JP5559644B2 - Inspection device - Google Patents

Description

  The present invention relates to an inspection apparatus for inspecting a semiconductor element as an inspection object.

  An inspection apparatus that inspects a semiconductor element such as an LED chip as an inspection object by irradiating the semiconductor element with an observation optical system while irradiating various illumination lights (for example, patents) is known. Reference 1). In this inspection apparatus, transmitted illumination from a transmission illumination mechanism that illuminates the inspection object from the side opposite to the observation optical system when viewed from the inspection object is used as one of various illumination lights.

  Here, it is often seen that the semiconductor element is cut out from the wafer while being stuck to a tape (film) and is handled in a state where the tape is held by the annular member. For this reason, in the inspection apparatus mentioned above, using the light which permeate | transmits a tape as transmission illumination, irradiating various illumination light with respect to the test target object in the state affixed on the tape hold | maintained at the annular member Inspect the inspection object.

JP 2010-107254 A

  However, with the tape, when the transmitted illumination is observed with the observation optical system, even if no member is attached, the tape is not uniformly bright but is partially linear or dotted. There are dark spots. This is considered to be caused by dust or the like adhering to the tape or spots of adhesive. For this reason, when the inspection object is transparent, it is difficult to discriminate between the information (contour line, etc.) of the inspection object obtained by transmitted illumination and the dark part on the tape in the observation by the observation optical system. A dark spot may act as a noise component, leading to a decrease in inspection accuracy of the inspection object.

  The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an inspection apparatus capable of obtaining accurate information by transmission illumination even for a transparent inspection object attached to a tape. It is to provide.

The invention according to claim 1 is an observation optical system having a predetermined position on the observation optical axis as an observation surface, a reflection illumination mechanism for illuminating the observation surface from the observation optical system side, and the observation optical system. A transmission illumination mechanism that illuminates the observation surface from the opposite side, and a cylindrical holding stage that can hold a tape to which an inspection object is attached from the transmission illumination mechanism side, The transmission illumination mechanism has an emission part that emits the transmitted light guided from the light source, and a scattering part that scatters the transmission light emitted by the emission part, and the scattering part is transmitted through the observation surface. In order to make the light into a predetermined scattering state , the transmission illumination mechanism is provided at a predetermined interval from the observation surface when viewed in the direction of the transmission optical axis of the transmission illumination mechanism. And the view is between the scattering portion and the observation surface. A transmissive member provided with a flat surface defining a plane along the surface, and the scattering portion is configured such that a facing surface facing the emitting portion in the transmissive member is a scattering surface, and the transmissive member is The plate is extended to fill the inside of the holding stage by being held by the holding stage, and the emitting part transmits transmitted light to the scattering part of the transmitting member in a predetermined spot region. in order to be incident, characterized Rukoto to have a collection optics to reduce the diffusion of the transmitted light emitted.

The invention described in claim 2 is the inspection apparatus according to claim 1, wherein the predetermined scattering state, the tape which the inspection object is stuck is located on the observation plane, the transmitted illumination When the tape on the observation surface irradiated with transmitted light from the mechanism is observed with the observation optical system, the tape is uniformly brightened.

A third aspect of the present invention is the inspection apparatus according to the first or second aspect , wherein the condensing optical member also has a function of uniformizing a light amount distribution viewed in a cross section perpendicular to the transmitted optical axis. It is a rod integrator optical member having.

  According to the inspection apparatus of the present invention, the noise component in the tape irradiated with the transmitted light from the transmission illumination mechanism can be removed in the observation optical system observation due to the scattering effect by the scattering unit. Can be used to accurately obtain information on the inspection object attached to the tape.

  In the inspection apparatus, since the scattering portion is provided at a predetermined interval from the observation surface when viewed in the direction of the transmission optical axis, a scattering effect can be obtained with certainty. In observation, the noise component in the tape irradiated with the transmitted light from the transmitted illumination mechanism can be reliably removed.

  In addition to the above-described configuration, the predetermined scattering state is such that the tape on which the inspection object is attached is positioned on the observation surface, and the tape on the observation surface irradiated with the transmitted light from the transmission illumination mechanism When the above-mentioned observation optical system is used to make the tape uniformly bright, the scattering effect can be obtained more reliably, and the noise in the tape irradiated with the transmitted light from the transmission illumination mechanism can be obtained. The component can be removed more reliably.

  In addition to the configuration described above, the transmission illumination mechanism is provided with a flat surface that allows transmission of transmitted light from the emission unit and that defines a plane along the observation surface between the scattering unit and the observation surface. If the transmission member is provided, the inspection object can be flattened while being positioned on the observation surface on the flat surface of the transmission member, so that the inspection object is appropriately observed by the observation optical system. be able to.

  In addition to the above-described configuration, the scattering unit has a simple configuration and is suitable for an observation optical system, assuming that the opposing surface of the transmission member facing the emission unit is a scattering surface. It is possible to easily and surely set the position of the scattering portion viewed in the direction of the transmitted light axis relative to the observation surface that is the observation point, that is, the interval between the observation surface viewed in the direction of the transmitted optical axis and the scattered portion.

  In addition to the above-described configuration, the apparatus further includes a cylindrical holding stage capable of holding the tape to which the inspection object is attached from the transmission illumination mechanism side, and the transmission member is held by the holding stage. In this way, the transmission part has a plate shape extending so as to fill the inside of the holding stage, and the emission part emits the transmitted light so that the transmitted light is incident on the scattering part of the transmission member in a predetermined spot region. If it has a condensing optical member that reduces the diffusion of light, it is possible to irradiate an appropriate area for the observation optical system on the observation surface, so that appropriate observation by the observation optical system can be performed more efficiently. Can do.

  In addition to the above-described configuration, if the condensing optical member is a rod integrator optical member that also has a function of uniformizing the light amount distribution seen in a cross section orthogonal to the transmission optical axis, it is more appropriate to use an observation optical system. Observation can be possible.

  In addition to the above-described configuration, when the transmission illumination mechanism has a cylindrical holding portion that holds the emission portion and the transmission member inward and holds them inward, the transmission illumination mechanism uses transmission illumination with a simpler configuration. Thus, it is possible to accurately obtain the information of the inspection object stuck on the tape.

  In addition to the above-described configuration, when the emission unit includes an integrator optical member that uniformizes the light amount distribution seen in a cross section orthogonal to the transmission optical axis, an appropriate region for the observation optical system on the observation surface is irradiated. Therefore, appropriate observation by the observation optical system can be enabled more efficiently.

It is explanatory drawing which shows typically the structure of the inspection apparatus 10 of Example 1 which concerns on this invention. 2 is a block diagram showing a functional configuration of the inspection apparatus 10. FIG. 2 is a perspective view schematically showing a holding stage 34 of the inspection apparatus 10. FIG. It is explanatory drawing for demonstrating the kind of test | inspection workpiece | work 40, (a) shows the state cut | disconnected at each boundary surface, with each semiconductor element 44 affixed on the tape 42, (b) shows the tape 42. Is stretched and each semiconductor element 44 is divided into individual pieces. 2 is a perspective view schematically showing a holding mechanism 13 and a transmission illumination mechanism 14 of the inspection apparatus 10. FIG. It is explanatory drawing which shows the location which follows the II line | wire shown in FIG. 5 with a partial cross section. It is explanatory drawing which shows each semiconductor element 44 of an example as a test subject. FIG. 8 is an explanatory diagram for describing an example of a defect in each semiconductor element 44 illustrated in FIG. 7. It is explanatory drawing for demonstrating that the shadow part by the some fine shape M in the tape 42 arises in the image data from the imaging camera 24 obtained by acquiring on the observation surface Fp through an observation optical system. It is explanatory drawing for demonstrating that each defective semiconductor element 44 is judged to be two normal semiconductor elements 44 due to the fine shape M. For explaining a state in which a shadow portion due to a plurality of fine shapes M on the tape 42 is prevented from being generated in the image data from the imaging camera 24 obtained by acquiring the observation surface Fp through the observation optical system. It is explanatory drawing. It is explanatory drawing which shows typically the structure of 10 A of test | inspection apparatuses of Example 2. FIG. It is explanatory drawing which shows typically the structure of the holding mechanism 13B of the test | inspection apparatus 10B of Example 3. FIG. It is explanatory drawing which shows typically the structure of the holding | maintenance mechanism 13C of the inspection apparatus 10C of Example 4, and the transmitted illumination mechanism 14C.

  Embodiments of an inspection apparatus according to the present invention will be described below with reference to the drawings.

  First, a schematic configuration of the inspection apparatus 10 according to the first embodiment of the present invention will be described. FIG. 1 is an explanatory view schematically showing a configuration of an inspection apparatus 10 as an example of an inspection apparatus according to the present invention. FIG. 2 is a block diagram illustrating a functional configuration of the inspection apparatus 10. In FIG. 5, the wafer 41 and the tape 42 in the inspection target workpiece 40 are omitted for easy understanding.

  As shown in FIGS. 1 and 2, the inspection apparatus 10 is generally configured by an observation mechanism 11, a reflection illumination mechanism 12, a holding mechanism 13, a transmission illumination mechanism 14, and a control mechanism 15. As shown in FIG. 1, the inspection apparatus 10 has a main body 21. Although not shown, the main body 21 is provided with a relay lens and a revolver turret, and the turret is provided with a plurality of objective lens barrels 22. Each objective lens barrel 22 is provided with an objective lens 23. An imaging camera 24 is attached to the upper part of the main body 21. The imaging camera 24 passes through the objective lens 23 and the main body portion 21 (relay lens) according to the magnification determined by the set objective lens 23, and image data at a predetermined position on the optical axis (observation optical axis Oa). Can be obtained. For this reason, the imaging camera 24, the main body 21, the objective lens barrel 22, and the objective lens 23 function as an observation optical system in the observation mechanism 11, and the optical axis thereof becomes the observation optical axis Oa. In addition, a plane (object-side imaging plane) that includes the position where the imaging camera 24 can acquire an appropriate image on the observation optical axis Oa, that is, the focal position in the observation optical system and is orthogonal to the observation optical axis Oa is the observation plane Fp. It becomes. In the following, the direction of the observation optical axis Oa is the Z-axis direction, and the plane orthogonal to the direction is the XY plane. Image data acquired by the imaging camera 24 is appropriately analyzed by an image control unit 61 described later and can be displayed on the monitor 39 (see FIG. 2).

  Inside the main body 21, a reflecting member 25 formed of a half mirror or a prism is provided on the observation optical axis Oa. In the main body portion 21, a light guide fiber 27 is attached via a connector portion 26 in the direction of reflection from the observation optical axis Oa by the reflecting member 25. The light guide fiber 27 can guide the irradiation light emitted from the coaxial light source 28 to the reflection member 25. As shown in FIG. 2, the coaxial light source 28 can selectively emit both the halogen lamp 28 a and the strobe light 28 b, and the light is emitted to the light guide fiber 27 regardless of which light is emitted. It is possible to make it. As shown in FIG. 1, the irradiation light emitted from the coaxial light source 28 travels on the observation optical axis Oa through the light guide fiber 27 and the reflecting member 25, and passes through the objective lens 23 of each objective lens barrel 22. Then, the observation surface Fp can be illuminated on the observation optical axis Oa. For this reason, the coaxial light source 28, the light guide fiber 27, and the reflection member 25 cooperate with the objective lens 23 of each objective lens barrel 22 from the inspection object (44) described later with respect to the observation optical system. It functions as the reflective illumination mechanism 12 for generating the reflected light in the coaxial direction, that is, the coaxial incident illumination mechanism 29.

  The main body 21 is movable in the observation optical axis Oa direction (Z-axis direction) by a Z-axis drive mechanism 66 (see FIG. 2) described later. For this reason, the observation optical system in the observation mechanism 11 and the coaxial incident illumination mechanism 29 are integrally movable in the observation optical axis Oa direction (Z-axis direction).

  Further, as shown in FIG. 1, the main body 21 is provided with a ring plate 30 for illuminating light so as to surround the outer periphery of the objective lens barrel 22. Although not shown, the illumination light deriving ring board 30 is provided with a plurality of light emitting portions so as to surround the observation optical axis Oa at a predetermined interval from the observation optical axis Oa. Irradiation is possible from the direction inclined with respect to the axis Oa toward the observation surface Fp. A light guide fiber 31 is attached to the ring plate 30 for illuminating light. The light guide fiber 31 can guide the irradiation light emitted from the ring light source 32 to each light emitting unit (not shown) of the illumination light deriving ring board 30. As shown in FIG. 2, the ring light source 32 can selectively emit both the halogen lamp 32 a and the strobe 32 b, and the light is emitted to the light guide fiber 31 regardless of which light is emitted. It is possible to make it. As shown in FIG. 1, the irradiation light emitted from the ring light source 32 passes through the light guide fiber 31, and from each light emitting portion (not shown) of the illumination light deriving ring board 30 to the observation optical axis Oa. Thus, the observation surface Fp can be illuminated in a tilting direction. For this reason, the ring light source 32, the light guide fiber 31, and the illumination light deriving ring board 30 (the respective light emitting portions) are arranged on the observation optical axis Oa from the inspection object (44) described later with respect to the observation optical system. It functions as the reflective illumination mechanism 12 for generating the reflected light in the inclined direction, that is, the oblique illumination mechanism 33. The illumination light deriving ring board 30 is movable in the observation optical axis Oa direction (Z-axis direction) by a Z-axis drive mechanism 66 (see FIG. 2) described later. The movement in the direction of the observation optical axis Oa may be integrated with the main body 21 or may be independent of each other.

  A holding mechanism 13 is provided below the main body 21 and the illumination light derivation ring board 30. The holding mechanism 13 has a holding stage 34. As shown in FIG. 3, the holding stage 34 has a stepped cylindrical shape, and the annular tip portion 34 a constitutes a holding portion for an inspection object (44) described later. The tip portion 34a is provided with an annular ring groove 34b, and a suction hole 34c for evacuation is provided in the groove. Therefore, in the holding stage 34, the tape 42 (see FIG. 4 and the like) placed as described later can be sucked and held by the tip end portion 34a. The holding stage 34 is provided with a transmission stage 35 on the inside thereof.

  As shown in FIGS. 1, 3, 5, and 6, the transmission stage 35 has a disk shape, and an upper end surface 35a on the upper side (observation optical system side) is a flat surface. A lower end surface 35b of the illumination mechanism 14 (on the irradiation mechanism unit 16 side described later) is a scattering surface. In the first embodiment, the upper end surface 35a is a polished flat surface, and the lower end surface 35b is set in consideration of the diffusivity and the like from the viewpoint of obtaining a scattering effect as described later. The transmission stage 35 is formed of at least a transparent member (transmission member) that allows transmission of transmitted light emitted from an irradiation mechanism section 16 (the emission section 53), which will be described later, of the transmission illumination mechanism 14. Then, it is formed of glass. The transmission stage 35 is supported at its lower end at the peripheral edge from below via a support frame 36 (see FIG. 6).

  As shown in FIG. 6, the support frame 36 has an annular shape and is supported from below by a plurality of Z-axis screwing members 37 (only one is shown in FIG. 6) and a plurality of orthogonal members. Movement to the upper side in the Z-axis direction (observation optical system side) is restricted by the shaft screwing member 38 (only one is shown in FIG. 6). Each Z-axis screw member 37 is provided so as to penetrate the holding stage 34 in the Z-axis direction, and can be positioned in the Z-axis direction by a nut 37a. The Z-axis screwing member 37 is provided at least at three or more points so as to have a predetermined interval when viewed in the rotation direction around the Z-axis. Each orthogonal shaft screwing member 38 has a conical tip, and can be engaged with an inclined surface at the upper end position of the support frame 36. For this reason, in the holding stage 34, the position (height position) of the transmission stage 35 viewed in the Z-axis direction, that is, the observation optical axis Oa direction is changed by appropriately changing the support position by each Z-axis screwing member 37. The transmission stage 35 is provided so that both the inclination of the transmission stage 35 (upper end surface 35a) with respect to the observation optical axis Oa can be adjusted. Accordingly, each Z-axis screw member 37 and each orthogonal shaft screw member 38 function as a position adjustment mechanism that holds the transmission stage 35 with respect to the holding stage 34 so that the position of the transmission stage 35 can be adjusted with respect to the observation optical axis Oa. To do.

  In the transmission stage 35, the thickness dimension, that is, the distance between the upper end surface 35a and the lower end surface 35b is set in consideration of the following three points in consideration of optical characteristics and hardness characteristics of the transmission stage 35. . In Example 1, the thickness dimension of the transmission stage 35 is in the range of 5 cm to 15 cm, and is uniform throughout.

  The first point is that a predetermined amount of light can be secured in the transmitted light that is emitted from an irradiation mechanism section 16 (to be described later) of the transmitted illumination mechanism 14 and incident on the lower end surface 35b and emitted from the upper end surface 35a. This is because the inspection stage (44), which will be described later, needs to be appropriately illuminated in the transmission stage 35 when viewed from an image acquired by the imaging camera 24 via the observation optical system. This point mainly affects the upper limit value of the thickness dimension of the transmission stage 35.

  The second point is that the deformation amount of the bending deformation that falls at the center position is within a predetermined range due to the lower end of the peripheral edge portion being supported from below. In the transmission stage 35, as will be described later, the upper end surface 35a has a function of positioning an inspection target (44) described later on an observation surface Fp that is an appropriate position in the observation optical system. Therefore, the upper end surface 35a needs to be along the observation surface Fp over the entire surface. For this reason, the predetermined range in the deformation amount described above is the maximum depth of field in the observation optical system. This point mainly affects the lower limit value of the thickness dimension of the transmission stage 35.

  The third point is that the scattering effect by the lower end surface 35b as a scattering surface is sufficiently obtained in the transmitted light emitted from the upper end surface 35a. This will be described in detail later.

  As shown in FIG. 1, the holding stage 34 that holds the transmission stage 35 is X orthogonal to the observation optical axis Oa (observation optical system) by an XY drive mechanism 64 (see FIG. 2) described later. It can be moved on the -Y plane. The holding stage 34 can be rotated around the Z axis by a rotation drive mechanism 65 (see FIG. 2) described later. The workpiece 40 to be inspected is held on the holding stage 34 by suction.

  As shown in FIG. 4, the inspection target workpiece 40 is configured by holding a tape (film) 42 to which a wafer 41 (including a glass substrate and the like) is attached inside an annular member 43. In this inspection target workpiece 40, as shown in FIG. 6A, a plurality of semiconductor elements 44 formed from the wafer 41 are in a state of being cut (diced) at each boundary surface while being stuck to the tape 42. And, as shown in (b), there is a state where the tape 42 is stretched and divided into individual pieces (expanded) after being attached to the tape 42 and cut. Here, the annular member 43 has a diameter larger than that of the distal end portion 34a (see FIG. 1) of the holding stage 34, regardless of the difference in state (type of the workpiece 40 to be inspected). The inspection apparatus 10 is used for inspecting whether or not each semiconductor element 44 is appropriately formed in any of these states. For this reason, each semiconductor element 44 can be used as an inspection object, and the inspection object can be inspected while the state of the inspection object workpiece 40 is maintained.

  As shown in FIGS. 1, 5, and 6, in the inspection target workpiece 40, the holding stage 34 is positioned inward of the annular member 43, and the tape 42 is placed on the tip 34 a of the workpiece 40. By the action of the groove 34b and the suction hole 34c, the tape 42 is adsorbed and held on the tip portion 34a. At this time, in the holding stage 34, if the upper end surface 35a of the transmission stage 35 is located above (the observation optical system side) above the tip end portion 34a (suction holding position), the suction holding position on the tape 42 Since the region located more inward is pulled by the upper end surface 35a of the transmission stage 35, it is flattened so as to stick to the upper end surface 35a (see FIG. 1). Therefore, by adjusting the position of the transmission stage 35 with respect to the observation optical axis Oa, the inspection object (each semiconductor element 44) attached to the tape 42 can be positioned on the observation surface Fp in an appropriate state. Below the holding stage 34, an irradiation mechanism section 16 as a transmission illumination mechanism 14 is provided (see FIG. 1).

  As shown in FIG. 1, the transmission illumination mechanism 14 transmits transmitted light from the side opposite to the observation optical system (observation mechanism 11) to the inspection object (each semiconductor element 44) sucked and held by the holding stage 34. Irradiation. The transmitted illumination mechanism 14 includes an irradiation mechanism unit 16. The irradiation mechanism unit 16 can guide the transmitted light emitted from the light source 51 for transmission through the light guide unit 52 described later to the output unit 53 described later. As shown in FIG. 2, the transmissive light source 51 can selectively emit both the halogen lamp 51a and the strobe light 51b, and the light is emitted to the light guide 52 regardless of which light is emitted. It is possible to make it.

  In addition to the transmission light source 51 (see FIG. 2), the irradiation mechanism unit 16 includes a light guide unit 52, an emission unit 53, and a support unit 54 as shown in FIGS. Although not shown, the light guide portion 52 has an incident surface provided on one end side so that light (transmitted light) emitted from the halogen lamp 51a and the strobe light 51b of the transmissive light source 51 (see FIG. 2) can be incident. They are provided so as to face each other, and guide the transmitted light from the transmission light source 51 (see FIG. 2) incident from the incident surface to the emission surface 52a (see FIG. 6) provided on the other end side. In the first embodiment, the light guide unit 52 is formed of an optical fiber. The emission part 53 is connected to the emission surface 52a of the light guide part 52 (see FIG. 6).

  The emission part 53 is configured by accommodating at least one or more optical elements 53b in a cylindrical casing 53a. The optical element 53b includes an incident surface 53c that faces the exit surface 52a of the light guide section 52, and an exit surface 53d that emits transmitted light incident therefrom. The optical element 53b has a predetermined optical characteristic so that the transmitted light incident from the incident surface 53c is emitted from the emission surface 53d in a desired state. A rotationally symmetric axis serving as the central axis position of the optical element 53b is defined as a transmission optical axis Pa (see FIG. 1) of the irradiation mechanism unit 16 (transmission illumination mechanism 14 (transmission illumination system)). In the irradiation mechanism unit 16, when transmitted light is incident from the light guide unit 52 to the emission unit 53, transmitted light along the transmission optical axis Pa is emitted from the emission unit 53. The predetermined optical characteristics in the optical element 53b are that the light amount distribution seen in a cross section orthogonal to the transmission optical axis Pa, which is the traveling direction, is uniform, and the spread (diffusion) of the irradiation region is suppressed. Say that. The optical element 53b is configured by an optical element having the above-described predetermined optical characteristics (integrator function and diffusion prevention (condensing) function). In Example 1, the optical element 53b is a rod integrator optical member. It is configured.

  Further, in the first embodiment, the lower end portion 53e positioned below the incident surface 53c of the optical element 53b in the housing 53a has a cylindrical shape, and the other end portion of the light guide portion 52 (the emission surface 52a is provided). The end portion on the side that is on the inside can be fitted inward. For this reason, the light emission part 53 and the light guide part 52 insert the other end part of the light guide part 52 into the lower end part 53e of the light emission part 53, thereby allowing the light emission part 52a and the light emission part 53 to enter. The face 53c is abutted and connected (connected). In this state, the light guide portion 52 and the emission portion 53 are fixedly supported by the support portion 54.

  For this reason, in the irradiation mechanism section 16, the transmitted light emitted from the transmission light source 51 is advanced to the emission section 53 through the light guide section 52, and is transmitted from the emission section 53 as a substantially parallel light with a uniform light amount distribution. It is possible to irradiate the lower end surface 35b of the transmission stage 35 by emitting the light toward the Pa (see FIG. 1) direction. This transmitted light is scattered by the lower end surface 35b, which is a scattering surface, and irradiates the observation surface Fp from the back surface side. This transmitted light passes through at least the tape 42 of the workpiece 40 to be inspected and held on the holding stage 34, and can be observed by the observation optical system (imaging camera 24) (see FIG. 1). For this reason, the irradiation mechanism unit 16 (the transmission light source 51, the light guide unit 52, and the emission unit 53) cooperates with the lower end surface 35b of the transmission stage 35, which is a scattering surface, to observe from the side opposite to the observation optical system. It functions as a transmission illumination mechanism 14 that generates transmitted light that irradiates the surface Fp (inspection object (semiconductor element 44)). In the first embodiment, the transmission optical axis Pa is set parallel to the Z-axis direction, and the position of the irradiation mechanism unit 16 with respect to the observation optical system is set so that the transmission optical axis Pa and the observation optical axis Oa coincide with each other. ing. The transmitted illumination mechanism 14 is observed by the observation optical system (imaging camera 24) in the irradiated area of the transmitted light viewed on the observation surface Fp by the optical element 53b of the irradiation mechanism unit 16 configured by a rod integrator optical member. It is set so as to be able to satisfy possible observation areas.

  In this inspection apparatus 10, the observation mechanism 11, the reflection illumination mechanism 12, the holding mechanism 13 and the transmission illumination mechanism 14 configured as described above are controlled in an integrated manner under the control of the control mechanism 15 (see FIG. 2). . As illustrated in FIG. 2, the control mechanism 15 includes an image control unit 61, an illumination control unit 62, and a drive control unit 63.

  The image control unit 61 appropriately analyzes the image data acquired by the imaging camera 24. This analysis refers to recognizing the contour lines of a plurality of inspection objects (semiconductor elements 44) affixed to the tape 42, determining the focus state at the observation point, and recognizing defects in each inspection object. For example, recognizing defects of electrodes, wirings, etc. provided on each inspection object, recognizing defective cutting of each inspection object (semiconductor element 44) from the wafer 41, and the like. In addition, the image control unit 61 causes the monitor 39 to display a video based on the image data acquired by the imaging camera 24.

  The illumination control unit 62 appropriately turns on / off the coaxial light source 28, the ring light source 32, and the transmission light source 51. That is, the illumination control unit 62 selectively turns on and off the halogen lamps (28a, 32a, 51a) or the strobes (28b, 32b, 51b) appropriately in the coaxial light source 28, the ring light source 32, and the transmissive light source 51. At the same time, the coaxial light source 28, the ring light source 32, and the transmissive light source 51 are turned on and off simultaneously or individually. The halogen lamps (28a, 32a, 51a) are used as observation illumination, and the strobes (28b, 32b, 51b) are used as inspection illumination. In addition, the illumination control unit 62 can adjust the brightness of the strobes (28b, 32b, 51b) as the inspection illumination in each light source (28, 32, 51). This brightness adjustment can be realized, for example, by appropriately selecting one of a plurality of ND filters.

  The drive control unit 63 appropriately controls driving of the XY drive mechanism 64, the rotation drive mechanism 65, and the Z-axis drive mechanism 66. That is, the drive control unit 63 can appropriately move the observation optical system and the coaxial incident illumination mechanism 29 in the observation mechanism 11 in the observation optical axis Oa direction (Z-axis direction) by driving and controlling the Z-axis drive mechanism 66. In addition, the oblique illumination mechanism 33 can be appropriately moved in the observation optical axis Oa direction (Z-axis direction). This makes it possible to appropriately observe the inspection object (each semiconductor element 44) of the inspection object workpiece 40 held by suction on the holding stage 34 under appropriate illumination. The drive control unit 63 controls the XY drive mechanism 64 and the rotation drive mechanism 65 to control the holding stage 34, that is, the workpiece 40 to be inspected and held on the observation optical axis Oa (observation optical system) and The transmission optical axis Pa (irradiation mechanism unit 16) can be appropriately moved on an XY plane orthogonal to the transmission optical axis Pa (transmission optical axis Pa (Z-axis direction)) as appropriate. Can be rotated. As a result, it is possible to inspect an inspection object (semiconductor element 44) at an arbitrary position on the inspection target work 40 held by suction on the holding stage 34.

  In addition to this, the control mechanism 15 can control the suction operation in the holding stage 34 described above, and can compare image data for inspection.

  In this inspection apparatus 10, first, the position of the transmission stage 35 with respect to the observation optical axis Oa is adjusted according to the inspection target workpiece 40 to which the inspection target to be inspected is attached. This is due to the following. In the inspection apparatus 10, since the tip 42 a of the holding stage 34 sucks and holds the tape 42 at the inner position of the annular member 43, the peripheral edge of the tape 42 is supported from below. In some cases, the center position may be bent and deformed. Then, due to this bending deformation, each semiconductor element 44 on the tape 42 is displaced from the observation surface Fp, and there is a possibility that appropriate observation by the observation optical system (imaging camera 24) cannot be performed. The amount and state of the bending deformation of the tape 42 varies depending on the material of the tape 42 and the position and number of the semiconductor elements 44 attached thereto, and therefore varies depending on the type of the workpiece 40 to be inspected. It becomes. Therefore, the amount and state of the deformation of the tape 42 are set so that each semiconductor element 44 on the tape 42 is positioned on the observation surface Fp in a state where the inspection target work 40 is held by suction by the holding stage 34. Accordingly, both the position (height position) of the transmission stage 35 viewed in the Z axis, that is, the observation optical axis Oa direction, and the inclination of the transmission stage 35 (upper end surface 35a) with respect to the observation optical axis Oa are adjusted.

  At this time, the larger the bending deformation of the tape 42, the higher the upper end surface 35 a of the transmission stage 35 is positioned above (the observation optical system side) the tip end portion 34 a (suction holding position) of the holding stage 34. This is due to the following. When the upper end surface 35 a of the transmission stage 35 is positioned above the tip end portion 34 a of the holding stage 34, the region located inward from the sucked and held portion of the tape 42 is moved upward by the upper end surface 35 a of the transmission stage 35. Therefore, the tape 42 is flattened so that the tape 42 sticks to the upper end surface 35a. For this reason, the inspection object (each semiconductor element 44) affixed to the tape 42 is observed in a more appropriate state by positioning the upper end surface 35a of the transmission stage 35 in accordance with the bending deformation of the tape 42. It can be located on the surface Fp. At this time, it goes without saying that the observation mechanism 11, the reflection illumination mechanism 12, and the irradiation mechanism portion 16 of the transmission illumination mechanism 14 are appropriately moved in the Z-axis direction according to the height position of the upper end surface 35a of the transmission stage 35. The amount and state of the bending deformation of the tape 42 can be acquired, for example, by analyzing image data from the imaging camera 24 by the image control unit 61.

  Next, in the inspection apparatus 10, the inspection target workpiece 40 is sucked and held by the holding stage 34 to perform chip scanning. In this chip scan, the drive controller 63 scans the inner position of the tip end 34a of the holding stage 34, that is, the inner position rather than the portion sucked and held on the workpiece 40 (tape 42) to be inspected. Thus, the holding stage 34 is moved with respect to the observation optical axis Oa. In this scanning, an image is acquired by the imaging camera 24 while irradiating the transmitted light from the transmission illumination mechanism 14.

  Next, a chip map is created. This chip map indicates the position and orientation of each inspection object (semiconductor element 44) on the inspection object work 40 (tape 42). The control mechanism 15 discriminates a plurality of inspection objects (semiconductor elements 44) attached to the tape 42 by recognizing the contour line by chip scanning, and considers movement position information by the drive control unit 63. Thus, the position and orientation of each inspection object (semiconductor element 44) are acquired.

  Next, the inspection object (semiconductor element 44) is determined. In this determination, an observation position by the observation optical system is determined based on the created chip map, and the holding stage 34 is moved by the drive control unit 63 according to the determination. Thereafter, the inspection object (semiconductor element 44) at the observation position is compared with non-defective data of the inspection object, and the quality of the inspection object (semiconductor element 44) is determined. This quality determination is performed by analyzing image data from the imaging camera 24 by the image control unit 61.

By sequentially determining all the inspection objects (semiconductor elements 44) on the inspection object workpiece 40 (tape 42) based on the created chip map, the inspection object (semiconductor element 44) is determined. The inspection for the inspection target workpiece 40 is completed. This inspection can also be performed by visually observing an image based on image data acquired by the imaging camera 24 displayed on the monitor 39 under the control of the image control unit 61.
(Technical issues)
Next, technical problems in the conventional inspection apparatus will be described with reference to FIGS. As for the problem of this technique, if the lower end surface 35b of the transmission stage 35 is not a scattering surface, the same problem occurs in the inspection apparatus 10 according to the present invention. For the sake of simplicity, the inspection apparatus 10 will be described. Further, in FIGS. 7 to 10, for easy understanding, the state of each semiconductor element 44 and the fine shape M (see FIG. 9) described later are emphasized, but the actual inspection object and observation state are shown. It does not necessarily match.

  In the inspection apparatus 10, as described above, when the inspection target workpiece 40 is sucked and held by the holding stage 34, first, a chip scan is performed, and a chip map is created by analyzing image data from the imaging camera 24. At this time, the inspection apparatus 10 needs to recognize the outline of each semiconductor element 44 in the image data from the imaging camera 24. For this recognition, the inspection apparatus 10 acquires image data by the imaging camera 24 while irradiating transmitted light with the transmission illumination mechanism 14 (its irradiation mechanism unit 16).

  As shown in FIG. 7, it is assumed that an inspection target object is formed by aligning rectangular semiconductor elements 44 on a tape 42 of a workpiece 40 to be inspected. Each semiconductor element 44 in this example (FIGS. 7 to 11) schematically shows an LED chip in which an electrode 44b made of a conductor is provided at the center of a rectangular transparent glass substrate 44a. Although not shown, various wirings are also provided on the glass substrate 44a. For this reason, in the workpiece 40 to be inspected, the glass substrate 44a of each semiconductor element 44 and the tape 42 allow transmission of transmitted light. In the image data acquired by the imaging camera 24, the glass substrate of each semiconductor element 44. 44a and the tape 42 become bright.

  Here, in the above-described image analysis, it is necessary to recognize the outline of each semiconductor element 44 irradiated with the transmitted light from the transmitted illumination mechanism 14 (irradiation mechanism unit 16), but each semiconductor element 44 transmits the transmitted light. If it does not allow the transmission of light, its outline is clear, so there is no problem. However, in the case where the inspection object is a member in which the member constituting the outer shape is formed of a material that allows transmission of transmitted light, such as each semiconductor element 44 formed of the transparent glass substrate 44a of this example, 42 and the glass substrate 44a are displayed brightly, and only the outline becomes a thin shadow. Therefore, it is necessary to recognize the outline based on fine contrast (contrast).

  In the workpiece 40 to be inspected, each semiconductor element 44 is formed by being separated from the wafer 41 (see FIG. 4). Therefore, on the tape 42, as shown in FIG. In some cases, the dividing line of the element 44 may be inappropriate (see the upper left), or the two semiconductor elements 44 adjacent to each other may not be separated (see the lower right). When there is such a semiconductor element 44 (inspection object), it is in these states, that is, the two upper left semiconductor elements 44 and the two lower right semiconductor elements 44 in FIG. 8 are defective. It needs to be detected accurately.

  However, each semiconductor element 44 in this example is made of a transparent glass substrate 44a and is attached to a tape 42 that allows transmission of transmitted light. Here, when the state irradiated with the transmitted illumination is observed with the image data from the observation optical system (imaging camera 24), the tape 42 is uniformly bright even when no member is attached. Instead of a state, there is a partially dark spot (see reference numeral M in FIG. 9) that is linear or dotted. Hereinafter, this partially dark portion is referred to as a fine shape M on the tape 42. The fine shape M is considered to be caused by dust or the like adhering to the tape 42 or adhesive spots.

  From this, when each of the elements constituting the outer shape is formed of a material that allows transmission of transmitted light, such as each semiconductor element 44 formed of the transparent glass substrate 44a of this example, In the image data from the imaging camera 24, as shown in FIG. 9, between the shadow portions by the respective electrodes 44b, the shadow portions by the outlines of the respective glass substrates 44a, and the shadow portions by the plurality of fine shapes M, , Will be mixed.

For this reason, as shown in FIG. 10, the dividing line of the two adjacent semiconductor elements 44 is inappropriate (see the upper left), or the two adjacent semiconductor elements 44 are not divided (see the lower left). Even so, there is a risk that the fine shape M existing between them will be determined as the contour line (parting line) of both semiconductor elements 44. For this reason, it is determined that two semiconductor elements 44 that are improperly disconnected or two consecutive semiconductor elements 44 are adjacent to two normal semiconductor elements 44 (see the right side). These defective products may not be accurately detected. In other words, on the image data, each fine shape M of the tape 42 acts as a noise component, and there is a possibility that the inspection accuracy of the inspection object 44 is lowered. For this reason, it is desirable to remove the noise component by some countermeasure.
(Action by scattering surface)
In the inspection apparatus 10, the lower end surface 35 b of the transmission stage 35 is scattered in order to remove the fine shape M of the tape 42 in the image data from the imaging camera 24 obtained by acquiring the observation surface Fp through the observation optical system. It is considered as a surface. Therefore, the transmitted light emitted from the irradiation mechanism unit 16 of the transmission illumination mechanism 14 enters the transmission stage 35 from the lower end surface 35b, which is a scattering surface, exits from the upper end surface 35a, and is attached to the tape 42. Each semiconductor element 44 is irradiated from the back side. For this reason, the transmitted light is scattered by the lower end surface 35b and reaches the tape 42 and the semiconductor elements 44 attached thereto. As described above, when the transmitted light that irradiates the tape 42 is in a predetermined scattering state, the fine shape M of the tape 42 can hardly be recognized in the image data acquired by the imaging camera 24 through the observation optical system. Can do. This is considered due to the fact that the transmitted light is irradiated in various angular directions with respect to the fine shape M of the tape 42.

  For this reason, as described above, in the transmission stage 35, the thickness dimension, that is, the distance between the upper end surface 35a and the lower end surface 35b is determined in consideration of the scattering effect by the lower end surface 35b that is the scattering surface. That is, the thickness dimension of the transmission stage 35 is set so that the transmitted light (transmitted light emitted from the upper end surface 35a) that irradiates the tape 42 on the observation surface Fp can be in a predetermined scattering state. It is set in consideration of the degree of scattering surface (roughness) at the lower end surface 35b. Here, the predetermined scattering state means that the fine shape M of the tape 42 in the image data from the imaging camera 24 is removed, that is, the tape 42 on the observation surface Fp irradiated with the transmitted light from the transmission illumination mechanism 14. When acquired by the imaging camera 24 through the observation optical system, the tape 42 is uniformly bright in the image data.

  In the inspection apparatus 10 configured in this manner, each semiconductor element 44 (see FIG. 7) configured by the transparent glass substrate 44a described above is imaged from the observation optical system (imaging camera 24) while irradiating transmitted illumination. Observing with data, as shown in FIG. 11, it is possible to prevent a shadow portion due to a plurality of fine shapes M on the tape 42, so that noise components on the image data can be removed. For this reason, the outline of each semiconductor element 44 can be accurately determined. For example, as shown in FIG. 10, when two adjacent semiconductor elements 44 have an inappropriate dividing line (see the upper left), the two adjacent semiconductor elements 44 are not divided in an inappropriate state. Since things (refer to the lower left) can be recognized in the continuous state, those defective products can be accurately detected.

  As described above, in the inspection apparatus 10 according to the present invention, the image data from the observation optical system (imaging camera 24) is transmitted from the transmission illumination mechanism 14 by the scattering effect by the lower end surface 35b which is the scattering surface of the transmission stage 35. Since it is possible to prevent shadow portions due to a plurality of fine shapes M in the tape 42 irradiated with transmitted light, the inspection object (Example 1) attached to the tape 42 using the transmitted illumination mechanism 14 can be prevented. Then, the information of each semiconductor element 44) can be obtained accurately.

  In the inspection apparatus 10, the lower end surface 35 b that is a scattering surface is provided at a predetermined interval from the upper end surface 35 a of the transmission stage 35 that defines a plane along the observation surface Fp when viewed in the direction of the transmission optical axis Pa. Therefore, since the scattering effect due to the fact that the surface is a scattering surface can be obtained with certainty, the transmitted light from the transmission illumination mechanism 14 is irradiated in the image data from the observation optical system (imaging camera 24). It is possible to surely prevent a shadow portion due to the plurality of fine shapes M on the tape 42 from occurring.

  Furthermore, in the inspection apparatus 10, the distance between the upper end surface 35a and the scattering surface (lower end surface 35b) viewed in the direction of the transmitted light axis Pa is the transmitted light from the transmission illumination mechanism 14 (emitted from the irradiation mechanism unit 16 and the scattering surface). When the tape 42 on the observation surface Fp irradiated with the transmitted light) is acquired by the imaging camera 24 through the observation optical system, the tape 42 is uniformly bright in the image data. Since it is set together with the degree of the scattering surface (roughness) at the lower end surface 35b, the scattering effect due to the fact that it is a scattering surface can be obtained more reliably. In addition, when an experiment was conducted using the upper end surface 35a of the transmission stage 35 formed of glass as the observation surface Fp and the lower end surface 35b as the scattering surface, the distance between the observation surface Fp and the scattering surface was set to 3 cm or more to obtain a desired value. A scattering effect could be obtained.

  In the inspection apparatus 10, the upper end surface 35a of the transmission stage 35 has a function of flattening the inspection object (each semiconductor element 44 in the first embodiment) while being positioned on the observation surface Fp. The inspection object can be appropriately observed by the observation optical system (observation mechanism 11).

  In the inspection apparatus 10, since the lower end surface 35b of the transmission stage 35 provided with the upper end surface 35a for positioning the inspection object on the observation surface Fp constitutes the scattering surface as the transmission illumination mechanism 14, the observation optical system is used. In the system (observation mechanism 11), the position of the scattering surface (lower end surface 35b) viewed in the direction of the transmitted optical axis Pa relative to the observation surface Fp (upper end surface 35a), which is an appropriate observation point, that is, the observation viewed in the direction of the transmitted optical axis Pa The distance between the surface Fp and the scattering surface can be set easily and reliably.

  In the inspection apparatus 10, since the scattering surface as the transmission illumination mechanism 14 is configured by the lower end surface 35b of the transmission stage 35 provided with the upper end surface 35a, the function and image for positioning the inspection object on the observation surface Fp. Since the function of removing noise components on the data can be realized simply by providing the transmission stage 35, a simple configuration can be achieved.

  In the inspection apparatus 10, the distance (the thickness dimension of the transmission stage 35) between the upper end surface 35 a and the lower end surface 35 b viewed in the direction of the transmission optical axis Pa is the transmitted light emitted from the irradiation mechanism unit 16 and passing through the transmission stage 35. Since the light amount is also set, the inspection object on the observation surface Fp can be irradiated with the predetermined amount of light, so that the inspection object (in the first embodiment) is transmitted using the transmission illumination mechanism 14. Information of each semiconductor element 44) can be obtained more accurately.

  In the inspection apparatus 10, the distance (the thickness dimension of the transmission stage 35) between the upper end surface 35 a and the lower end surface 35 b viewed in the direction of the transmission optical axis Pa makes the deformation amount of the deflection deformation of the transmission stage 35 within a predetermined range. Since the point is also set, the observation optical system (imaging camera 24) can appropriately observe.

  In the inspection apparatus 10, when the work 40 to be inspected (the tape 42) is sucked and held by the holding stage 34, the upper end surface 35 a of the transmission stage 35 is above the front end portion 34 a (suction holding position) of the holding stage 34 (observation optics). Therefore, the inspection object (each semiconductor element 44) attached to the tape 42 can be more appropriately positioned on the observation surface Fp.

  In the inspection apparatus 10, since the position of the transmission stage 35 can be adjusted with respect to the observation optical axis Oa with respect to the holding stage 34 by the position adjustment mechanism, the tape is changed according to the amount and state of the bending deformation of the tape 42. The inspection object (each semiconductor element 44) attached to 42 can be more appropriately positioned on the observation surface Fp.

  In the inspection apparatus 10, since the irradiation mechanism unit 16 (the emission unit 53 thereof) of the transmission illumination mechanism 14 has optical performance (integrator function) that suppresses the expansion (diffusion) of the irradiation region, on the observation surface Fp. Since an appropriate region for the observation optical system (imaging camera 24) can be irradiated, appropriate observation by the observation optical system (imaging camera 24) can be performed more efficiently.

  In the inspection apparatus 10, the irradiation mechanism 16 (the emission part 53) of the transmission illumination mechanism 14 has optical performance (diffusion prevention (collection prevention)) that makes the light amount distribution seen in a cross section orthogonal to the transmission optical axis Pa that is the traveling direction. Light) function), it is possible to perform more appropriate observation by the observation optical system (imaging camera 24).

  In the inspection apparatus 10, the irradiation mechanism portion 16 (the emission portion 53) of the transmitted illumination mechanism 14 is inspected and held by the holding stage 34 from a position away from the holding stage 34 (in the first embodiment, each semiconductor element). 44), it is possible to reliably prevent the holding stage 34 and the irradiation mechanism section 16 (the emission section 53) from interfering with the movement of the holding stage 34 along the XY plane. Therefore, the transmitted light can be irradiated to the entire inner area of the tip end portion 34a that holds the tape 42 by suction in the holding stage 34, so that an effective inspection area can be ensured to the maximum. This is because the irradiation mechanism section 16 (the emission section 53) is held inside the holding stage 34 so as to overlap the holding stage 34 when viewed in the Z-axis direction, and held by the casing 53a of the emission section 53. This is because an area (effective inspection area) where the transmitted light can be irradiated inside the holding stage 34 is narrowed due to interference with the inner peripheral wall surface of the stage 34. For this reason, it is possible to efficiently and appropriately inspect the inspection object attached to the tape 42 sucked and held by the holding stage 34 using the transmission illumination mechanism 14.

  Therefore, in the inspection apparatus 10 according to the present invention, accurate information can be obtained by transmission illumination even for a transparent inspection object (each semiconductor element 44) attached to the tape 42.

  Next, an inspection apparatus 10A according to Example 2 of the present invention will be described with reference to FIG. The second embodiment is an example in which the configuration of the position adjustment mechanism in the holding stage 34A (holding mechanism 13A) is different from the inspection apparatus 10 of the first embodiment. Since the basic configuration of the inspection apparatus 10A of the second embodiment is the same as that of the above-described inspection apparatus 10 of the first embodiment, the same reference numerals are given to parts having the same configuration, and detailed description thereof is omitted. .

  In the inspection apparatus 10A, as shown in FIG. 12, a plurality of Z-axis adjustment mechanisms 71 are provided instead of the Z-axis screw members 37 as position adjustment mechanisms in the holding stage 34A of the holding mechanism 13A. As with the Z-axis screwing member 37, this Z-axis adjusting mechanism 71 is provided with at least three points (only two are shown in FIG. 12). Each Z-axis adjusting mechanism 71 includes a drive motor 72, a cam member 73 attached to the rotating shaft 72a, and a Z-axis support portion 74 that is changed thereby. The drive motor 72 is a drive source in the Z-axis adjustment mechanism 71, and outputs a rotational drive force by the rotary shaft 72a. A cam member 73 is connected to the rotating shaft 72a. The cam member 73 has a disk shape and is connected to the rotating shaft 72a at a position eccentric from the axis. The cam member 73 can be brought into contact with the Z-axis support portion 74 on the outer surface. The Z-axis support portion 74 has a rod shape and is provided through the holding stage 34A in the Z-axis direction on the upper side of the cam member 73 (on the transmission stage 35 side) when viewed in the Z-axis direction. It is supposed to be movable. In the Z-axis support portion 74, one end on the upper side (observation optical system side) supports the support frame 36 from below, and the other end on the lower side is in contact with the outer surface of the cam member 73.

  In the Z-axis adjustment mechanism 71, the drive motor 72 is appropriately driven and controlled, and the Z-axis support portion 74 can be moved in the Z-axis direction according to the rotational posture of the cam member 73 around the rotation shaft 72a. For this reason, in the holding stage 34A, each Z-axis adjusting mechanism 71 is appropriately driven, and the support position by each Z-axis support portion 74 is appropriately changed, so that the transmission stage viewed in the Z-axis direction, that is, the observation optical axis Oa direction. The transmission stage 35 is provided so that both the position (height position) 35 and the inclination of the transmission stage 35 (upper end surface 35a) with respect to the observation optical axis Oa can be adjusted. Thus, each Z-axis screwing member 37 functions as a position adjustment mechanism that holds the transmission stage 35 with respect to the holding stage 34A so that the position adjustment with respect to the observation optical axis Oa is possible. In the inspection apparatus 10A, the drive control unit 63 of the control mechanism 15 can appropriately drive and control each Z-axis adjusting mechanism 71, that is, the drive motor 72 thereof.

  In this inspection apparatus 10A, the tape 42 is bent by analyzing the image data from the imaging camera 24 by the image control unit 61 of the control mechanism 15 in a state where the inspection target workpiece 40 is sucked and held by the holding stage 34A. Get the amount and state of deformation. Next, according to the amount and state of the bending deformation of the tape 42, the drive control unit 63 of the control mechanism 15 adjusts each Z axis so that each semiconductor element 44 on the tape 42 is positioned on the observation surface Fp. By appropriately driving and controlling the drive motor 72 of the mechanism 71, the position (height position) of the transmission stage 35 viewed in the Z-axis direction, that is, the observation optical axis Oa direction, and the transmission stage 35 (upper end surface) with respect to the observation optical axis Oa. Adjust both the slope of 35a). Next, in order to position the inspection object (each semiconductor element 44) attached to the tape 42 on the upper end surface 35a of the transmission stage 35 whose position with respect to the observation optical axis Oa is adjusted, on the observation surface Fp, The drive control unit 63 of the control mechanism 15 appropriately moves the observation mechanism 11, the reflection illumination mechanism 12, and the transmission illumination mechanism 14 (its irradiation mechanism unit 16) in the Z-axis direction. Thereby, the test object (each semiconductor element 44) stuck on the tape 42 is positioned on the observation surface Fp in an appropriate state. For this reason, in the inspection apparatus 10A, the inspection object (each semiconductor element 44) can be inspected similarly to the inspection apparatus 10 of the first embodiment.

  Since the inspection apparatus 10A according to the second embodiment has basically the same configuration as that of the inspection apparatus 10 according to the first embodiment, the same effects as those in the first embodiment can be basically obtained.

  In addition, in the inspection apparatus 10A of the second embodiment, the inspection object (each semiconductor element 44 in the second embodiment) on the tape 42 of the target inspection target workpiece 40 is automatically positioned on the observation surface Fp. Therefore, the inspection object (each semiconductor element 44 in the second embodiment) can be inspected quickly and appropriately.

  Therefore, in the inspection apparatus 10A according to the present invention, accurate information can be obtained by transmission illumination even for the transparent inspection object (each semiconductor element 44) attached to the tape 42.

  In the second embodiment, each Z-axis adjustment mechanism 71 includes the drive motor 72 (rotating shaft 72a), the cam member 73, and the Z-axis support portion 74. However, the drive control of the control mechanism 15 is performed. Any configuration capable of adjusting the position of the transmission stage 35 with respect to the observation optical axis Oa with respect to the holding stage 34A by drive control by the unit 63 is not limited to the configuration of the second embodiment.

  Next, an inspection apparatus 10B according to Example 3 of the present invention will be described with reference to FIG. The third embodiment is an example in which the configuration of the holding mechanism 13B is different from the inspection apparatus 10A according to the second embodiment. Since the basic configuration of the inspection apparatus 10B according to the third embodiment is the same as that of the inspection apparatus 10A according to the second embodiment described above, the same reference numerals are given to portions having the same configuration, and detailed description thereof is omitted. .

  In the inspection apparatus 10B, as shown in FIG. 13, a pressing mechanism 81 is provided in the holding mechanism 13B. The pressing mechanism 81 enables the workpiece 40 to be inspected placed on the transmission stage 35 (upper end surface 35a) of the holding stage 34A to be held. Specifically, the pressing mechanism 81 has a transmission stage with respect to the holding stage 34A so that the upper end surface 35a of the transmission stage 35 is positioned above (the observation optical system side) above the distal end portion 34a (suction holding position) of the holding stage 34A. When the position in the Z-axis direction of 35 is adjusted, the inspection object (each semiconductor element 44) affixed to the tape 42 is appropriately observed by the cooperation with the transmission stage 35 (its upper end surface 35a). The inspection target workpiece 40 can be held while being positioned on Fp.

  In the third embodiment, the pressing mechanism 81 is movable in the Z-axis direction by the slide support portion 82 provided at the outer position of the holding stage 34A and the slide support portion 82 when viewed in the direction orthogonal to the Z-axis. And a pressing arm portion 83 held on the surface. There are at least two pressing mechanisms 81 (two are shown in FIG. 13). Each pressing arm portion 83 extends inward from the slide support portion 82, and can press the annular member 43 of the workpiece 40 to be inspected from above (the observation optical system side) around the holding stage 34A. It is possible. In other words, each pressing arm 83 is provided so that at least the tip portion overlaps the annular member 43 of the workpiece 40 to be inspected when viewed in the Z-axis direction.

  In the inspection apparatus 10B, the tape 42 of the workpiece 40 to be inspected is basically sucked and held by the tip 34a of the holding stage 34A. Here, the Z-axis of the transmission stage 35 with respect to the holding stage 34A so that the upper end surface 35a of the transmission stage 35 is located above (the observation optical system side) the tip 34a (suction holding position) of the holding stage 34A. When the position in the direction is adjusted, the tape 42 placed on the upper end surface 35a may not be attracted and held by the tip 34a of the holding stage 34A. This is due to the fact that the bending deformation of the tape 42 has a limit, and is caused by an increase in the difference between the position of the upper end surface 35a and the position of the distal end portion 34a viewed in the Z-axis direction. At this time, in the inspection apparatus 10B, in each pressing mechanism 81, the pressing arm portion 83 provided on each slide support portion 82 is pushed down (moved to the irradiation mechanism portion 16 side (see FIG. 12 and the like)), The pressing arm 83 presses the annular member 43 of the workpiece 40 to be inspected downward (from the observation optical system side (see FIG. 12)) downward. Then, since the center of the tape 42 is pushed up by the upper end surface 35a of the transmission stage 35, the workpiece 40 to be inspected is fixed in a flattened state so that the tape 42 adheres to the upper end surface 35a. . From this, the pressing position (height position) in each pressing arm 83 is individually set according to the inclination of the transmission stage 35 (its upper end surface 35a) with respect to the observation optical axis Oa. The pressing position of each pressing arm 83 may be the same height position (position relative to the transmission stage 35 as viewed in the Z-axis direction). For this reason, the inspection object (each semiconductor element 44) is appropriately positioned on the observation surface Fp, which is an appropriate position in the observation optical system. The movement of the position of the pressing arm portion 83 on each slide support portion 82 is performed under the control of the control mechanism 15 (the drive control portion 63). The movement of the position of the pressing arm portion 83 on each slide support portion 82 may be performed manually. In each of the pressing mechanisms 81, in a scene where the annular member 43 of the workpiece 40 to be inspected is not pressed, the pressing arm is provided so as not to hinder the placement of the workpiece 40 to be inspected on the holding stage 34A (transmission stage 35). The portion 83 is retracted to the upper position by the slide support portion 82. Note that the pressing arm 83 may be configured to be extendable and retractable in the extending direction for this retraction, and may be configured to be rotatable around the slide support unit 82.

  Since the inspection apparatus 10B according to the third embodiment has basically the same configuration as the inspection apparatus 10A according to the second embodiment, the same effects as those of the second embodiment can be basically obtained.

  In addition, in the inspection apparatus 10B of the third embodiment, the transmission stage 35 is set to Z with respect to the holding stage 34A in order to appropriately position the inspection object (each semiconductor element 44) attached to the tape 42 on the observation surface Fp. Even if the workpiece 40 to be inspected can no longer be sucked and held by the tip end 34a of the holding stage 34A due to the axial position adjustment, the transmission mechanism 35 is pressed by the pressing mechanism 81. Since the tape 42 can be fixed along the upper end surface 35a while being flattened, the inspection object (each semiconductor element 44) affixed to the tape 42 can be appropriately inspected.

  In the inspection apparatus 10B, since the pressing mechanism 81 presses the annular member 43 of the inspection target workpiece 40, the tape 42 of the inspection target workpiece 40 and the inspection target (each semiconductor element 44) affixed thereto. The tape 42 (inspection object (each semiconductor element 44)) can be pressed against the upper end surface 35a of the transmission stage 35 while suppressing the load on the transmission stage 35).

  Therefore, in the inspection apparatus 10B according to the present invention, accurate information can be obtained by transmission illumination even for a transparent inspection object (each semiconductor element 44) attached to the tape 42.

  In the third embodiment, the inspection apparatus 10B provided with the pressing mechanism 81 in the inspection apparatus 10A of the second embodiment is shown. However, the pressing mechanism 81 may be applied to the inspection apparatus 10 of the first embodiment. It is not limited to the configuration of the third embodiment.

In the third embodiment, the pressing mechanism 81 includes the slide support portion 82 and the pressing arm portion 83. However, the pressing mechanism 81 is placed on the transmission stage 35 (upper end surface 35a) of the holding stage (34A). The inspection target workpiece 40 may be any as long as it can hold the inspection target object (each semiconductor element 44) affixed to the tape 42 while appropriately positioning it on the observation surface Fp. It is not limited to the configuration of 3. For example, in the holding stage (34A), the pressing mechanism seals the inward position of the tip end portion (34a) and the transmission member (35) and the support frame (36), and the inside of the tip end portion (34a). This can be realized by adopting a configuration in which the annular groove formed by the one position, the transmission member (35), and the support frame (36) can be evacuated. In the case of such a configuration, the tape 42 of the workpiece 40 to be inspected placed on the upper end surface (35a) of the transmission member (35) is adsorbed over the entire circumference at a position surrounding the upper end surface (35a). Can do. For this reason, regardless of whether or not the tape 42 can be sucked and held by the tip 34a of the holding stage 34A, the surplus due to the bending deformation of the tape 42 can be drawn into the annular groove, so that the tape 42 is attached. The inspection object (each semiconductor element 44) can be appropriately positioned on the observation surface Fp. Further, in the third embodiment, the pressing arm portion 83 of the pressing mechanism 81 causes the annular member 43 of the inspection target workpiece 40 to move. Although it is configured to press from above (observation optical system side), it may be configured to press the tape 42 and is not limited to the configuration of Example 3 described above.

  Next, an inspection apparatus 10C according to Example 4 of the present invention will be described with reference to FIG. The fourth embodiment is an example in which the configuration of the holding stage 34C of the holding mechanism 13C and the transmitted illumination mechanism 14C are different from the inspection apparatus 10 of the first embodiment. Since the basic configuration of the inspection apparatus 10C according to the fourth embodiment is the same as that of the above-described inspection apparatus 10 according to the first embodiment, portions having the same configuration are denoted by the same reference numerals, and detailed description thereof is omitted. .

  In the inspection apparatus 10C, as shown in FIG. 14, the transmission stage 35 and its position adjustment mechanism are not provided in the holding stage 34C of the holding mechanism 13C. That is, the holding stage 34 </ b> C is a stepped cylindrical member that is capable of sucking and holding the tape 42 at the inner position of the annular member 43 at the tip 34 a.

  Further, in the inspection apparatus 10C, the irradiation mechanism portion 16C as the transmission illumination mechanism 14C is configured such that the first optical element 53Cp and the second optical element 53Cq are accommodated in a cylindrical casing 53Ca. The first optical element 53Cp constitutes an incident surface 53Cr that faces the exit surface 52a of the light guide 52 and a first facing surface 53Cs that faces the second optical element 53Cq. The second optical element 53Cq constitutes a second opposing surface 53Ct that opposes the first opposing surface 53Cs of the first optical element 53Cp, and an emission surface 53Cu that emits transmitted light incident therefrom. The second facing surface 53Ct of the second optical element 53Cq is a scattering surface similar to the lower end surface 35b of the transmission stage 35 of the first embodiment. Further, the emission surface 53Cu of the second optical element 53Cq is a flat surface, and in Example 3, it is a polished flat surface. Furthermore, in Example 3, the first facing surface 53Cs of the first optical element 53Cp is a polished flat surface.

  The first optical element 53Cp and the second optical element 53Cq basically have a uniform light amount distribution as viewed in a cross section perpendicular to the transmission optical axis Pa, which is the traveling direction, as in the optical element 53b of the first embodiment. Optical performance (diffusion prevention (condensing) function), and optical performance (integrator function) that suppresses the spread (diffusion) of the irradiation region. In the fourth embodiment, the first optical element 53Cp and the second optical element 53Cq are configured by rod integrator optical members.

  In this irradiation mechanism part 16C, the transmitted light emitted from the light source 51 for transmission passes through the emission surface 52a of the light guide part 52, and proceeds from the incident surface 53Cr facing thereto to the first optical element 53Cp, so that the uniform light quantity is obtained. The light travels through the first facing surface 53Cs of the first optical element 53Cp as the substantially parallel light of the distribution, and travels from the second facing surface 53Ct facing the second optical element 53Cq. At this time, since the second facing surface 53Ct is a scattering surface, the transmitted light is scattered and travels to the second optical element 53Cq, and passes through the emission surface 53Cu of the second optical element 53Cq. The observation surface Fp is irradiated from the back side. This transmitted light is transmitted through at least the tape 42 of the work 40 to be inspected and held by the holding stage 34C, and can be observed by the observation optical system (imaging camera 24) (see FIG. 1). For this reason, in the irradiation mechanism section 16C, the transmission light source 51, the light guide section 52, and the first optical element 53Cp cooperate with the second facing surface 53Ct of the second optical element 53Cq, which is a scattering surface, to observe the optical system. Functions as a transmissive illumination mechanism 14C that generates transmitted light that irradiates the observation surface Fp (inspection object (semiconductor element 44)) from the opposite side, the transmissive light source 51, the light guide 52, and the first optical element 53Cp. However, it functions as the emitting portion 53C of the transmission illumination mechanism 14C. In addition, the second optical element 53Cq is provided with a scattering portion (second opposing surface 53Ct as a scattering surface) that scatters the transmitted light emitted from the emission portion 53C in the transmission illumination mechanism 14C, and allows transmission of the transmitted light. It functions as a transmissive member. Further, in the irradiation mechanism portion 16C, the housing 53Ca functions as a cylindrical holding portion that holds the emission portion 53C and the second optical element 53Cq as a transmission member while connecting them inward.

  In the inspection apparatus 10C, when the tape 42 at the inner position of the annular member 43 is sucked and held by the tip 34a of the holding stage 34C, the emission surface 53Cu of the irradiation mechanism unit 16C is set to the back surface (on the irradiation mechanism unit 16C side) of the tape 42. The object to be inspected is positioned on the observation plane Fp, which is an appropriate position in the observation optical system (imaging camera 24 (see FIG. 1)). Thus, in the inspection apparatus 10C, the emission surface 53Cu of the irradiation mechanism unit 16C has a function of positioning the inspection object on the observation surface Fp, which is an appropriate position in the observation optical system (imaging camera 24). .

  Since the inspection apparatus 10C according to the fourth embodiment has basically the same configuration as that of the inspection apparatus 10 according to the first embodiment, the same effects as those of the first embodiment can be basically obtained.

  In addition, in the inspection apparatus 10C according to the fourth embodiment, in the irradiation mechanism section 16C, the first optical element 53Cp and the second optical element 53Cq need only be housed and configured in the cylindrical housing 53Ca. Since there is no need to provide the transmission stage 35 and its position adjustment mechanism on the holding stage 34C of the mechanism 13C, the inspection object (Example 4) affixed to the tape 42 using the transmission illumination mechanism 14C with a simpler configuration. Then, the information of each semiconductor element 44) can be obtained accurately.

  Therefore, in the inspection apparatus 10 </ b> C according to the present invention, accurate information can be obtained by transmission illumination even for the transparent inspection object (each semiconductor element 44) attached to the tape 42.

  In each of the above-described embodiments, each example of the inspection apparatus according to the present invention has been described. However, an observation optical system having a predetermined position on the observation optical axis as an observation surface, and the observation surface from the observation optical system side. A reflection illumination mechanism that illuminates the observation surface, and a transmission illumination mechanism that illuminates the observation surface from the opposite side of the observation optical system, wherein the transmission illumination mechanism transmits transmitted light guided from a light source And a scatterer that scatters the transmitted light emitted by the irradiator, and the scatterer transmits the transmitted light on the observation surface in a predetermined scattering state. Any inspection apparatus may be used as long as the inspection apparatus is provided at a predetermined interval from the observation surface when viewed in the direction of the transmission optical axis of the mechanism, and is not limited to the above-described embodiments.

  In each of the above-described embodiments, the lower end surface 35b of the transmission stage as the transmission member or the second facing surface 53Ct of the second optical element 53Cq as the transmission member is used as the scattering surface to form the scattering portion. For example, the inspection object is placed on the observation surface Fp as long as it is provided at a predetermined interval in the direction of the transmission optical axis Pa from the observation surface Fp so that the transmitted light on the observation surface Fp is in a predetermined scattering state. It may be configured by an optical member having a scattering action provided separately from the members defined in the above and the emission part of the transmission illumination mechanism 14, and is not limited to the above-described embodiments.

  Further, in each of the above-described embodiments, the holding stage (34, etc.) is configured to suck and hold the tape 42 at the tip end portion 34a, but the state of the inspection target workpiece 40 so that each semiconductor element 44 is an inspection target. As long as the workpiece 40 is held while maintaining the above, it is not limited to the above-described embodiments.

  As mentioned above, although the inspection apparatus of the present invention has been described based on each embodiment, the specific configuration is not limited to each of these examples and each embodiment, and is designed without departing from the gist of the present invention. Changes or additions are permitted.

10, 10A, 10B, 10C Inspection device 11 Observation mechanism (as observation optical system) 12 Reflection illumination mechanism 14, 14C Transmission illumination mechanism 24 Imaging camera (as observation optical system) 34, 34A, 34C Holding stage 35 (Transmission member) Transmission stage 35a (as flat surface) Upper end surface 35b (as scattering surface) Lower end surface 42 Tape 44 Semiconductor element (as inspection object) 51 Light source for transmission 53, 53C Emission part 53Ca (Cylinder holding part) As a casing 53Cq second optical element 53Ct (as a transmission member) second opposing surface (as a scattering surface) Fp observation surface Oa observation optical axis Pa transmission optical axis

Claims (3)

An observation optical system having a predetermined position on the observation optical axis as an observation surface, a reflection illumination mechanism for illuminating the observation surface from the observation optical system side, and illuminating the observation surface from a side opposite to the observation optical system A transmission illumination mechanism, and an inspection device comprising:
Provided with a cylindrical holding stage capable of holding the tape to which the inspection object is affixed from the transmission illumination mechanism side,
The transmission illumination mechanism has an emission part that emits the transmitted light guided from the light source, and a scattering part that scatters the transmitted light emitted by the emission part,
The scattering portion is provided at a predetermined interval from the observation surface when viewed in the direction of the transmitted light axis of the transmission illumination mechanism so that the transmitted light on the observation surface is in a predetermined scattering state .
The transmission illumination mechanism includes a transmission member that allows transmission of transmitted light from the emission unit and is provided with a flat surface that defines a plane along the observation surface between the scattering unit and the observation surface. ,
The scattering portion is configured such that a facing surface facing the emitting portion in the transmitting member is a scattering surface,
The transmission member has a plate shape extending so as to fill the inside of the holding stage by being held by the holding stage,
The emission section, in order to be incident transmitted light into the scattering portion of the transmission member at a predetermined spot area, the inspection apparatus according to claim Rukoto to have a collection optics to reduce the diffusion of the transmitted light emitted . The predetermined scattering state, the inspection of the tape in which the object is stuck is located on the observation plane, the observation optical system, the tape on the observation plane of the transmitted light is irradiated from the transmitted illumination mechanism The inspection apparatus according to claim 1, wherein the tape is uniformly brightened when observed with the lens. The condensing optical member inspection apparatus according to claim 1 or claim 2, characterized in the rod integrator optical member der Rukoto which also has the function of homogenizing the light intensity distribution as seen in cross-section perpendicular to the transmission optical axis .