TW201730551A - Inspection apparatus capable of shortening the time required for the inspection of an object under test - Google Patents
Inspection apparatus capable of shortening the time required for the inspection of an object under test Download PDFInfo
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- TW201730551A TW201730551A TW105136689A TW105136689A TW201730551A TW 201730551 A TW201730551 A TW 201730551A TW 105136689 A TW105136689 A TW 105136689A TW 105136689 A TW105136689 A TW 105136689A TW 201730551 A TW201730551 A TW 201730551A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/89—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles
- G01N21/8914—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles characterised by the material examined
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0691—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of objects while moving
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/89—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles
- G01N21/892—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles characterised by the flaw, defect or object feature examined
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/24—Optical enhancement of defects or not directly visible states, e.g. selective electrolytic deposition, bubbles in liquids, light emission, colour change
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/89—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles
- G01N21/892—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles characterised by the flaw, defect or object feature examined
- G01N2021/8925—Inclusions
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- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
本發明係關於用以檢查半導體晶圓等之被檢查物的檢查裝置。 The present invention relates to an inspection apparatus for inspecting an inspection object such as a semiconductor wafer.
在以IC、LSI等為代表之半導體裝置之製造工程中，使用不同的複數檢查裝置(例如，參照專例文獻1、2等)而檢查半導體晶圓之表背面等為多。例如，藉由以該些檢查裝置攝影半導體晶圓之表背面等，可以適當地檢測出混入至電路圖案內之異物，或在研削、研磨等之處理中產生的劃痕等之缺陷。 In the manufacturing process of a semiconductor device typified by an IC, an LSI or the like, a plurality of complex inspection devices (for example, refer to the specific documents 1 and 2) are used to inspect the front and back surfaces of the semiconductor wafer. For example, by photographing the front and back surfaces of the semiconductor wafer by the inspection apparatuses, it is possible to appropriately detect foreign matter mixed in the circuit pattern or defects such as scratches generated during processing such as grinding or polishing.
[專利文獻1]日本特開平7-281098號公報 [Patent Document 1] Japanese Patent Laid-Open No. Hei 7-281098
[專利文獻2]日本特開平10-185535號公報 [Patent Document 2] Japanese Laid-Open Patent Publication No. Hei 10-185535
然而，於使用複數檢查裝置而對半導體晶圓等之被檢查物進行檢查之時，於在某檢查裝置之檢查後，將被檢查物搬入至另外的檢查裝置而實施檢查。因此，於使用如此之複數檢查裝置之情況下，有被檢查物之檢查需要之時間容易變長的問題。 However, when an inspection object such as a semiconductor wafer is inspected by using a plurality of inspection apparatuses, after inspection by an inspection apparatus, the inspection object is carried into another inspection apparatus to perform inspection. Therefore, in the case of using such a plurality of inspection apparatuses, there is a problem that the time required for inspection of the inspection object tends to become long.
本發明係鑑於如此之問題而研究出，其目的在於提供可以縮短被檢查物之檢查所需之時間的檢查裝置。 The present invention has been made in view of such problems, and an object thereof is to provide an inspection apparatus capable of shortening the time required for inspection of an inspection object.
若藉由本發明之一觀點，提供一種檢查裝置，其係檢查板狀之被檢查物的檢查裝置，其特徵在於具備：保持台，其係保持被檢查物；旋轉機構，其係使該保持台旋轉；及檢查單元，其係檢查被保持在該保持台之被檢查物，該檢查單元包含取得被使用於檢測出被檢查物之缺損、被檢查物表面之刮傷、附著於被檢查物之附著物、被檢查物之厚度中之任一者的檢查資訊之第1檢測單元及第2檢測單元，藉由一面使保持被檢查物之狀態的該保持台旋轉，一面配合包含被檢查物之端和中心的直線狀之區域而使該檢查單元直線性移動，而以該第1檢測單元和該第2檢測單元取得檢查資訊。 According to one aspect of the present invention, an inspection apparatus for inspecting a plate-shaped object to be inspected is provided, comprising: a holding table for holding an object to be inspected; and a rotating mechanism for holding the holding table And an inspection unit for inspecting an object to be inspected on the holding table, the inspection unit including obtaining a defect for detecting the object to be inspected, scratching the surface of the object to be inspected, and attaching to the object to be inspected The first detecting unit and the second detecting unit that check the inspection information of the thickness of the object to be inspected are rotated by the holding table while holding the object to be inspected, and the object to be inspected is contained. The inspection unit is linearly moved by the linear region of the end and the center, and the inspection information is acquired by the first detection unit and the second detection unit.
在本發明之一觀點中，上述第1檢測單元及上述第2檢測單元分別為以亮視野觀察法攝影被檢查物而 取得檢查資訊之亮視野攝影單元、以暗視野觀察法攝影被檢查物而取得檢查資訊之暗視野攝影單元、檢測出在被檢查物散亂之光而取得檢查資訊的表面檢查單元、測量被檢查物之上面的高度而取得檢測資訊之厚度測量單元中之任一者為佳。 In one aspect of the invention, the first detecting unit and the second detecting unit respectively detect the object to be inspected by the bright field observation method. A bright-field imaging unit that acquires inspection information, a dark-field imaging unit that acquires inspection information by photographing an inspection object by a dark-field observation method, a surface inspection unit that detects inspection information by dispersing light of the inspection object, and a measurement is inspected Any of the thickness measuring units that obtain the detection information of the height above the object is preferred.
再者，在本發明之一觀點中，以進一步具備：第1控制部，其係控制上述檢查單元之直線性的移動，且記憶該檢查單元之座標；及第2控制部，其係控制上述保持台之旋轉，且記憶該保持台之旋轉角度，根據被檢查物之任意之基準點的座標，和被記憶於該第1控制部的該檢查單元之座標，和被記憶於該第2控制部的該保持台之旋轉角度，在被檢查物上特定取得檢查資訊的位置為佳。 Furthermore, in one aspect of the present invention, the first control unit further includes: a first control unit that controls linear movement of the inspection unit and memorizes coordinates of the inspection unit; and a second control unit that controls the Keeping the rotation of the table, and memorizing the rotation angle of the holding table, the coordinates of the reference point according to any of the objects to be inspected, and the coordinates of the inspection unit stored in the first control unit, and being memorized in the second control The rotation angle of the holding table of the portion is preferably a position at which the inspection information is specifically obtained on the object to be inspected.
再者，在本發明之一觀點中，以進一步具備：畫像生成部，其係根據被檢查物之上述基準點之座標，和被記憶於上述第1控制部之上述檢查單元之座標，和被記憶於上述第2控制部之上述保持台之旋轉角度，和以上述第1檢測單元或上述第2檢測單元所取得出之檢查資訊，生成畫像；和顯示器，其係將在該畫像生成部所生成的畫像予以顯示。 Furthermore, in the aspect of the invention, the image generating unit further includes a coordinate of the reference point of the object to be inspected, a coordinate of the inspection unit stored in the first control unit, and a coordinate The image is generated by the rotation angle of the holding table of the second control unit and the inspection information acquired by the first detecting unit or the second detecting unit, and a display is provided in the image generating unit. The generated portrait is displayed.
與本發明之一觀點有關的檢查裝置由於具備保持被檢查物之保持台，和使該保持台旋轉之旋轉機構， 和包含第1檢測單元及第2檢測單元之檢查單元，且藉由一面保持被檢查物之狀態之保持台旋轉，一面配合包含被檢查物之中心的直線狀之區域而使檢查單元直線性移動，以第1檢測單元和第2檢測單元取得2種類之檢查資訊，故可以使檢查單元之動作單純化，並且一次取得2種類之檢查資訊。 An inspection apparatus according to one aspect of the present invention includes a holding table for holding an object to be inspected, and a rotating mechanism for rotating the holding table. And the inspection unit including the first detection unit and the second detection unit, and linearly moving the inspection unit by arranging a linear region including the center of the inspection object while rotating the holding table while maintaining the state of the inspection object Since the first type of detection unit and the second detection unit acquire two types of inspection information, the operation of the inspection unit can be simplistic, and two types of inspection information can be obtained at one time.
即是，由於不需要取得檢查資訊之時的搬運等之工程，故可以縮短被檢查物之檢查所需之時間。再者，由於使包含第1檢測單元及第2檢測單元之檢查單元直線性移動而一次取得2種類之檢查資訊，故比起使第1檢測單元和第2檢測單元個別移動而取得2種類之檢查資訊之情況等，可以縮短被檢查物之檢查所需的時間。 In other words, since it is not necessary to obtain a project such as transportation when the inspection information is obtained, it is possible to shorten the time required for inspection of the inspection object. In addition, since the inspection information including the first detection unit and the second detection unit is linearly moved to obtain two types of inspection information at a time, two types of detection are obtained by moving the first detection unit and the second detection unit individually. By checking the information, etc., it is possible to shorten the time required for inspection of the object to be inspected.
2‧‧‧檢查裝置 2‧‧‧Checking device
4‧‧‧基台 4‧‧‧Abutment
6‧‧‧保持台 6‧‧‧ Keeping the table
6a‧‧‧保持面 6a‧‧‧ Keep face
8‧‧‧旋轉機構(旋轉手段) 8‧‧‧Rotating mechanism (rotation means)
10‧‧‧檢查單元(檢查手段) 10‧‧‧Check unit (inspection means)
12‧‧‧支撐構造 12‧‧‧Support structure
12a‧‧‧前面 12a‧‧‧ front
14‧‧‧移動機構 14‧‧‧Mobile agencies
16‧‧‧導軌 16‧‧‧rails
18‧‧‧移動板 18‧‧‧Mobile board
20‧‧‧滾珠螺桿 20‧‧‧Ball screw
22‧‧‧脈衝馬達 22‧‧‧ pulse motor
24‧‧‧檢測單元(第1檢測手段) 24‧‧‧Detection unit (1st detection means)
26‧‧‧檢測單元(第2檢測手段) 26‧‧‧Detection unit (2nd detection means)
28‧‧‧檢測單元(第3檢測手段) 28‧‧‧Detection unit (3rd detection means)
30‧‧‧控制單元 30‧‧‧Control unit
30a‧‧‧第1控制部 30a‧‧‧1st Control Department
30b‧‧‧第2控制部 30b‧‧‧2nd Control Department
30c‧‧‧位置特定部 30c‧‧‧Location Specific Department
30d‧‧‧畫像生成部 30d‧‧‧Portrait Generation Department
32‧‧‧顯示器(顯示手段) 32‧‧‧Display (display means)
42‧‧‧亮視野攝影單元 42‧‧‧ Bright field photography unit
44‧‧‧亮視野光源 44‧‧‧ Bright field light source
46‧‧‧透鏡 46‧‧‧ lens
48‧‧‧半反射鏡 48‧‧‧Half mirror
50‧‧‧接物鏡 50‧‧‧ receiving objective lens
52‧‧‧透鏡 52‧‧‧ lens
54‧‧‧攝影單元 54‧‧‧Photographic unit
62‧‧‧暗視野攝影單元 62‧‧‧Dark field photography unit
64‧‧‧暗視野光源 64‧‧‧ Dark field light source
66‧‧‧反射鏡 66‧‧‧Mirror
68‧‧‧透鏡 68‧‧‧ lens
70‧‧‧透鏡 70‧‧‧ lens
72‧‧‧攝影單元 72‧‧‧Photographic unit
82‧‧‧表面檢查單元 82‧‧‧Surface inspection unit
84‧‧‧雷射照射單元 84‧‧‧Laser illumination unit
86‧‧‧聚光單元 86‧‧‧concentrating unit
86a‧‧‧內壁面 86a‧‧‧ inner wall
86b‧‧‧開口 86b‧‧‧ openings
88‧‧‧檢查單元 88‧‧‧Check unit
90‧‧‧光電倍增管 90‧‧‧Photomultiplier
102‧‧‧厚度測量單元 102‧‧‧ thickness measuring unit
104‧‧‧光源 104‧‧‧Light source
106‧‧‧半反射鏡 106‧‧‧half mirror
108‧‧‧透鏡 108‧‧‧ lens
110‧‧‧分光單元 110‧‧‧Distribution unit
112‧‧‧線感測器 112‧‧‧ line sensor
11‧‧‧被檢查物 11‧‧‧Inspected objects
11a‧‧‧上面 11a‧‧‧above
11b‧‧‧下面 11b‧‧‧ below
11c‧‧‧溝槽 11c‧‧‧ trench
11d‧‧‧中心 11d‧‧‧ Center
13‧‧‧直線狀之區域 13‧‧‧Linear area
15‧‧‧軌跡 15‧‧‧Track
21‧‧‧亮視野光 21‧‧‧ Bright field of view
23‧‧‧暗視野光 23‧‧‧ Dark field light
25‧‧‧雷射光線 25‧‧‧Laser light
27‧‧‧散射光 27‧‧‧scattered light
29‧‧‧光 29‧‧‧Light
圖1為示意性表示檢查裝置之構成例的圖示。 Fig. 1 is a view schematically showing an example of the configuration of an inspection apparatus.
圖2為示意性表示亮視野攝影單元之構成例的圖示。 Fig. 2 is a view schematically showing an example of the configuration of a bright-field imaging unit.
圖3為示意性表示暗視野攝影單元之構成例的圖示。 Fig. 3 is a view schematically showing an example of the configuration of a dark-field imaging unit.
圖4為示意性表示表面檢查單元之構成例的圖示。 4 is a view schematically showing a configuration example of a surface inspection unit.
圖5為示意性表示厚度測量單元之構成例的圖示。 Fig. 5 is a view schematically showing a configuration example of a thickness measuring unit.
圖6(A)為示意性表示檢查工程的俯視圖，圖6(B)為示意性表示檢查單元相對於被檢查物之軌跡的俯視圖。 Fig. 6(A) is a plan view schematically showing an inspection project, and Fig. 6(B) is a plan view schematically showing a trajectory of the inspection unit with respect to the inspection object.
圖7(A)為示意性表示根據以亮視野攝影單元所取 得之檢查資訊的畫像之例的圖示，圖7(B)係示意性表示根據以暗視野攝影單元所取得之檢查資訊的畫像之例的圖示。 Figure 7 (A) is a schematic representation according to the bright field photography unit An illustration of an example of an image of the inspection information is obtained, and FIG. 7(B) is a diagram schematically showing an example of an image based on inspection information acquired by the dark-field imaging unit.
圖8(A)係表示以表面檢查單元所測量之散亂光強度之例的曲線圖，圖8(B)為表示根據以厚度測量單元所取得之檢查資訊的畫像之例的圖示。 Fig. 8(A) is a graph showing an example of the scattered light intensity measured by the surface inspection unit, and Fig. 8(B) is a view showing an example of an image based on the inspection information obtained by the thickness measuring unit.
參照附件圖面，針對與本發明之一觀點有關的實施型態進行說明。圖1為示意性表示檢查裝置之構成例的圖示。圖1所示之檢查裝置2具備支撐各構成要素的基台4。 The embodiment relating to one aspect of the present invention will be described with reference to the attached drawings. Fig. 1 is a view schematically showing an example of the configuration of an inspection apparatus. The inspection apparatus 2 shown in FIG. 1 is provided with the base 4 which supports each component.
在基台4之中央設置保持板狀之被檢查物11(參照圖2等)之保持台6。被檢查物11係例如IC、LSI等之製造所使用之圓盤狀之半導體晶圓。但是，被檢查物11之種類、形狀等並無限制，例如即使以封裝基板、陶瓷基板、玻璃基板等作為被檢查物11亦可。 A holding table 6 for holding a plate-shaped object 11 (see FIG. 2 and the like) is provided in the center of the base 4. The test object 11 is a disk-shaped semiconductor wafer used for manufacturing, for example, an IC or an LSI. However, the type, shape, and the like of the test object 11 are not limited, and for example, a package substrate, a ceramic substrate, a glass substrate, or the like may be used as the test object 11.
保持台6被連結於例如包含馬達等之旋轉機構(旋轉手段8)，繞相對於垂直方向(Z軸方向)大概平行之旋轉軸之周圍旋轉。保持台6之上面成為保持被檢查物11之保持面6a。 The holding table 6 is coupled to, for example, a rotating mechanism (rotation means 8) including a motor or the like, and rotates around a rotation axis that is approximately parallel with respect to the vertical direction (Z-axis direction). The upper surface of the holding table 6 serves as a holding surface 6a for holding the inspection object 11.
該保持面6a例如通過被形成在保持台6之內部的吸引路(無圖示)等而連接於吸引源(無圖示)。藉由使吸引源之負壓作用於保持面6a，可以在保持台6保 持被檢查物11。 The holding surface 6a is connected to a suction source (not shown) by, for example, a suction path (not shown) formed inside the holding table 6. By applying a negative pressure of the suction source to the holding surface 6a, it is possible to protect the holding table 6 Holding the object to be inspected 11.
在基台4之上面，以跨越保持台6之方式配置有支撐檢查單元(檢查手段)10之門型支撐構件12。在支撐構件12之前面12a之上部，設置有使檢查單元10在左右方向(Y軸方向)移動之移動機構14。藉由該移動機構14，使檢查單元10直線性移動。 On the upper surface of the base 4, a gate-type support member 12 that supports an inspection unit (inspection means) 10 is disposed across the holding table 6. On the upper portion of the front surface 12a of the support member 12, a moving mechanism 14 that moves the inspection unit 10 in the left-right direction (Y-axis direction) is provided. The inspection unit 10 is linearly moved by the moving mechanism 14.
移動機構14具備被配置在支撐構造12之前面12a且在左右方向延伸的一對導軌16。在導軌16，以能夠滑動之方式安裝構成移動機構14的移動板18。在移動板18之背面側(後面側)設置有螺帽部(無圖示)，該螺帽部螺合平行於導軌16平行之滾珠螺桿20。 The moving mechanism 14 includes a pair of guide rails 16 that are disposed on the front surface 12a of the support structure 12 and that extend in the left-right direction. The moving plate 18 constituting the moving mechanism 14 is slidably attached to the guide rail 16. A nut portion (not shown) is provided on the back side (rear side) of the moving plate 18, and the nut portion is screwed into the ball screw 20 which is parallel to the guide rail 16 in parallel.
在滾珠螺桿20之一端部連結有脈衝馬達22。若以脈衝馬達22使滾珠螺桿20旋轉時，移動板18沿著導軌16在左右方向移動。在移動板18之表面側(前面側)設置有檢查單元10。 A pulse motor 22 is coupled to one end of the ball screw 20. When the ball screw 20 is rotated by the pulse motor 22, the moving plate 18 moves in the left-right direction along the guide rail 16. An inspection unit 10 is provided on the surface side (front side) of the moving plate 18.
檢查單元10包含取得各自不同之資訊(檢查資訊)的檢測單元(第1檢測手段)24、檢測單元(第2檢測手段)26及檢測單元(第3檢測手段)28。各檢測單元24、26、28被構成可以取得例如被被檢查物11之缺損、被檢查物11之表面的傷痕、附著於被檢查物11之附著物、被檢查物11之厚度等之檢測所需的資訊(檢查資訊)。 The inspection unit 10 includes a detection unit (first detection means) 24, a detection unit (second detection means) 26, and a detection means (third detection means) 28 that acquire different information (inspection information). Each of the detecting units 24, 26, and 28 is configured to detect, for example, a defect of the inspection object 11, a flaw on the surface of the inspection object 11, an attachment attached to the inspection object 11, and a thickness of the inspection object 11. Information required (check information).
具體而言，例如以亮視野觀察法攝影被檢查物11之上面11a而取得檢查資訊之亮視野攝影單元、以 暗視野觀察法攝影被檢查物11之上面11a而取得檢查資訊之暗視野攝影單元、檢測出在被檢查物11之上面11a散亂之光而取得檢查資訊的表面檢查單元，及測量相對於被檢查物11之下面11b的上面11a之高度而取得檢查資訊的厚度測量單元中之任一者被選擇出以作為各檢測單元24、26、28。 Specifically, for example, a bright-field imaging unit that acquires inspection information by photographing the upper surface 11a of the inspection object 11 by a bright field observation method, The dark field observation unit that photographs the upper surface 11a of the inspection object 11 and obtains the inspection information, the surface inspection unit that detects the scattered light on the upper surface 11a of the inspection object 11 and obtains inspection information, and the measurement relative to the Any one of the thickness measuring units that obtain the inspection information by the height of the upper surface 11a of the lower surface 11b of the inspection object 11 is selected as each of the detecting units 24, 26, 28.
另外，在本實施型態中，針對包含3種類之檢測單元24、26、28之檢查單元10進行表示，但是與本發明有關之檢查單元(檢查手段)若為至少2種類之檢測單元(檢測手段)即可。再者，檢查單元及使包含4種類以上之檢測單元(檢測手段)亦可。而且，複數(在本實施型態中為3種類)之檢測單元即使不一定被一體化亦可。 Further, in the present embodiment, the inspection unit 10 including the three types of detection units 24, 26, and 28 is shown, but the inspection unit (inspection means) related to the present invention is at least two types of detection units (detection Means). Further, the inspection unit and the detection unit (detection means) including four or more types may be included. Further, the detection units of the plurality (three types in the present embodiment) may not necessarily be integrated.
保持台6、旋轉機構8、檢查單元10、移動機構14等之各構成要素被連接於控制單元30。控制單元30係根據經例如觸控面板式之顯示器(顯示手段)32等而被設定之檢查條件等而控制各構成要素之動作。 The components of the holding table 6, the rotating mechanism 8, the inspection unit 10, the moving mechanism 14, and the like are connected to the control unit 30. The control unit 30 controls the operation of each component based on an inspection condition or the like set by, for example, a touch panel type display (display means) 32 or the like.
控制單元30包含控制移動機構14之第1控制部30a，和控制旋轉機構8之第2控制部30b。第1控制部30a係透過移動機構14而控制檢查單元10之直線性的動作，同時記憶相當於檢查單元10之座標(Y座標)之移動板18之座標(Y座標)。另外，第2控制部30b係透過旋轉機構8而控制保持台6之旋轉，同時記憶保持台6之旋轉角度。 The control unit 30 includes a first control unit 30a that controls the movement mechanism 14, and a second control unit 30b that controls the rotation mechanism 8. The first control unit 30a controls the linear operation of the inspection unit 10 through the movement mechanism 14, and simultaneously stores the coordinates (Y coordinates) of the movement plate 18 corresponding to the coordinates (Y coordinates) of the inspection unit 10. Further, the second control unit 30b controls the rotation of the holding table 6 through the rotation mechanism 8, and memorizes the rotation angle of the holding table 6.
再者，控制單元30包含在被檢查物11上特定取得檢查資訊之位置的位置特定部30c，和從檢查資訊生成畫像之畫像生成部30d。位置特定部30c係根據被檢查物11之任意之基準點(例如，溝槽11c(參照圖6(A)等)之座標，和被記憶於第1控制部30a之檢查單元10之座標，和被記憶於第2控制部30b之保持台6之旋轉角度，在被檢查物11上特定取得檢查資訊之位置(座標)。 Further, the control unit 30 includes a position specifying unit 30c that uniquely acquires the inspection information on the inspection object 11, and an image generation unit 30d that generates an image from the inspection information. The position specifying unit 30c is based on an arbitrary reference point of the object 11 (for example, a coordinate of the groove 11c (see FIG. 6(A) and the like), and a coordinate of the inspection unit 10 that is stored in the first control unit 30a, and The position (coordinate) at which the inspection information is specifically acquired on the inspection object 11 is stored in the rotation angle of the holding table 6 of the second control unit 30b.
另外，畫像生成部30d係根據被檢查物11之基準點(在本實施型態中為溝槽11c)之座標，和被記憶於第1控制部30a之檢查單元10之座標，和被記憶於第2控制部30b之保持台6之旋轉角度，和在檢測單元24、26、28中之任一者所取得出之檢測資訊，生成畫像。在畫像生成部30d生成之畫像因應所需被顯示於顯示器32。 Further, the image generating unit 30d is based on the coordinates of the reference point (the groove 11c in the present embodiment) of the test object 11 and the coordinates of the inspection unit 10 stored in the first control unit 30a, and is memorized. The rotation angle of the holding table 6 of the second control unit 30b and the detection information acquired by any of the detecting units 24, 26, and 28 generate an image. The image generated by the image generating unit 30d is displayed on the display 32 as needed.
圖2係示意性表示被當作檢測單元24、26、28使用之亮視野攝影單元之構成例的圖示。圖2所示之亮視野攝影單元42具備有放射亮視野觀察用之均質之光的亮視野光源44。從亮視野光源44被放射之亮視野光21係經照明用之透鏡46、半反射鏡48、接物鏡50等，而在被檢查物11之上面11a成像。 Fig. 2 is a view schematically showing a configuration example of a bright-field imaging unit used as the detecting units 24, 26, and 28. The bright-field imaging unit 42 shown in Fig. 2 is provided with a bright-field light source 44 that emits homogeneous light for bright field of view. The bright field light 21 emitted from the bright field light source 44 is irradiated with the lens 46 for illumination, the half mirror 48, the objective lens 50, and the like, and is imaged on the upper surface 11a of the test object 11.
在半反射鏡48之上方，設置有聚光在上面11a被反射之反射光而進行成像的成像用之透鏡52。在透鏡52之更上方配置有包含CCD、CMOS等之攝影元件之 攝影單元54。攝影單元54係生成相當於以透鏡52等所形成之影像的畫像(檢查資訊)而送至控制單元30。使用該亮視野攝影單元42之亮視野觀察係例如朝向檢測被形成在被檢查物11之電路圖案等之模樣、刮傷、輪廓之缺損等。 Above the half mirror 48, an imaging lens 52 that collects the reflected light reflected by the upper surface 11a and images the image is provided. A photographic element including a CCD, a CMOS, or the like is disposed above the lens 52. Photography unit 54. The photographing unit 54 generates an image (inspection information) corresponding to the image formed by the lens 52 or the like, and sends it to the control unit 30. The bright field observation using the bright-field imaging unit 42 detects, for example, a pattern, a scratch, a contour defect, or the like of a circuit pattern or the like formed on the inspection object 11.
圖3係示意性表示被當作檢測單元24、26、28使用之暗視野攝影單元之構成例的圖示。圖3所示之暗視野攝影單元62具備有暗視野觀察用之暗視野光源64。從暗視野光源64放射出之暗視野光23經由反射鏡66等而被照射至被檢查物11之上面11a。另外，在反射鏡66被反射之暗視野光23之光束成為對被檢查物11之上面11a傾斜的狀態。 Fig. 3 is a view schematically showing a configuration example of a dark-field imaging unit used as the detecting units 24, 26, and 28. The dark field imaging unit 62 shown in FIG. 3 is provided with a dark field light source 64 for dark field observation. The dark-field light 23 emitted from the dark-field light source 64 is irradiated onto the upper surface 11a of the inspection object 11 via the mirror 66 or the like. Further, the light beam of the dark-field light 23 reflected by the mirror 66 is in a state of being inclined to the upper surface 11a of the inspection object 11.
在上面11a反射之反射光經由成像用之透鏡68、70等而射入至上方之攝影單元72。攝影單元72包含CCD、CMOS等之攝影元件，生成相當於以透鏡68、70等所形成之影像的畫像(檢查資訊)而送至控制單元30。另外，使用該暗視野攝影單元62之暗視野觀察朝向檢測出例如被形成在被檢查物11之刮傷，或附著於上面11a的附著物等。 The reflected light reflected on the upper surface 11a is incident on the imaging unit 72 above via the imaging lenses 68, 70 and the like. The photographing unit 72 includes an imaging element such as a CCD or a CMOS, and generates an image (inspection information) corresponding to the image formed by the lenses 68 and 70, and sends it to the control unit 30. In addition, the dark field observation direction of the dark-field imaging unit 62 is used to detect, for example, a scratch formed on the inspection object 11 or an adhering matter attached to the upper surface 11a.
圖4係示意性表示被當作檢測單元24、26、28使用之表面檢查單元之構成例的圖示。圖4所示之表面檢查單元82具備朝向被配置在下方之被檢查物11之上面11a照射雷射光線25之雷射照射單元84。該雷射照射單元84例如將在雷射振盪器振盪之雷射光線25聚光至被 檢查物11之上面11a。 Fig. 4 is a view schematically showing a configuration example of a surface inspection unit used as the detecting units 24, 26, 28. The surface inspection unit 82 shown in FIG. 4 includes a laser irradiation unit 84 that irradiates the laser beam 25 toward the upper surface 11a of the inspection object 11 disposed below. The laser irradiation unit 84 converges, for example, the laser beam 25 oscillated by the laser oscillator to be Check the top 11a of the object 11.
在雷射光線25之被照射區域存在任何缺陷之情況下，雷射光線25由於該缺陷被散射。另外，在被照射區域不存在缺陷之情況下，雷射光線25原樣地被反射。照射單元84之雷射振盪器係例如半導體雷射，使適合於在缺陷之散射的波長(405nm等)之雷射光線25振盪。但是，雷射振盪器之種類或雷射光線25之波長等並無限制。 In the event that there is any defect in the illuminated area of the laser beam 25, the laser beam 25 is scattered due to the defect. Further, in the case where there is no defect in the irradiated area, the laser beam 25 is reflected as it is. The laser oscillator of the illumination unit 84 is, for example, a semiconductor laser that oscillates the laser beam 25 suitable for the wavelength (405 nm, etc.) at which the defect is scattered. However, the type of the laser oscillator or the wavelength of the laser beam 25 is not limited.
在照射單元84之周圍配置有聚光雷射光線25之散射光27之筒狀的聚光單元86。聚光單元86之內壁面86a之一部分或全部成為反射從兩個焦點中之一方被放射之光而聚光至另一方的橢圓鏡(旋轉橢圓鏡)。依此，例如若在一方之焦點定位被檢查物11之上面11a時，可以反射在雷射光線25之被照射區域產生的散射光27而聚光於另一方之焦點。另外，在聚光單元86之下部，形成用以取入散射光27之開口86b。 A cylindrical concentrating unit 86 that condenses the scattered light 27 of the laser beam 25 is disposed around the irradiation unit 84. One or all of the inner wall surface 86a of the concentrating unit 86 is an elliptical mirror (rotating elliptical mirror) that reflects light radiated from one of the two focal points and condenses the light to the other. Accordingly, for example, when the upper surface 11a of the inspection object 11 is positioned at one of the focal points, the scattered light 27 generated in the irradiated region of the laser beam 25 can be reflected and collected in the other focus. Further, an opening 86b for taking in the scattered light 27 is formed at a lower portion of the concentrating unit 86.
在聚光單元86之上方配置有檢測出被聚光之散射光27的檢測單元88。檢測單元88具備有能夠檢測出微弱之光的光電倍增管90。光電倍增管90被配置在上述橢圓鏡之另一方之焦點附近。依此，可以以光電倍增管90適當地檢測出因缺陷引起的微弱之散射光27。 Above the concentrating unit 86, a detecting unit 88 that detects the condensed scattered light 27 is disposed. The detecting unit 88 is provided with a photomultiplier tube 90 capable of detecting weak light. The photomultiplier tube 90 is disposed near the focus of the other of the elliptical mirrors. Accordingly, the weak scattered light 27 due to the defect can be appropriately detected by the photomultiplier tube 90.
與以光電倍增管90被檢測出之散射光27之光強度有關的資訊(檢查資訊)被送至控制單元30。另外，使用該表面檢查單元82之檢查係朝向檢測除了被形 成在被檢查物11之刮傷，或附著於上面11a之附著物等之外，被稱為霧度之微小的凹凸。 Information (inspection information) relating to the light intensity of the scattered light 27 detected by the photomultiplier tube 90 is sent to the control unit 30. In addition, the inspection system using the surface inspection unit 82 is oriented to detect the shape except It is called a small unevenness of haze, in addition to the scratch of the test object 11, or the adhering matter attached to the upper surface 11a.
圖5係示意性表示被當作檢測單元24、26、28使用之厚度測量單元之構成例的圖示。圖5所示之厚度測量單元102具備有放射檢查用之光29的光源104。該光源104係例如SLD(超發光二極體)，或LED、鹵素燈等，在穿透被檢查物11之特定的波長範圍放射持有強度分布的光29。從光源104被放射之光29通過半反射鏡106、透鏡108等而被照射至被檢查物11。 Fig. 5 is a view schematically showing a configuration example of a thickness measuring unit used as the detecting units 24, 26, 28. The thickness measuring unit 102 shown in Fig. 5 is provided with a light source 104 having light 29 for radiation inspection. The light source 104 is, for example, an SLD (Super Luminescent Diode), or an LED, a halogen lamp, or the like, and emits light 29 having an intensity distribution in a specific wavelength range penetrating the test object 11. The light 29 emitted from the light source 104 is irradiated to the inspection object 11 through the half mirror 106, the lens 108, and the like.
如上述般，由於光29穿透被檢查物11，故被照射至被檢查物11之光29之一部分在被檢查物11之上面11a被反射，另外，被照射至被檢查物11之光29的另外之一部分在被檢查物11之下面11b被反射。依此，在上面11a被反射之光29和在下面11b被反射之光29的干擾光，由於因應上面11a和下面11b之光路差(相當於被檢查物11之厚度)等之複數波長而增強。 As described above, since the light 29 penetrates the object to be inspected 11, a portion of the light 29 that is irradiated onto the object to be inspected 11 is reflected on the upper surface 11a of the object to be inspected 11, and the light that is irradiated to the object to be inspected 11 is 29 The other part is reflected on the lower surface 11b of the object to be inspected 11. Accordingly, the disturbance light of the light 29 reflected on the upper surface 11a and the light 29 reflected on the lower surface 11b is enhanced by the complex wavelengths corresponding to the optical path difference (corresponding to the thickness of the inspection object 11) of the upper surface 11a and the lower surface 11b. .
上述干擾光經由半反射鏡106等而射入至以衍射光柵等而構成之分光單元110。在分光單元110之附近配置有檢測出在分光單元110被分光之光29之強度分布的線感測器112。與以線感測器112取得之干擾光之強度分布有關的資訊(檢查資訊)被送至控制單元30。 The disturbance light is incident on the spectroscopic unit 110 configured by a diffraction grating or the like via the half mirror 106 or the like. A line sensor 112 that detects the intensity distribution of the light 29 split by the spectroscopic unit 110 is disposed in the vicinity of the spectroscopic unit 110. Information (inspection information) related to the intensity distribution of the disturbance light obtained by the line sensor 112 is sent to the control unit 30.
如上述般，以線感測器112所取得之資訊，包含相當於由於複數波長增強的干擾光之分光光譜的資訊。依此，例如藉由控制單元30對在線感測器112所取 得之資訊(干擾光之分光光譜)進行傳立葉轉換(代表有高速傅立葉轉換)等，可以取得與上面11a對下面的高度(即是，被檢查物11之厚度)有關的資訊。 As described above, the information obtained by the line sensor 112 includes information corresponding to the spectral spectrum of the interference light enhanced by the complex wavelength. Accordingly, the online sensor 112 is taken, for example, by the control unit 30. The obtained information (the spectral spectrum of the disturbing light) is subjected to a Fourier transform (representing a high-speed Fourier transform) or the like, and information relating to the height of the lower surface of the above 11a (that is, the thickness of the object 11 to be inspected) can be obtained.
接著，說明以該檢查裝置2被實施之被檢查物11之檢查方法的概略。在與本實施型態有關之檢查方法中，首先實施使被檢查物11保持於檢查裝置2之保持台6的保持工程。具體而言，以上面11a露出至上方之方式，在保持面6a載置被檢查物11。在該狀態下，若使吸引源之負壓作用於保持面6a時，被檢查物11被保持台6吸引、保持。 Next, an outline of an inspection method of the inspection object 11 to be performed by the inspection apparatus 2 will be described. In the inspection method according to the present embodiment, first, the holding work for holding the inspection object 11 on the holding table 6 of the inspection device 2 is performed. Specifically, the test object 11 is placed on the holding surface 6a such that the upper surface 11a is exposed upward. In this state, when the negative pressure of the suction source is applied to the holding surface 6a, the inspection object 11 is sucked and held by the holding table 6.
在保持工程之後，實施取得各種之檢查資訊的檢查工程。圖6(A)係示意性表示檢查工程的俯視圖。如圖6(A)所示般，在該檢查工程中，一面使保持台6繞Z軸之周圍旋轉，一面使檢查單元10移動至Y軸方向。在此，保持台6和檢查單元10被配置成配合包含被保持於保持台6之被檢查物11之中心11d之直線狀之區域13，移動檢查單元10。 After the project is maintained, an inspection project that obtains various inspection information is implemented. Fig. 6(A) is a plan view schematically showing an inspection project. As shown in FIG. 6(A), in the inspection process, the inspection unit 10 is moved to the Y-axis direction while the holding table 6 is rotated around the Z-axis. Here, the holding table 6 and the inspection unit 10 are arranged to move the inspection unit 10 in cooperation with the linear region 13 including the center 11d of the inspection object 11 held by the holding table 6.
依此，當一面以適當之速度使保持台6旋轉，一面以適當之速度使檢查單元10在Y軸方向移動時，檢查單元10(檢測單元24、26、28)係以對被檢查物11描繪螺旋之軌跡之方式移動。圖6(B)係示意性表示檢查單元10(檢測單元24、26、28)對被檢查物11之軌跡的俯視圖。 According to this, when the inspection unit 10 is moved in the Y-axis direction at an appropriate speed while the holding table 6 is rotated at an appropriate speed, the inspection unit 10 (detection units 24, 26, 28) is attached to the inspection object 11 Move in a way that depicts the trajectory of the spiral. Fig. 6(B) is a plan view schematically showing the trajectory of the inspection object 10 by the inspection unit 10 (detection units 24, 26, 28).
因此，若一面使檢查單元10對被檢查物11 如上述般移動，一面以各檢測單元24、26、28連續性或斷續性地取得檢查資訊時，可以沿著軌跡15在被檢查物11之大概的全體取得檢查資訊。另外，第1控制部30a及第2控制部30b被構成可以與以各檢測單元24、26、28取得檢查資訊之時序同步，記憶檢查單元10之座標(移動板18之座標)及保持台6之旋轉角度。 Therefore, if the inspection unit 10 is placed on the inspection object 11 When the inspection information is continuously or intermittently acquired by each of the detecting units 24, 26, and 28 as described above, the inspection information can be acquired along the trajectory 15 in the approximate entirety of the inspection object 11. Further, the first control unit 30a and the second control unit 30b are configured to be synchronized with the timing at which the inspection information is acquired by each of the detecting units 24, 26, and 28, and the coordinates of the inspection unit 10 (the coordinates of the moving plate 18) and the holding table 6 are memorized. The angle of rotation.
依此，位置特定部30c可以根據被檢查物11之溝槽11c(基準點)之座標，和被記憶於第1控制部30a之檢查單元10之座標，和被記憶於第2控制部30b之保持台6之旋轉角度，在被檢查物11上特定取得檢查資訊之位置(座標)。與在位置特定部30c被特定之位置(座標)有關之資訊，在使所對應之檢查資訊具有關聯之狀態下被記憶於控制單元30。 Accordingly, the position specifying unit 30c can be stored in the second control unit 30b based on the coordinates of the groove 11c (reference point) of the inspection object 11 and the coordinates of the inspection unit 10 stored in the first control unit 30a. The position (coordinate) at which the inspection information is specifically obtained on the inspection object 11 is maintained at the rotation angle of the table 6. The information relating to the specific position (coordinate) of the position specifying unit 30c is memorized in the control unit 30 in a state in which the corresponding inspection information is associated.
另外，在該檢查工程中，藉由在上述態樣下使一體性具備檢測單元24、26、28之檢查單元10移動，可以一次取得複數(在本實施型態中，為3種類)之檢查資訊。依此，比起使複數檢測單元個別移動而取得複數檢查資訊之情況等，可以縮短被檢查物11之檢查所需的時間。 Further, in the inspection project, by moving the inspection unit 10 including the detection units 24, 26, and 28 integrally in the above-described manner, it is possible to obtain a plurality of inspections (three types in the present embodiment) in one time. News. According to this, it is possible to shorten the time required for the inspection of the inspection object 11 compared to the case where the plurality of inspection units are individually moved to obtain the plurality of inspection information.
於檢查工程之後，因應所需實施使各檢查資訊予以畫像化的畫像生成工程。如上述般，與在位置特定部30c被特定之位置(座標)有關之資訊，在使所對應之檢查資訊具有關聯之狀態下被記憶於控制單元30。依此，配合取得複數檢查資訊之位置(座標)而進行配列 (匹配)，可以生成例如與被加工物11之全體對應的畫像。 After the inspection of the project, the image generation project for visualizing each inspection information is carried out in accordance with the requirements. As described above, the information relating to the position (coordinate) specified by the position specifying unit 30c is stored in the control unit 30 in a state in which the corresponding inspection information is associated. According to this, the position (coordinate) of the plurality of inspection information is matched. (Matching), for example, an image corresponding to the entire workpiece 11 can be generated.
另外，該畫像生成工程係在畫像生成部30d被實施。被生成之畫像被記憶於控制單元30，因應所需被顯示於顯示器32。但是，於檢查資訊之數量少之情況等，無須使檢查資訊視覺化之情況下，即使省略該畫像生成工程亦可。 In addition, the image generation engineering system is implemented in the image generation unit 30d. The generated image is memorized in the control unit 30 and displayed on the display 32 as needed. However, in the case where the amount of inspection information is small, it is not necessary to visualize the inspection information, and even if the image generation project is omitted.
圖7(A)係示意性表示根據在亮視野攝影單元42所取得之檢查資訊的畫像之例的圖示。從圖7(A)所示之畫像可以確認輪廓之缺損。圖7(B)係示意性表示根據在暗視野攝影單元62所取得之檢查資訊的畫像之例的圖示。從圖7(A)所示之畫像可以確認附著物之存在。 FIG. 7(A) is a view schematically showing an example of an image based on inspection information acquired by the bright-field imaging unit 42. The outline defect can be confirmed from the image shown in Fig. 7(A). FIG. 7(B) is a view schematically showing an example of an image based on inspection information acquired by the dark-field imaging unit 62. The presence of the attached matter can be confirmed from the image shown in Fig. 7(A).
圖8(A)係表示以表面檢查單元82所測量的散射光強度之例的曲線圖。散射光之光強度一般在存在缺陷之區域變大。依此，在例如某區域(位置、座標)測量出之散射光之光強度超過事先設定之臨界值Ith之情況等。可以判定在其區域存在缺陷。該判定以例如控制單元30等進行。 Fig. 8(A) is a graph showing an example of the intensity of scattered light measured by the surface inspection unit 82. The intensity of the scattered light generally increases in areas where defects are present. Accordingly, for example, the light intensity of the scattered light measured in a certain region (position, coordinates) exceeds a threshold value I th set in advance. It can be determined that there is a defect in its area. This determination is performed by, for example, the control unit 30 or the like.
圖8(B)係示意性表示根據在厚度測量單元102所取得之檢查資訊的畫像之例的圖示。從圖8(B)所示之畫像可知在被檢查物11形成有同心圓狀之凹凸圖案。 FIG. 8(B) is a view schematically showing an example of an image based on the inspection information acquired by the thickness measuring unit 102. As is clear from the image shown in FIG. 8(B), a concavo-convex pattern of concentric circles is formed on the test object 11.
如上述般，與本實施型態有關之檢查裝置2 具備保持被檢查物11之保持台6、使保持台6旋轉之旋轉機構(旋轉手段)8、包含複數檢測單元(檢測手段)24、26、28的檢查單元(檢查手段)10，一面使保持被檢查物11之狀態之保持台6旋轉，一面配合包含被檢查物11之中心11d的直線狀之區域13而使檢查單元10直線性移動，依此由於在複數檢測單元24、26、28取得複數檢查資訊，故可以使檢查單元10之動作單純化並且一次取得複數檢查資訊。 As described above, the inspection apparatus 2 related to the present embodiment The holding unit 6 for holding the inspection object 11 and the rotation mechanism (rotation means) 8 for rotating the holding table 6 and the inspection unit (inspection means) 10 including the plurality of detection units (detection means) 24, 26, and 28 are provided for holding. The holding table 6 in the state of the inspection object 11 is rotated, and the inspection unit 10 is linearly moved while being fitted to the linear region 13 including the center 11d of the inspection object 11, thereby obtaining the plurality of detection units 24, 26, and 28 By checking the information in multiples, the action of the inspection unit 10 can be simplistic and the complex inspection information can be obtained at one time.
即是，由於不需要取得檢查資訊之時的搬運等之工程，故可以縮短被檢查物11之檢查所需的時間。再者，由於使一體性具備複數檢測單元24、26、28之檢查單元10直線性移動而一次取得複數檢查資訊，故比起使複數檢測單元個別移動而取得複數檢查資訊之情況等，可以縮短被檢查物11之檢查所需的時間。而且，由於檢查單元10之動作單純，故不需要複雜的移動機構或控制。 In other words, since it is not necessary to acquire a project such as transportation when the inspection information is obtained, the time required for the inspection of the inspection object 11 can be shortened. In addition, since the inspection unit 10 including the plurality of detection units 24, 26, and 28 is linearly moved to obtain the plurality of inspection information at a time, it is possible to shorten the comparison information by acquiring the plurality of inspection information by moving the plurality of detection units individually. The time required for the inspection of the object 11 to be inspected. Moreover, since the operation of the inspection unit 10 is simple, a complicated moving mechanism or control is not required.
另外，本發明並不限定於上述實施型態之記載，能夠做各種變更而加以實施。例如，在上述實施型態中，雖然針對亮視野攝影單元42、暗視野攝影單元62、表面檢查單元82、厚度測量單元102而加以例示，但是即使使用其他檢測單元亦可。 In addition, the invention is not limited to the description of the above-described embodiments, and various modifications can be made. For example, in the above embodiment, although the bright-field imaging unit 42, the dark-field imaging unit 62, the surface inspection unit 82, and the thickness measuring unit 102 are exemplified, other detection units may be used.
其他，與上述實施型態有關之構造、方法等只要在不脫離本發明之目的的範圍，可以適當變更而加以實施。 In addition, the structure, the method, and the like according to the above-described embodiments may be modified as appropriate without departing from the scope of the invention.
2‧‧‧檢查裝置 2‧‧‧Checking device
4‧‧‧基台 4‧‧‧Abutment
6‧‧‧保持台 6‧‧‧ Keeping the table
6a‧‧‧保持面 6a‧‧‧ Keep face
8‧‧‧旋轉機構(旋轉手段) 8‧‧‧Rotating mechanism (rotation means)
10‧‧‧檢查單元(檢查手段) 10‧‧‧Check unit (inspection means)
12‧‧‧支撐構造 12‧‧‧Support structure
12a‧‧‧前面 12a‧‧‧ front
14‧‧‧移動機構 14‧‧‧Mobile agencies
16‧‧‧導軌 16‧‧‧rails
18‧‧‧移動板 18‧‧‧Mobile board
20‧‧‧滾珠螺桿 20‧‧‧Ball screw
22‧‧‧脈衝馬達 22‧‧‧ pulse motor
24‧‧‧檢測單元(第1檢測手段) 24‧‧‧Detection unit (1st detection means)
26‧‧‧檢測單元(第2檢測手段) 26‧‧‧Detection unit (2nd detection means)
28‧‧‧檢測單元(第3檢測手段) 28‧‧‧Detection unit (3rd detection means)
30‧‧‧控制單元 30‧‧‧Control unit
30a‧‧‧第1控制部 30a‧‧‧1st Control Department
30b‧‧‧第2控制部 30b‧‧‧2nd Control Department
30c‧‧‧位置特定部 30c‧‧‧Location Specific Department
30d‧‧‧畫像生成部 30d‧‧‧Portrait Generation Department
32‧‧‧顯示部(顯示手段) 32‧‧‧Display Department (display means)
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| JP2015248942A JP2017116293A (en) | 2015-12-21 | 2015-12-21 | Inspection device |
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| TW201730551A true TW201730551A (en) | 2017-09-01 |
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| KR (1) | KR20170074169A (en) |
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| WO2019167151A1 (en) * | 2018-02-28 | 2019-09-06 | 株式会社日立ハイテクノロジーズ | Inspection device and inspection method for same |
| CN108426532A (en) * | 2018-04-16 | 2018-08-21 | 九豪精密陶瓷(昆山)有限公司 | Ceramic substrate thickness detection apparatus |
| JP7262263B2 (en) * | 2019-03-25 | 2023-04-21 | 東京エレクトロン株式会社 | Method and apparatus for detecting abnormal growth of graphene |
| JP7064125B2 (en) * | 2019-04-25 | 2022-05-10 | 株式会社Sumco | Semiconductor wafer analysis method, semiconductor wafer manufacturing process evaluation method, and semiconductor wafer manufacturing method |
| JP2021015850A (en) | 2019-07-10 | 2021-02-12 | 株式会社ディスコ | Wafer inspection device |
| CN114812411B (en) * | 2022-05-16 | 2022-11-18 | 泰州汇品不锈钢有限公司 | Equipment for measuring thickness of blue by laser |
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| JP2003115436A (en) * | 2001-10-03 | 2003-04-18 | Nikon Corp | Overlapping-measuring machine and method therefor |
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