TW200839924A - Plasma processing apparatus, plasma processing method and storage medium - Google Patents

Plasma processing apparatus, plasma processing method and storage medium Download PDF

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Publication number
TW200839924A
TW200839924A TW097101386A TW97101386A TW200839924A TW 200839924 A TW200839924 A TW 200839924A TW 097101386 A TW097101386 A TW 097101386A TW 97101386 A TW97101386 A TW 97101386A TW 200839924 A TW200839924 A TW 200839924A
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TW
Taiwan
Prior art keywords
electrode
plasma
gas
processing
substrate
Prior art date
Application number
TW097101386A
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English (en)
Chinese (zh)
Inventor
Ikuo Sawada
Peter Ventzek
Tatsuro Ohshita
Kazuyoshi Matsuzaki
Song-Yun Kang
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Tokyo Electron Ltd
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Filing date
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Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200839924A publication Critical patent/TW200839924A/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/32091—Radio frequency generated discharge the radio frequency energy being capacitively coupled to the plasma
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3244—Gas supply means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H01J37/32522—Temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32541—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32568—Relative arrangement or disposition of electrodes; moving means

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Plasma Technology (AREA)
  • Drying Of Semiconductors (AREA)
TW097101386A 2007-01-15 2008-01-14 Plasma processing apparatus, plasma processing method and storage medium TW200839924A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007006206A JP5168907B2 (ja) 2007-01-15 2007-01-15 プラズマ処理装置、プラズマ処理方法及び記憶媒体

Publications (1)

Publication Number Publication Date
TW200839924A true TW200839924A (en) 2008-10-01

Family

ID=39635848

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097101386A TW200839924A (en) 2007-01-15 2008-01-14 Plasma processing apparatus, plasma processing method and storage medium

Country Status (6)

Country Link
US (2) US8636871B2 (enExample)
JP (1) JP5168907B2 (enExample)
KR (1) KR101124924B1 (enExample)
CN (1) CN101601125B (enExample)
TW (1) TW200839924A (enExample)
WO (1) WO2008087843A1 (enExample)

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TWI502619B (zh) * 2012-11-19 2015-10-01 Tokyo Electron Ltd 用於電漿處理設備之電極、電漿處理設備、以及使用電漿處理設備產生電漿的方法
TWI575554B (zh) * 2014-05-14 2017-03-21 馗鼎奈米科技股份有限公司 電漿設備
TWI671782B (zh) * 2014-12-16 2019-09-11 日商東京威力科創股份有限公司 電漿處理裝置
TWI709995B (zh) * 2015-09-28 2020-11-11 美商應用材料股份有限公司 以電漿點源之陣列處理工件的電漿反應器

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US8636871B2 (en) 2014-01-28
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US20140138356A1 (en) 2014-05-22
US9252001B2 (en) 2016-02-02
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KR101124924B1 (ko) 2012-04-12
KR20090091332A (ko) 2009-08-27

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