爲 入射於攝 情形同樣 存在於表 入射在攝 具有突起 地被照出 在攝影手 裝置的檢 的複數配 TAB膠帶 3的基板1 5被搬運 成的基板 一照明手 -12- 200842347 段）3 1與透過照明手段（第二照明手段）3 2的各個光源 (LED)31 1，321，而對於進行檢查的檢查圖案2，從兩照 明手段3 1，3 2同時地照射照明光。控制部4是藉由攝影 手段3 3，攝影藉由兩照明手段31，3 2同時地照明的圖案 像。控制部4是記憶被攝影的畫像。如上述地僅在檢查圖 案2的表面存在凹坑21時，其部分是變暗。因此，與基 準圖案比較，若有黑暗部分，則其部分是產生凹坑21的 部分，其圖案是被判定爲不良品。在控制部4，記憶著有 凹坑21的不良的圖案2的位置，當該圖案2藉由膠帶搬 運部5搬運到時序記號部53時，進行穿孔或著色等的標 記。當結束檢查圖案2的檢查，藉由膠帶搬運機構5搬運 TAB膠帶所成的基板1，成爲下一檢查對象的檢查圖案2 被搬運到檢查部3的所定位置。 第4圖是表示實際攝影形成於TAB膠帶所成的基板1 的圖案的畫像的圖式。又，在同圖中，爲了容易瞭解圖案 2地，所有明暗被反轉，黑暗部分爲圖案2，而明亮部分 爲基板1。 第4(a)圖是表示本發明的圖案檢查裝置的情形，藉由 攝影手段3 3攝影同時地照射來自反射照明手段（第一照明 手段）31與透射照明手段（第二照明手段）32的照明光的圖 案2的圖案畫像，而第4(b)圖是表示習知技術的圖案檢查 裝置的情形，藉由攝影手段3 3攝影僅照射來自反射照明 手段的照明光的圖案2的圖案畫像。在此些圖的上列，是 在圖案2的表面有突起22的部分的圖案畫像，下列是在 -13- 200842347 圖案2的表面具有凹坑21的圖案畫像。反射照明光是本 發明的圖案檢查裝置或是習知技術的圖案檢查裝置，都是 對於圖案2從正上方令照明光的中心光線對於基板1的攝 影領域照射成正交或大約正交，而透射照明光是在本發明 圖案檢查裝置中，令中心光線對於基板1的攝影領域照射 成斜斜地入射。攝影手段3 3是設在與反射照明光所照射 的方向相同方向。如以第4(b)圖的〇記號所示地，僅在反 射照明光，凹坑21或突起22都是同樣地，對於圖案2的 黑色都以白色被檢測，可知無法區別凹坑2 1與突起22。 對於此，如以第4(a)圖的〇記號所示地。對於基板1同時 地照射反射照明光與透射照明光時，則僅凹坑2 1以白色 被檢測，區別凹坑21與突起22，而可知僅可檢測凹坑 21 ° 第5(a)，（b)圖是分別表示與圖示於第2圖的反射照 明手段（第一照明手段）31不相同的反射照明手段（第一照 明手段）31的構成。 第5(a)圖是作爲反射照明手段（第一照明手段）31的光 源311使用1個LED的情形，從LED所出射的光是在半 反射鏡3 1 2折回90°，其光束的中心光線是對於基板1上 的檢查領域6構成大約垂直地入射。又，第5(b)圖是作爲 反射照明手段（第一照明手段）31的光源使用鹵素燈314, 以反射鏡3 1 5聚光從鹵素燈3 1 4所出射的光而從導光光纖 317的光入射端316入射，導光在導光光纖317內，構成 從光出射端3 1 8出射者。從光出射端3 1 8所出射的光，是 -14- 200842347 在半反射鏡312折回90°，其光束的中心光線是對於基板 1上的檢查領域6構成大約垂直地入射。 第6圖是表示用以說明對於依本發明的圖案檢查裝置 的透射照明手段（第二照明手段）32的照明光對於基板1上 的檢查領域6的入射角度的適當範圍的圖式。 在同圖中，若將透射照明光僅作爲入射於檢查領域6 的入射角度爲20°以下的光，則在圖案2表面的突起22不 會碰到透射照明光，而可知會檢測突起22。又，通過基 板1的部分的透過照明光成爲入射至攝影手段33，在圖 案2表面被反射而與入射於攝影手段3 3的反射照明光的 對比變差，使得圖案2的線寬測定變困難。又，若透'過照 明光僅作爲入射於檢查領域6的入射角度爲70°以上的 光，則被照射至突起22而被反射的光成爲不會入射至攝 影手段33，與入射角度爲20°以下時同樣地被檢測出突起 22。又，圖案2的輪廓會模糊。此可能爲在圖案2側壁被 反射而增加入射於攝影手段3 3的光的成分。因此，爲了 僅檢測凹坑21透射照明光是在20°〜70°的入射角度範圍 內可適用入射於基板1的檢查領域的光。 但是，即使在透過照明光包括20°〜70°的入射角度範 圍的光，若入射角度爲包括20°以下的光，則如上述地， 通過基板1部分的透射照明光入射至照明手段之故，因而 在圖案2部分反射而與反射照明光的對比變差，又若入射 角度爲包括7 0 °以上的光，則如上述地，圖案2的輪廓線 會模糊之故，因而成爲很難測定圖案2的線寬。 -15- 200842347 第7(a)圖是表示與圖示於第2圖的透射照明手段（第 二照明手段）32不相同的透射照明手段（第二照明手段）32 的構成的側視斷面圖，第7(b)圖是表示從圖示於第7(a)圖 的透射照明手段（第二照明手段）32的基板1側觀看的俯視 如此些圖式所示地，該透射照明手段3 2是在形成有 光出射口 325的圓形箱體322中，具備出射照明光的配列 複數LED所成的光源321，在箱體322的光出射口 325, 設有圓形及圓環狀的遮光板3 23，而在遮光板3 23的基板 1側設有圓形聚光透鏡324，在聚光透鏡324的聚光點配 置有基板1，從箱體3 22的光源（LED)321所出射的光，是 藉由遮光板323未被遮光的部分的光藉由聚光透鏡324被 聚光，從與形成有基板1的圖案2的一側相反側對於檢查 領域6(亦即，依第一照明手段的照射光所照射的領域）斜 斜地被照射。在此，遮光板3 23的寬度（箱體322的徑向 長度），是從出射口 225所出射的照明光，被調整成對於 檢查領域6，在20°〜70°的角度範圍內入射。 第8 (a)圖是表示與圖示於第2圖及第7圖的透射照明 手段（第二照明手段）32不相同的其他透射照明手段（第二 照明手段）32的構成的俯視圖，第8(b)圖是表示圖示於第 8(a)圖的透射照明手段（第二照明手段）32的側視圖，第 8(c)圖是表示圖示於第8(a)圖的透射照明手段（第二照明手 段）3 2的前視圖。 如此些圖式所示地，該透射照明手段（第二照明手 -16- 200842347 段）32是在長方形箱體322中，具備出射照明光的配列複 數LED所成的光源321。 第9圖是表示使用圖示於第8圖的透射照明手段（第 二照明手段）3 2進行照明形成於基板1的圖案2的構成的 圖式。 在同圖中，從第8圖的透射照明手段（第二照明手 段）3 2所出射的照明光的光束的中心光線，是配置成對於 基板1的檢查領域6(藉由第一照明手段所照明的領域）以 外的某一位置大約垂直地入射。配置成這樣地，令照明光 的利用效率變差，惟對於檢查領域6令照明光從斜方向入 射之故，因而可得到與在先前第2圖或第7圖所述的透射 照明手段（第二照明手段）3 2的情形同樣的效果。亦即，來 自透射照明手段（第二照明手段）32的照明光，是將基板1 上的檢查領域6(藉由第一照明手段所照明的領域）對於基 板1從朝法線方向投影的領域外照射，而對於檢查領域6 令照明光從斜方向入射，而強光不會從法線方向入射乃極 爲重要。又，該透射照明手段（第二照明手段）3 2，是表示 於第8圖的長方形的透射照明手段（第二照明手段）32的長 邊對應於基板1的寬度方向（對於基板1被搬運的方向正 交的方向）。 第10圖是表示圖示於第2圖，第7圖及第8圖的透 射照明手段（第二照明手段）32不相同的其他透射照明手段 (第二照明手段）32的構成的圖式。 該透射照明手段（第二照明手段）32是將鹵素燈326利 -17- 200842347 用作爲光源者，從鹵素燈3 2 6所放射的光是在反射鏡3 2 7 被聚光而從光入射端328入射至導光光纖329，被入射的 光是在被分歧成2方向的導光光纖3 29內被導光。從設於 所分歧的導光光纖329的各出射側的複數的導光光纖成束 成長方形的光出射部3 3 0對於基板1上的檢查領域6令照 明光從斜方向入射。該情形，兩個光出射部3 3 0，是將基 板1上的檢查領域6(藉由第一照明手段所照明的領域）對 於基板1朝法線方向所投影的領域外，對於檢查領域6配 置成入射照明光。 【圖式簡單說明】 第1圖是表示本發明的圖案檢查裝置的構成的方塊 圖。 第2圖是表示圖示於第1圖的檢查部3的擴大圖。 第3(a)圖及第3(b)圖是表示具有形成於TAB膠帶所 成的基板1上的凹坑21與突起22的圖案2的局部斷面 圖。 第4(a)圖及第4(b)圖是表示實際地攝影形成於TAB 膠帶所成的基板1的圖案2的畫像的圖式。 第5(a)圖及第5(b)圖是表示與圖示於第2圖的反射照 明手段（第一照明手段）3 1不相同的反射照明手段（第一照 明手段）31的構成的圖式。 第6圖是表示用以說明依透射照明手段（第二照明手 段）32的照明光對於基板1上的檢查領域6的入射角度的 -18 - 200842347 適當範圍的圖式。 第7圖是表示與圖另於第2圖的透射照明手段（第二 照明手段）32不相同的透射照明手段（第二照明手段）32的 構成的側面斷面圖及俯視圖。 第8(a)圖至第8(c)圖是表示與圖示於第2圖及第7圖 的透射照明手段（第二照明手段）32不相同的其他透射照明 手段（第二照明手段）32的構成的俯視圖、側視圖、及前視 圖。 第9圖是表示使用圖示於第8圖的透射照明手段（第 二照明手段）32照明形成於基板1的圖案2的構成的圖 式。 第10圖是表示與圖示於第2圖、第7圖及第8圖的 透射照明手段（第二照明手段）32的其他透射照明手段（第 二照明手段）32的構成的圖式。 第1 1(a)圖及第1 1(b)圖是表示具有稱爲形成於基板 101上的凹坑103的凹陷（穴）或突起1〇4的配線圖案102 的局部斷面圖。 【主要元件符號說明】 1 : TAB膠帶的基板 2 :配線圖案等的圖案 21 :凹坑 22 :突起 3 :檢查部 -19- 200842347 3 1 :反射照明手段（第一照明手段） 3 1 1 :光源 3 1 2 :半反射鏡 3 13 :透鏡 3 1 4 :鹵素燈 3 1 5 :反射鏡 3 1 6 :光人射端 • 3 1 7 :導光光纖 3 1 8 :光出射端 32 :透射照明手段（第二照明手段） 3 2 1 :光源 322 :箱體 3 23 :遮光板 324 ：聚光透鏡 3 2 5 :光出射口 • 3 2 6 :鹵素燈 327 :反射鏡 3 2 8 :光入射端 - 329 :導光光纖 3 3 0 :光出射部 3 3 :攝影手段 3 4 :透鏡 4 :控制部 5 :膠帶搬運機構 -20- 200842347200842347 The illumination direction of the illumination means is photographed in the same direction. The pattern of the substrate is detected based on the image being photographed. According to the present invention, the pits and projections which are generated on the surface of the pattern by the reflected illumination light and the transmission are used, and only the pits are good. [Embodiment] The present invention will be described with reference to Figs. 1 to 10, and Fig. 1 is a block diagram showing the configuration of a pattern sample of the invention of the present embodiment. In the same figure, 1 is a light-transmissive substrate made of polyimine (resin) or the like, 2 is a pattern of a copper wiring pattern formed on the substrate 1, and 3 is an inspection portion, and 31 is formed. One side of the pattern 2 passes through the center of the beam center of the illumination light to become approximately orthogonal reflections for the inspection field of the substrate 1! One illumination means), 3 1 1 is a half mirror, and 3 1 2 is a pattern on the shape On the opposite side of one side of the second, two transmission illumination means (second illumination means) for projecting the illumination light toward the normal direction of the substrate 1 by the field irradiated by the segments on the substrate 1, 34 is a lens, 4 It is a control unit, 5 is a tape conveyance take-up reel, 52 is a take-up reel, and 53 is a field of a timing mark part. Here, the inspection field 6 refers to a field in which illumination light is irradiated and the means 3 3 is photographed. Means, photography No pattern surface Bright light, coming area Detection as a non-I form. Check the whole TAB tape of the device, etc., and the light on the substrate 1 is irradiated into a therapeutic means (the first; the first illumination hand of the substrate 1 is externally photographed, 3 3 is a photographing mechanism, 51 is, 6 is an inspection By the photographing of the pattern 2 which is determined to be defective, it is possible to visually confirm that the portion of the pattern 2 which is determined to be defective is a punched hole or a coloring mark such as a punch. The part 4 inputs a reference pattern as a reference for pattern inspection in advance, compares the photographed pattern 2 with the reference pattern, determines the quality of the product, and controls the operation of the inspection unit 3, the timing symbol unit 53, and the tape conveying unit 5. The reference pattern may be an image obtained by photographing the actual pattern determined as a good product, or may be a CAD material. • Fig. 2 is an enlarged view of the inspection unit 3 shown in Fig. 1. In the same figure, the transmission illumination means The light source 321 of the (second illumination means) 32 is a substrate 1 formed by appropriately selecting a resin thin resin that transmits a TAB tape, and is radiated at a wavelength reflected by the pattern 2. From the reflective illumination means (first illumination means The illumination light of 31 is emitted from a light source 31 1 formed by a plurality of LEDs, and the lens 3 13 is converged, and the central light of the light is irradiated to be orthogonal or approximately orthogonal to the inspection field 6 on the substrate 1. The illumination light from the transmissive illumination means (second illumination means) 32 is emitted from a plurality of light sources 3 2 1 formed by the LEDs, and from the back side of the substrate 1 to the inspection field 6 (i.e., by the In the field illuminated by an illumination means, the illumination is incident obliquely. The photographing means 33 is, for example, a CCD line sensor or an area sensor having a light receiving sensitivity at the wavelength of the illumination light, and is disposed on the TAB tape. The formed substrate 1 is photographed in the direction directly above the illumination light by the reflection illumination means (first illumination means) 31, and the pattern image from the pattern 2 on the substrate 1 is imaged. On the side, there is a field in which the pattern 2 of the substrate 1 formed by the TAB tape is inspected. -10- 200842347 A lens 34 that is enlarged and projected, and the lens 34 is combined with a plurality of lenses and housed in the lens barrel. First lighting means) 31 is that the direction in which the illumination light is applied to the substrate 1 formed by the TAB tape must be aligned with the direction in which the image pattern 3 3 is photographed. Therefore, the half mirror 3 1 2 ' is used to illuminate the TAB tape with the reflected illumination light. The optical path ' of the substrate 1 and the optical path of the light reflected from the pattern 2 and incident on the imaging means 33 are aligned. Specifically, the light from the reflection illumination means (first illumination means) 31 is folded back at the half mirror 312. °, and is irradiated directly from the substrate 1 formed by the TAB tape. The light reflected by the pattern 2 is incident on the photographing means 33 through the half mirror 3 1 2 . Hereinafter, the present invention will be described using FIG. The principle of the pit inspection of the pattern inspection device. Fig. 3(a) is a partial cross-sectional view showing a pattern 2 having depressions (holes) called pits 21 formed on a substrate 1 formed of a TAB tape, and Fig. 3(b) is a view showing A partial cross-sectional view of the pattern 2 of the protrusions 22 on the substrate 1 formed by the TAB tape. Further, in these figures, the size of the pattern 2 for the substrate 1 is shown to be extremely large. Also, the reflected illumination and the transmitted illumination light represent only the central ray. By reflecting the illumination means (first illumination means) 31, the illumination light is irradiated to the substrate 1 from the center light of the illumination light from the upper side to the substrate 1 in an orthogonal or approximately orthogonal manner, and if the surface of the pattern 2 is flat The illumination light is reflected and incident on the imaging means 33 provided in the same direction as the direction in which the illumination light by the reflection illumination means (first illumination means) 31 is irradiated. -11 - 200842347 The illumination light that is irradiated on the portion other than the pattern 2 is placed on the substrate 1 without being incident on the imaging means 33. Further, if there are pits or protrusions 2 2 on the surface, the light is irradiated onto the surface as described above, and is not incident on the imaging means 33. However, from the opposite side of the substrate 1, by the transmission (second illumination means) 32, the center ray is irradiated with the transmitted illumination light from the substrate 1, and as shown in the third (b), the protrusion is present. At 22 o'clock, the transmitted illumination light is reflected on the slope of the projection 22 and the shadow means 33, and the portion of the projection 22 is brightly illuminated with the surface flat. On the other hand, as shown in Fig. 3(a), when the face is the pit 21, the transmitted illumination light passes directly through the unshaded means 3 3, and the portion of the pit 2 1 is still dark. That is, according to the pattern inspection device, when the pattern 2 is 22, the image capturing means 3 is as bright as the image in the flat state, and when the pattern 2 has the pit 21, the segment 3 3 is dark. Only the presence of the pit 2 1 can be detected. Hereinafter, the pattern inspection operation will be described using Figs. 1 and 2 . The same line pattern 2 is continuously produced on the substrate 1 formed by the TAB tape, and the control unit 4 drives the tape conveyance unit 5' to convey the formed substrate 1 to the inspection unit 3, and the inspection object is placed on the TAB tape. When the inspection pattern 2 is at a predetermined position of the inspection portion 3 by the tape conveyance portion, the TAB 1 is stopped at its position. The control unit 4 is a lighting and reflecting illumination means (the illumination means for the first or the smoked pattern 2 is incident on the surface in the oblique direction, and the incident surface is incident on the surface. The plurality of inspections are carried out with the substrate 1 5 of the TAB tape 3 being conveyed into a substrate-illumination hand -12-200842347) 3 1 and each light source (LED) 31 1321 through the illumination means (second illumination means) 3 2 For the inspection pattern 2 to be inspected, the illumination light is simultaneously irradiated from the two illumination means 3 1, 3 2 . The control unit 4 is a pattern image which is simultaneously illuminated by the two illumination means 31, 32 by the photographing means 33. The control unit 4 is an image that memorizes the photograph. As described above, only when the pit 21 is present on the surface of the inspection pattern 2, the portion thereof is darkened. Therefore, compared with the reference pattern, if there is a dark portion, the portion is the portion where the pit 21 is formed, and the pattern is judged to be defective. In the control unit 4, the position of the defective pattern 2 of the pit 21 is memorized, and when the pattern 2 is transported to the timing mark portion 53 by the tape transport unit 5, a mark such as perforation or coloring is performed. When the inspection of the inspection pattern 2 is completed, the substrate 1 formed by the TAB tape is conveyed by the tape conveyance mechanism 5, and the inspection pattern 2 to be the next inspection target is conveyed to a predetermined position of the inspection unit 3. Fig. 4 is a view showing an image in which the pattern of the substrate 1 formed by the TAB tape is actually imaged. Further, in the same figure, in order to easily understand the pattern 2, all the light and dark are reversed, the dark portion is the pattern 2, and the bright portion is the substrate 1. Fig. 4(a) is a view showing the state of the pattern inspecting apparatus of the present invention, which is irradiated by the photographing means 33 simultaneously with the reflection illumination means (first illumination means) 31 and the transmissive illumination means (second illumination means) 32. The pattern image of the pattern 2 of the illumination light, and Fig. 4(b) shows the pattern inspection apparatus of the prior art, and the pattern image of the pattern 2 of only the illumination light from the reflection illumination means is imaged by the imaging means 33. . The upper row of these figures is a pattern image of a portion having a projection 22 on the surface of the pattern 2. The following is a pattern image having a pit 21 on the surface of the pattern 2 at -13-200842347. The reflected illumination light is a pattern inspection device of the present invention or a pattern inspection device of the prior art, in which the central light of the illumination light is irradiated orthogonally or approximately orthogonal to the image field of the substrate 1 from the upper side of the pattern 2, and In the pattern inspection device of the present invention, the transmitted illumination light causes the center light to be incident obliquely to the image field of the substrate 1. The photographing means 3 3 is provided in the same direction as the direction in which the reflected illumination light is irradiated. As shown by the 〇 mark in Fig. 4(b), only the reflected illumination light, the pit 21 or the protrusion 22 are the same, and the black of the pattern 2 is detected in white, and it is understood that the pit 2 1 cannot be distinguished. With the protrusions 22. For this, it is as shown by the 〇 mark in the figure 4(a). When the substrate 1 is simultaneously irradiated with the reflected illumination light and the transmitted illumination light, only the pit 2 1 is detected in white, and the pit 21 and the protrusion 22 are distinguished, and it is understood that only the pit 21 ° 5(a) can be detected, ( b) The figure shows the configuration of the reflective illumination means (first illumination means) 31 which are different from the reflection illumination means (first illumination means) 31 shown in Fig. 2, respectively. Fig. 5(a) shows a case where one LED is used as the light source 311 as the reflection illumination means (first illumination means) 31, and the light emitted from the LED is folded back by 90° at the half mirror 3 1 2 at the center of the light beam. The light is incident approximately perpendicularly to the inspection field 6 on the substrate 1. Further, in the fifth (b), the halogen lamp 314 is used as the light source of the reflective illumination means (first illumination means) 31, and the light emitted from the halogen lamp 3 1 4 is collected by the mirror 3 15 to be guided from the light guiding fiber. The light incident end 316 of 317 is incident, and the light is guided in the light guiding fiber 317 to form a light emitting end from the light emitting end 3 1 8 . The light emitted from the light exit end 3 1 8 is -14- 200842347 folded back 90° at the half mirror 312, and the center ray of the light beam is incident approximately perpendicularly to the inspection field 6 on the substrate 1. Fig. 6 is a view for explaining an appropriate range of the incident angle of the illumination light of the transmission illumination means (second illumination means) 32 of the pattern inspection apparatus according to the present invention with respect to the inspection area 6 on the substrate 1. In the same figure, when the transmitted illumination light is only light having an incident angle of 20 or less incident on the inspection region 6, the projections 22 on the surface of the pattern 2 do not hit the transmitted illumination light, and it is understood that the projections 22 are detected. Further, the transmitted illumination light passing through the portion of the substrate 1 is incident on the imaging means 33, and is reflected on the surface of the pattern 2 to deteriorate the contrast with the reflected illumination light incident on the imaging means 33, making it difficult to measure the line width of the pattern 2. . In addition, when the passing illumination light is only light having an incident angle of 70° or more incident on the inspection region 6, the light that is irradiated onto the projections 22 and reflected is not incident on the imaging means 33, and the incident angle is 20 When the angle is below °, the protrusion 22 is detected in the same manner. Also, the outline of the pattern 2 is blurred. This may be a component that is reflected on the side wall of the pattern 2 to increase the light incident on the photographing means 33. Therefore, in order to detect only that the illuminating light is transmitted through the pit 21, light incident on the inspection area of the substrate 1 can be applied in the range of the incident angle of 20 to 70. However, even if the transmitted light includes light having an incident angle range of 20° to 70°, and if the incident angle is light including 20° or less, as described above, the transmitted illumination light passing through the portion of the substrate 1 is incident on the illumination means. Therefore, the pattern 2 is partially reflected and the contrast with the reflected illumination light is deteriorated, and if the incident angle is light including 70° or more, the outline of the pattern 2 is blurred as described above, and thus it becomes difficult to measure. Line width of pattern 2. -15- 200842347 Fig. 7(a) is a side sectional view showing a configuration of a transmissive illumination means (second illumination means) 32 which is different from the transillumination means (second illumination means) 32 shown in Fig. 2; FIG. 7(b) is a plan view showing the transmission illumination means as viewed from the side of the substrate 1 of the transmission illumination means (second illumination means) 32 shown in FIG. 7(a). 3 2 is a light source 321 formed by a plurality of LEDs that emit illumination light in a circular housing 322 having a light exit opening 325, and a circular and annular shape is provided in the light exit opening 325 of the housing 322. The visor 3 23 is provided with a circular condensing lens 324 on the substrate 1 side of the visor 33, and the substrate 1 is disposed at the condensing point of the condensing lens 324, and the light source (LED) 321 from the housing 3 22 The light emitted is a portion of the light that is not shielded by the light shielding plate 323 by the condensing lens 324, and is opposite to the inspection field 6 from the side opposite to the side on which the pattern 2 of the substrate 1 is formed (that is, The area illuminated by the illumination light by the first illumination means is obliquely illuminated. Here, the width of the light shielding plate 323 (the radial length of the casing 322) is the illumination light emitted from the exit port 225, and is adjusted so as to be incident in the angle range of 20 to 70 with respect to the inspection field 6. Fig. 8(a) is a plan view showing a configuration of another transmissive illumination means (second illumination means) 32 which is different from the transillumination means (second illumination means) 32 shown in Figs. 2 and 7; 8(b) is a side view showing the transmission illumination means (second illumination means) 32 shown in Fig. 8(a), and Fig. 8(c) is a view showing the transmission shown in Fig. 8(a). Front view of the illumination means (second illumination means) 3 2 . As shown in these figures, the transmission illumination means (second illumination hand -16 - 200842347 segment) 32 is a light source 321 formed by a plurality of LEDs that emit illumination light in the rectangular casing 322. Fig. 9 is a view showing a configuration in which the pattern 2 formed on the substrate 1 is illuminated by the transmission illumination means (second illumination means) 32 shown in Fig. 8. In the same figure, the center ray of the light beam of the illumination light emitted from the transmission illumination means (second illumination means) 32 of Fig. 8 is arranged in the inspection field 6 for the substrate 1 (by the first illumination means A position other than the field of illumination is incident approximately perpendicularly. In this way, the utilization efficiency of the illumination light is deteriorated, but for the inspection field 6, the illumination light is incident from the oblique direction, so that the transmission illumination means described in the previous FIG. 2 or FIG. 7 can be obtained. The second lighting method) 3 2 the same effect. That is, the illumination light from the transmissive illumination means (second illumination means) 32 is a field in which the inspection area 6 (the area illuminated by the first illumination means) on the substrate 1 is projected from the normal direction to the substrate 1. External illumination, while for the inspection field 6 the illumination light is incident obliquely, and it is extremely important that the strong light does not enter from the normal direction. Further, the transmission illumination means (second illumination means) 32 is such that the long side of the rectangular transmission illumination means (second illumination means) 32 shown in Fig. 8 corresponds to the width direction of the substrate 1 (for the substrate 1 is carried The direction of the direction is orthogonal). Fig. 10 is a view showing the configuration of another transmission illumination means (second illumination means) 32 which is different from the transmission illumination means (second illumination means) 32 shown in Fig. 2, Fig. 7 and Fig. 8. The transmissive illumination means (second illumination means) 32 is a light source 326-200842347 used as a light source, and the light emitted from the halogen lamp 3 26 is collected by the mirror 3 27 and incident from the light. The end 328 is incident on the light guiding fiber 329, and the incident light is guided in the light guiding fiber 3 29 which is branched in two directions. A plurality of light guiding fibers provided on the respective exit sides of the divergent light guiding fibers 329 are bundled into a rectangular light emitting portion 390. The inspection field 6 on the substrate 1 causes the illumination light to enter from the oblique direction. In this case, the two light exiting portions 303 are outside the field in which the inspection field 6 on the substrate 1 (the area illuminated by the first illumination means) is projected toward the substrate 1 in the normal direction, for the inspection field 6 Configured to be incident illumination. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a block diagram showing the configuration of a pattern inspecting apparatus of the present invention. Fig. 2 is an enlarged view showing the inspection unit 3 shown in Fig. 1. Figs. 3(a) and 3(b) are partial cross-sectional views showing the pattern 2 having the pits 21 and the projections 22 formed on the substrate 1 formed of the TAB tape. The fourth (a) and fourth (b) drawings are diagrams showing an image in which the pattern 2 of the substrate 1 formed by the TAB tape is actually imaged. 5(a) and 5(b) are views showing a configuration of a reflection illumination means (first illumination means) 31 which is different from the reflection illumination means (first illumination means) 31 shown in Fig. 2; figure. Fig. 6 is a view showing an appropriate range of -18 - 200842347 for explaining the incident angle of the illumination light by the transmission illumination means (second illumination means) 32 with respect to the inspection area 6 on the substrate 1. Fig. 7 is a side cross-sectional view and a plan view showing a configuration of a transmission illumination means (second illumination means) 32 which is different from the transmission illumination means (second illumination means) 32 of Fig. 2; 8(a) to 8(c) are diagrams showing other transmissive illumination means (second illumination means) different from the transillumination means (second illumination means) 32 shown in Figs. 2 and 7; Top view, side view, and front view of the configuration of 32. Fig. 9 is a view showing a configuration in which the pattern 2 formed on the substrate 1 is illuminated by the transmission illumination means (second illumination means) 32 shown in Fig. 8. Fig. 10 is a view showing the configuration of another transmission illumination means (second illumination means) 32 of the transmission illumination means (second illumination means) 32 shown in Figs. 2, 7 and 8. Figs. 1(a) and 11(b) are partial cross-sectional views showing a wiring pattern 102 having depressions (holes) or protrusions 1〇4 called pits 103 formed on the substrate 101. [Description of main component symbols] 1 : Substrate 2 of TAB tape: Pattern 21 of wiring pattern, etc.: Pit 22: Protrusion 3: Inspection section -19- 200842347 3 1 : Reflective illumination means (first illumination means) 3 1 1 : Light source 3 1 2 : Half mirror 3 13 : Lens 3 1 4 : Halogen lamp 3 1 5 : Mirror 3 1 6 : Light beam end • 3 1 7 : Light guiding fiber 3 1 8 : Light exit end 32 : Transmission Illumination means (second illumination means) 3 2 1 : Light source 322 : Case 3 23 : Light shield 324 : Condenser lens 3 2 5 : Light exit port • 3 2 6 : Halogen lamp 327 : Mirror 3 2 8 : Light Incident end - 329 : Light guiding optical fiber 3 3 0 : Light exiting part 3 3 : Photographing means 3 4 : Lens 4 : Control part 5 : Tape carrying mechanism -20 - 200842347
51 :送出捲軸 52 :捲取捲軸 5 3 :時序記號部 - 2151 : Feeding reel 52 : Reeling reel 5 3 : Timing mark section - 21