JP2008026212A - Pattern inspection device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a pattern inspection device capable of obtaining both of a transmitted illumination image and a reflected illumination image only by once scanning an imaging means and an illumination means without lowering a resolving power. <P>SOLUTION: When the inspection pattern 5a of a TAB tape 5 is fed, transmitted illumination light and reflected illumination light are thrown by a transmission illumination means 1a and a reflecting illumination means 1b and the whole of the inspection pattern 5a is scanned so as to pass the region under an inspection part 1 by a scanning means 2. By this constitution, the transparent illumination image of the inspection pattern 5a and the reflected illumination image thereof are stored in a control part 4. The control part 4 compares the stored transmitted illumination image and a reference pattern for transmission illumination to inspect whether the wiring pattern of the transmitted illumination image is within a predetermined dimension range with respect to the reference pattern, that is, whether there is "thickening" or "thinning" in a wiring pattern to judge the quality of the inspection pattern 5a. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a pattern inspection apparatus, and particularly illuminates a wiring pattern formed on a substrate such as a TAB (Tape Automated Bonding) tape with reflected illumination and transmitted illumination, and the obtained reflected illumination image and transmitted illumination image are obtained. The present invention relates to a wiring pattern inspection apparatus that performs a pass / fail determination.

In a wiring pattern inspection, for example, Patent Literature 1, Patent Literature 2, Patent Literature 3 and the like are disclosed as methods and apparatuses for distinguishing between dust (foreign matter) adhering to the front surface or back surface of a substrate and defects in the wiring pattern and preventing erroneous detection. Proposed.
The above publication compares a reflected illumination image obtained by receiving reflected illumination light and a transmitted illumination image obtained by receiving transmitted illumination light on a substrate on which a wiring pattern is formed. It is described that a defect appearing in common is a defect in the wiring pattern.
JP 2004-61491 A Japanese Patent Laid-Open No. 2005-24386 JP 2004-212159 A

Paragraphs 0014-0015 of Patent Document 2 describe a procedure for obtaining a reflected (epi-illumination) illumination image and a transmission illumination image as follows.
(i) The substrate is irradiated with transmitted illumination light, and the imaging unit (CCD line sensor 1c) and the transmitted illumination unit 1a are scanned to obtain a transmitted illumination image of the substrate.
(ii) The illumination is switched to reflection (epi-illumination) illumination, and the imaging means (CCD line sensor 1c) and reflection (epi-illumination) illumination means 1b are scanned to obtain a reflected illumination image of the substrate.
As described above, in the device described in Patent Document 2, in order to obtain two types of images, a transmission illumination image and a reflection illumination image, the imaging unit and the illumination unit must be scanned twice in one inspection region. . Therefore, the problem that inspection takes time occurred.

As a means for solving the above problem, the technique described in Patent Document 3 gives important suggestions. In this publication, it is shown that a transmitted illumination image and a reflected illumination image are obtained simultaneously by changing the wavelengths of transmitted illumination light and reflected illumination light and using a sensor that can detect each wavelength independently.
If this technique is used, both the transmitted illumination image and the reflected illumination image can be obtained by irradiating the inspection area with the transmitted illumination light and the reflected illumination light at the same time and scanning the imaging unit and the illumination unit once.
However, this method has the following problems.
In an actual wiring pattern inspection apparatus, a lens (a lens unit in which a plurality of lenses are combined) is provided on the light incident side of the image pickup means (CCD sensor) for enlarging the inspection area and projecting onto the image pickup means. . Recently, in order to accurately inspect a wiring pattern that is becoming finer year by year, a lens having a higher resolution is demanded.

When the wavelengths of the transmitted illumination light and the reflected illumination light are different, the lens unit must project and project an image on the imaging means in which the transmitted illumination light and the reflected illumination light are equal. That is, the lens unit needs to have equivalent optical characteristics with respect to light having different wavelengths.
However, in general, designing to have equivalent optical characteristics with respect to light having different wavelengths is more difficult than designing an optical system that forms an image of light of one wavelength (monochromatic light), and resolution is also lowered. In order to improve the resolution, the cost of the apparatus becomes high, such as an expensive lens material.
The present invention has been made in view of the above circumstances, and an object of the present invention is to scan both the imaging device and the illuminating device once by scanning the imaging device and the illuminating device without reducing the resolution. It is to provide a pattern inspection apparatus that can be obtained.

(1) The inspection area of the substrate projected by the lens (lens visual field area) is divided into a first area that irradiates reflected illumination light and a second area that irradiates transmitted illumination light, and the lens Reflective illumination means for irradiating reflected illumination light to a first area that is a part of the area of the substrate in the field of view, and other partial areas in the field of view of the lens that are not illuminated by the reflected illumination light A second illumination area is provided with transmission illumination means for irradiating transmission illumination light. Moreover, the 1st imaging means for imaging a 1st area | region and the 2nd imaging means for imaging a 2nd area | region are provided.
Then, the substrate, the two imaging means, and the lens are relatively scanned and moved in the direction in which the first region and the second region are arranged, and the reflected illumination image and the transmission of the inspection region are transmitted by one scanning movement. An illumination image is obtained, and the quality of the pattern is determined based on both images.
(2) In the above (1), the substrate is a long strip TAB tape in which a metal wiring pattern is formed on a resin film, and the moving means transports the TAB tape in the longitudinal direction of the tape.
(3) In the above (1), the substrate is a long strip TAB tape in which a metal wiring pattern is formed on a resin film, and the moving means includes the two imaging means and the lens as a set. It is moved in the longitudinal direction of the TAB tape.
(4) In the above (1), the substrate is a long strip TAB tape in which a metal wiring pattern is formed on a resin film, and the moving means includes the two imaging means and the lens as a set. It is moved in the width direction of the TAB tape.
(5) The wavelength of reflected illumination light and the wavelength of transmitted illumination light are made the same.

In the present invention, the following effects can be obtained.
(1) The field of view of the lens is divided into two areas, the area that irradiates transmitted illumination light and the area that irradiates reflected illumination light, and each area is irradiated with reflected illumination light and transmitted illumination light. Therefore, it is possible to obtain both the transmitted illumination image and the reflected illumination image by scanning the imaging device and the illumination device only once.
(2) By using the same wavelength for transmitted illumination light and reflected illumination light, the lens can be designed so that only a specific wavelength is imaged, and the resolution of the captured image can be improved.
(3) Since only one lens is required and it is not necessary to use an expensive lens material, it is possible to prevent an increase in apparatus cost.

FIG. 1 is a block diagram of a wiring pattern inspection apparatus according to a first embodiment of the present invention. In any of the following embodiments, the case where the substrate is a TAB tape will be described. However, the present invention can be applied to pattern inspection of various substrates capable of transmitting illumination in addition to the TAB tape. . For example, since a silicon wafer transmits infrared rays, if infrared rays are used for reflected illumination light and transmitted illumination light, the same inspection as described above can be performed on the wiring pattern formed on the silicon wafer.
As shown in the figure, the pattern inspection apparatus of the present embodiment is transmitted through the TAB tape 5 fed from the feed reel 11 and the tape transport mechanism 10 including the feed reel 11 and the take-up reel 12 that transport the TAB tape 5. An inspection unit 1 that irradiates illumination light and reflected illumination light and images the pattern 5a, a scanning unit 2 that scans the inspection unit 1 on the inspection pattern 5a of the TAB tape, and a marker unit 3 that marks a defective pattern are provided.
In the marker unit 3, a pattern such as color coating is applied so that a pattern determined to be defective can be punched with a punch or the portion can be immediately confirmed visually as a defective product.

  In addition, the wiring pattern inspection apparatus according to the present embodiment compares the captured transmitted illumination image pattern and reflected illumination image pattern with a master pattern serving as a reference to determine the quality of the product, and also includes an inspection unit 1, a scanning unit 2, The marker part 3 and the control part 4 which controls operation | movement of the tape conveyance mechanism 10 are provided. A reference pattern serving as a reference for pattern inspection is input to the control unit 4 in advance. There are two types of reference patterns, one for reflected illumination and one for transmitted illumination. Note that the reference pattern may be an image obtained by capturing an actual wiring pattern determined to be non-defective, or may be one using CAD data.

Next, a configuration example of the inspection unit will be described.
As shown in FIG. 1, the inspection unit 1 enlarges and projects a region to be inspected of the TAB tape 5 and projects one lens (lens unit) 6, a region of the substrate in the field of view of the lens 6, that is, A part of the area of the substrate enlarged by the lens is not illuminated by the transmitted illumination means 1a that illuminates with the transmitted light from the back side of the TAB tape 5 and the transmitted illumination light of the area of the substrate in the field of view of the lens 6. In the region, there is provided reflective illumination means 1b for illuminating with reflected light (epi-illumination light) from the surface side. Further, provided is an imaging unit 1c that captures an image of the inspection pattern 5a with transmitted illumination light and an imaging unit 1d that captures an image of the inspection pattern 5a with reflected illumination light, provided on the opposite side of the TAB tape 5 of the lens 6. .
As the light source of the transmission illumination means 1a, a light source that transmits the resin film of the TAB tape 5 and emits a reflected wavelength in the pattern formed on the TAB tape 5 is appropriately selected. In this embodiment, an LED that emits light having a wavelength of 850 nm or more is used, and the same light source is used for the reflective illumination unit 1b.
The lens 6 is a combination of a plurality of lenses housed in a lens barrel, and is designed to have desired optical characteristics with respect to light having a wavelength of 850 nm.
The imaging means 1c and 1d have light receiving sensitivity at the wavelength of the illumination light. For example, a CCD line sensor or an area sensor will be described below, and a case where a CCD line sensor is used as the imaging units 1c and 1d will be described below.

FIG. 2 is an enlarged view of the vicinity of the inspection unit 1. 2A shows a state where the TAB tape side is viewed from the imaging means side, and FIG. 2B is a side view.
As shown in FIG. 2 (a), the region of the substrate in the field of view of the lens 6 (the region of the substrate enlarged by the lens 6) is the region X (reflective) irradiated with the reflected illumination light by the reflective illumination means 1b. Illumination region X) and substrate region Y (transmission illumination region Y) irradiated with transmission illumination light by transmission illumination means 1a are divided into two regions. In addition, the arrow direction (longitudinal direction of the TAB tape 5) of the figure is defined as the direction in which the reflected illumination area X and the transmitted illumination area Y are arranged.
Further, on the side opposite to the substrate of the lens 6, the first imaging unit 1 c that captures a transmitted illumination image at a position where the transmitted illumination area Y is projected, and the reflected illumination at a position where the reflected illumination area X is projected. A second image pickup unit 1d for picking up an image is provided.
In order to prevent the transmitted illumination light and the reflected illumination light from being mixed on the substrate to be inspected, the illumination light exit sides of the transmitted illumination means 1a and the reflected illumination means 1b correspond to the lengths of both illumination means. The cylindrical lens 1e is arranged, and the illumination light is condensed in the width direction of the illumination means. Further, by condensing the illumination light in this way, the transmitted illumination area Y and the reflected illumination area X can be brought close to each other, and the lens 6 and the inspection unit 1 can be reduced in size.

As shown in FIG. 3, it may be possible to provide two lenses 6a and 6b corresponding to the two illumination areas and the image pickup devices 1c and 1d, but this is not practical for the following reasons.
The lens is expensive because it requires high optical performance because of its high resolution. If there are two lenses, the cost of the lens is doubled, and the cost of the entire apparatus becomes expensive.
Further, as shown in the background art, since the reflected illumination image and the transmitted illumination image are compared in the inspection, both images must have the same resolution. For this purpose, it is necessary to match the optical characteristics of the two lenses. However, it is actually difficult to match the two lenses with high accuracy, and the cost increases when trying to match them.
Furthermore, as described above, the lens is configured by combining a plurality of lenses. When two lenses are used, the weight increases and the apparatus becomes large.

FIG. 4 is a diagram for explaining the operation of imaging the inspection pattern 5a. In FIG. 4, the imaging means 1c and 1d, the lens 6, the transmitted illumination means 1a and the reflected illumination means 1b (inspection unit 1) are integrated into a TAB tape. The case of moving in the transport direction is shown.
In this case, the reflection illumination area X and the transmission illumination area Y are formed side by side in the longitudinal direction of the TAB tape 5, and the imaging means (on the inspection pattern 5 a of the TAB tape 5 by the scanning means 2 that scans the inspection portion 1. CCD line sensors) 1c, 1d, lens 6, transmitted illumination means 1a and reflected illumination means 1b are scanned in the direction of the arrow in the figure.
The inspection pattern 5a is first illuminated with transmitted illumination, and a transmitted illumination image is obtained by the first imaging means 1c. Subsequently, it is illuminated by reflected illumination, and a reflected illumination image is obtained by the second imaging means 1d.
When the entire inspection unit 1 passes over the inspection pattern 5a, a transmission illumination image and a reflection illumination image of the entire inspection pattern 5a are obtained.

The reflected illumination area X by the reflected illumination means 1b, the transmitted illumination area Y by the transmitted illumination means 1a, the first imaging means 1c, and the second imaging means 1d have a length in a direction orthogonal to the scanning direction. It is necessary to set the length to cover the width of the inspection pattern 5a in one scan.
The light sources of the transmission illumination unit 1a and the reflection illumination unit 1b are configured by arranging a plurality of LEDs, for example. Therefore, the lengths of the transmission illumination area Y and the reflection illumination area X are adjusted by changing the number of LEDs of the illumination means 1a and 1b arranged in the width direction of the inspection pattern 5a.
On the other hand, the commercially available CCD line sensors used for the first image pickup means 1c and the second image pickup means 1d have a predetermined length. Therefore, in order to image a wide inspection pattern, a plurality of CCD line sensors are arranged side by side as shown in FIG.

Next, the operation of the pattern inspection apparatus according to the present embodiment will be described with reference to FIGS. The control (algorithm) for pattern inspection is basically the same as that described in Patent Document 2.
A plurality of the same wiring patterns are continuously formed on the TAB tape 5, and the control unit 4 drives the tape transport mechanism 10 to transport the TAB tape 5 to the inspection unit 1.
When the inspection pattern 5a to be inspected of the TAB tape 5 is transported to a predetermined position of the inspection unit 1 by the tape transport mechanism 10, the TAB tape 5 stops at that position.
The transmitted illumination means 1 a irradiates transmitted illumination light from the lower side of the TAB tape 5 (the side where the wiring pattern 5 a is not provided) to the upstream side in the tape conveyance direction in the substrate region within the field of view of the lens 6.
Further, the reflected illumination means 1b emits reflected illumination light from above the TAB tape 5 (the side on which the wiring pattern 5a is provided) to the downstream side in the tape transport direction in the substrate region within the field of view of the lens 6. To do.

The scanning unit 2 causes the inspection unit 1 (transmission illumination unit 1a, reflection illumination unit 1b, imaging unit 1c, 1d, lens 6) to move in the direction in which the reflection illumination region X and the transmission illumination region Y are aligned, that is, on the TAB tape 5. Scanning is performed so that the entire inspection pattern 5a passes under the inspection portion 1 in the longitudinal direction.
Thereby, the illumination light emitted from the transmission illumination means 1a is transmitted through the TAB tape 5 and received by the imaging means (CCD line sensor) 1c, and the transmission illumination image of the inspection pattern 5a is captured and stored in the control unit 4. Is done.
The illumination light emitted from the reflected light illuminating means 1b is reflected by the TAB tape 5 and received by the imaging means (CCD line sensor) 1d, and the reflected illumination image of the inspection pattern 5a is captured and stored in the control unit 4. Is done. FIG. 6 is a diagram illustrating an example of a transmitted illumination image and a reflected illumination image when there is a thinning, thickening, foreign matter, or the like.

The control unit 4 compares the stored transmission illumination image with the reference pattern for transmission illumination, and determines whether or not the wiring pattern of the transmission illumination image is within a predetermined size range with respect to the reference pattern, that is, the wiring pattern. Inspect for "fat" or "thinness".
When no defect is detected in the wiring pattern, the inspected wiring pattern is determined as a non-defective product.
On the other hand, as shown in FIG. 6A, when the transmitted illumination image and the transmitted illumination wiring pattern are narrower than the reference pattern, the inspected wiring pattern is determined to be a defective product with missing wiring.
If the wiring pattern for transmitted illumination is thicker than the reference pattern as shown in FIG. 6B, for example, the inspected wiring pattern is determined as a defect candidate. The position of the region A including the fat portion of the defective candidate wiring pattern is stored.
Next, the image of the reflected illumination image in a predetermined range around the position corresponding to the region A is compared with the image at the same position of the reference pattern for reflected illumination, and the thinness and the thickness are inspected.
As a result of this inspection, when the weight is detected in the reflected illumination image as in the inspection result by the transmitted illumination image as shown in FIG. 6B, the wiring pattern is determined to be defective.

On the other hand, when the thinness is detected in the reflected illumination image, as shown in FIG. 6C, contrary to the inspection result by the transmitted illumination image, the transmitted illumination image is detected even though the fatness is detected by the transmitted illumination image. The cause of overweight is determined as “foreign matter” on the pattern, and the wiring pattern is determined to be non-defective.
In addition, as shown in FIG. 6 (d), when neither thickening nor thinning is detected in the reflected illumination image, even though the fatness is detected in the transmitted illumination image, The wiring pattern is determined as a defective product due to the fat (root remaining) on the lower side of the pattern.
If the inspected pattern is determined to be defective, the position of the pattern is stored in the control unit, and when the pattern is conveyed to the marker unit 3 by the tape conveyance mechanism 10, marking such as perforation and coloring is performed. .
When the inspection of the inspection pattern 5a is completed, the TAB tape 5 is transported by the tape transport mechanism 10, and the inspection pattern to be inspected next is transported to a predetermined position of the inspection unit 1.

FIG. 7 is a block diagram of a wiring pattern inspection apparatus according to the second embodiment of the present invention. In this embodiment, the inspection unit 1 is not provided with a scanning means and is fixed. Therefore, relative movement between the inspection unit 1 and the TAB tape 5 for the inspection unit 1 to image the inspection pattern 5 a is performed by the tape transport mechanism 10.
The configuration of the inspection unit 1 is basically the same as that of the first embodiment, and the lens 6 and part of the area of the substrate in the field of view of the lens 6 are illuminated with transmitted light from the back side of the TAB tape 5. The reflected illumination means 1b that illuminates the reflected light from the surface side of the TAB tape 5 with respect to the other part of the substrate in the field of view of the lens 6 and the inspection pattern 5a by the transmitted illumination light An image pickup means 1c for picking up an image of the test pattern 5a and an image pickup means 1d for picking up an image of the inspection pattern 5a by reflected illumination light.

Next, the operation of imaging the inspection pattern 5a will be described with reference to FIG.
Similar to the first embodiment, the reflection illumination area X and the transmission illumination area Y are formed side by side in the longitudinal direction of the TAB tape 5, and the first imaging for imaging the transmission illumination area Y on the lens 6. Means 1c and second imaging means 1d for imaging the reflected illumination area X are provided.
When the inspection pattern 5a of the TAB tape 5 is imaged by the first and second imaging elements 1c and Id, the TAB tape 5 is moved by the tape transport mechanism 10 in the direction indicated by the arrow (the longitudinal direction of the TAB tape 5). That is, scanning is performed in a direction in which the reflected illumination area X and the transmitted illumination area Y are aligned.
When the entire inspection pattern 5a passes under the inspection unit 1, a transmission illumination image and a reflection illumination image of the entire inspection pattern 5a are obtained.

The operation of the apparatus of the present embodiment is basically the same as that of the first embodiment, and the description will focus on the different parts.
The TAB tape 5 is transported to the inspection unit 1 by the tape transport mechanism 10.
When the inspection pattern 5a to be inspected by the TAB tape 5 is transported to a predetermined position of the inspection unit 1 (upstream in the transport direction of the inspection unit 1), the transport of the TAB tape 5 is temporarily stopped at that position.
The transmitted illumination means 1 a and the reflected illumination means 1 b illuminate with the field of view of the lens 6 divided, and the transmitted illumination area Y and the reflected illumination area X are formed side by side in the transport direction of the TAB tape 5.
The TAB tape 5 is transported by the tape transport mechanism 10 and the entire inspection pattern 5a is scanned in the direction in which the reflected illumination area X and the transmitted illumination area Y area are arranged. As a result, the transmitted illumination image of the inspection pattern 5a is captured by the CCD line sensor 1c, and the reflected illumination image of the inspection pattern 5a is captured by the CCD line sensor 1d and stored in the control unit 4.
The control unit 4 compares the stored transmitted illumination image with the transmitted illumination reference pattern, and determines whether the inspection pattern 5a is good or bad by the procedure shown in the first embodiment. Is given.
When the inspection of the inspection pattern 5a is completed, the TAB tape 5 is transported by the tape transport mechanism 10, and the inspection pattern to be inspected next is transported to a predetermined position of the inspection unit 1.

FIG. 9 is a block diagram of a wiring pattern inspection apparatus according to a third embodiment of the present invention. In the present embodiment, as in the first embodiment, the inspection unit 1 is provided with a scanning unit 2 ′, but the scanning unit 2 ′ is orthogonal to the transport direction of the TAB tape 5. It moves in the direction (width direction of the TAB tape 5).
Therefore, the arrangement of the transmission illumination means 1a, the reflection illumination means 1b, and the corresponding imaging means 1c, 1d of the inspection unit 1 is centered on the optical axis of the lens 6 with respect to the first and second embodiments. And 90 ° rotated. In FIG. 9, only the transmission illumination unit 1a and the first imaging unit 1c that receives the transmission illumination image are shown in order to avoid complication of the drawing. An illumination unit 1b and a second imaging unit 1d that receives the reflected illumination image are provided.

The operation of imaging the inspection pattern 5a will be described with reference to FIG.
Unlike the first and second embodiments, the reflection illumination area X and the transmission illumination area Y are formed side by side in a direction orthogonal to the longitudinal direction of the TAB tape 5 (width direction of the TAB tape 5). On the lens 6, the 1st imaging means 1c which images the transmission illumination area | region Y, and the 2nd imaging means 1d which images the reflective illumination area | region X are provided.
By the scanning means 2 ′, the transmitted illumination means 1 a, the reflected illumination means 1 b, and the imaging means (CCD line sensors) 1 c and 1 d are arranged in the direction in which the reflected illumination area X and the transmitted illumination area Y area are arranged, that is, in the longitudinal direction of the TAB tape 5. Scan in the orthogonal direction (width direction of the TAB tape 5).
When the entire inspection pattern 5a passes under the inspection unit 1, a transmission illumination image and a reflection illumination image of the entire inspection pattern 5a are obtained.

The operation of the apparatus of the present embodiment is basically the same as that of the first embodiment, and the description will focus on the different parts.
The TAB tape 5 is transported to the inspection unit 1 by the tape transport mechanism 10. When the inspection pattern 5a to be inspected by the TAB tape 5 is conveyed to a predetermined position of the inspection unit 1 (upstream in the conveyance direction of the inspection unit 1), the conveyance of the TAB tape 5 is temporarily stopped at that position.
The transmitted illumination means 1a and the reflected illumination means 1b illuminate with the inside of the field of the lens 6 divided, and the transmitted illumination area Y and the reflected illumination area X are formed side by side in the width direction of the TAB tape 5.
By the scanning means 2 ′, the inspection unit 1 is configured so that the entire inspection pattern 5 a passes under the inspection unit 1 in the direction in which the reflected illumination region X and the transmission illumination region Y are arranged, that is, in the width direction of the TAB tape 5. The
As a result, the transmitted illumination image of the inspection pattern 5 a is captured by the imaging means (CCD line sensor) 1 c and the reflected illumination image of the inspection pattern 5 a is captured by the imaging means (CCD line sensor) 1 d and stored in the control unit 4.
The control unit 4 compares the stored transmitted illumination image with the transmitted illumination reference pattern, and determines whether the inspection pattern 5a is good or bad by the procedure shown in the first embodiment. Is given.

When the inspection of the inspection pattern 5a is completed, the TAB tape 5 is transported by the tape transport mechanism 10, and the inspection pattern to be inspected next is transported to a predetermined position of the inspection unit 1.
As described in the first embodiment, the reflection illumination area X, the transmission illumination area Y, and the first imaging means 1c and the second imaging means 1d have a length in a direction orthogonal to the scanning direction. It is necessary to set the length to cover the area to be inspected by one scan. As shown in FIG. 5, if a plurality of CCD line sensors are arranged side by side, the inspection area into which an image can be captured by a single scan of the inspection unit 1 is widened, so the inspection time of the entire TAB tape can be shortened. .

1 is a block diagram of a wiring pattern inspection apparatus according to a first embodiment of the present invention. It is the figure which expanded and showed the vicinity of the test | inspection part. It is a figure which shows the case where two lenses are provided corresponding to two illumination areas and an image sensor. It is a figure explaining the operation | movement which images a test | inspection pattern in a 1st Example. It is a figure which shows the case where the some CCD line sensor has been arrange | positioned side by side in order to image a wide test | inspection pattern. It is a figure which shows the example of a transmitted illumination image and a reflected illumination image. It is a block diagram of the wiring pattern inspection apparatus of 2nd Example of this invention. It is a figure explaining the operation | movement which images a test | inspection pattern in a 2nd Example. It is a block diagram of the wiring pattern inspection apparatus of the 3rd Example of the present invention. It is a figure explaining the operation | movement which images a test | inspection pattern in a 3rd Example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Inspection | inspection part 1a Transmission illumination means 1b Reflection illumination means 1c, 1d Image pickup means (CCD line sensor)
1e Cylindrical lens 2, 2 'scanning means 3 Marker part 4 Control part 5 TAB tape 5a Inspection pattern 6 Lens 11 Delivery reel 11
12 Take-up reel 10 Tape transport mechanism

Claims (5)

By irradiating the substrate on which the pattern is formed with transmitted illumination light that passes through the substrate and reflected illumination light that is reflected by the substrate,
In a pattern inspection apparatus for obtaining a transmitted illumination image and a reflected illumination image of the substrate, and determining the quality of the pattern based on both images,
One lens that projects an enlarged area of the substrate to be inspected;
Reflective illumination means for irradiating reflected illumination light to a first region that is part of the region of the substrate within the field of view of the lens;
Transmitting illumination means for irradiating transmitted illumination light to a second region that is another partial region of the substrate within the field of view of the lens;
First imaging means for imaging a first region illuminated by the reflected illumination means and enlarged by the lens;
Second imaging means for imaging a second region illuminated by the transmitted illumination means and enlarged by the lens;
A pattern comprising: the substrate; and a moving means for relatively moving the two imaging means and the lens in parallel with a direction in which the first area and the second area are arranged. Inspection device. The substrate is a long strip TAB tape in which a metal wiring pattern is formed on a resin film,
The pattern inspection apparatus according to claim 1, wherein the moving unit is a transport mechanism that transports the TAB tape in a longitudinal direction of the tape. The substrate is a long strip TAB tape in which a metal wiring pattern is formed on a resin film,
The pattern inspection apparatus according to claim 1, wherein the moving unit is an imaging and lens unit moving mechanism that moves the two imaging units and the lens as a set in a longitudinal direction of the TAB tape. The substrate is a long strip TAB tape in which a metal wiring pattern is formed on a resin film,
The pattern inspection apparatus according to claim 1, wherein the moving unit is an imaging and lens unit moving mechanism that moves the two imaging units and the lens as a set in the width direction of the TAB tape. The wavelength of the reflected illumination light irradiated from the reflective illumination means and the wavelength of the transmitted illumination light irradiated from the transmission illumination means are the same wavelength. 4. The pattern inspection apparatus according to 4.

Images