TW200834806A - Holding apparatus and holding method - Google Patents

Holding apparatus and holding method Download PDF

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Publication number
TW200834806A
TW200834806A TW96148268A TW96148268A TW200834806A TW 200834806 A TW200834806 A TW 200834806A TW 96148268 A TW96148268 A TW 96148268A TW 96148268 A TW96148268 A TW 96148268A TW 200834806 A TW200834806 A TW 200834806A
Authority
TW
Taiwan
Prior art keywords
holding
gas
plate
holding surface
wafer
Prior art date
Application number
TW96148268A
Other languages
English (en)
Chinese (zh)
Inventor
Masaki Tsujimoto
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of TW200834806A publication Critical patent/TW200834806A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
TW96148268A 2007-01-15 2007-12-17 Holding apparatus and holding method TW200834806A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007005712A JP5080090B2 (ja) 2007-01-15 2007-01-15 保持装置及び保持方法

Publications (1)

Publication Number Publication Date
TW200834806A true TW200834806A (en) 2008-08-16

Family

ID=39635802

Family Applications (1)

Application Number Title Priority Date Filing Date
TW96148268A TW200834806A (en) 2007-01-15 2007-12-17 Holding apparatus and holding method

Country Status (3)

Country Link
JP (1) JP5080090B2 (fr)
TW (1) TW200834806A (fr)
WO (1) WO2008087796A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI791561B (zh) * 2017-07-21 2023-02-11 美商伊雷克托科學工業股份有限公司 非接觸式處置器及使用非接觸式處置器處置工件之方法

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010530339A (ja) * 2007-05-25 2010-09-09 コーニング インコーポレイテッド ガラスシートハンドリング装置
JP2009028862A (ja) * 2007-07-27 2009-02-12 Ihi Corp 非接触搬送装置
US8231157B2 (en) 2008-08-28 2012-07-31 Corning Incorporated Non-contact manipulating devices and methods
JP5159528B2 (ja) * 2008-09-09 2013-03-06 リンテック株式会社 板状部材の支持装置および支持方法
US8443863B2 (en) * 2008-10-23 2013-05-21 Corning Incorporated High temperature sheet handling system and methods
JP5145209B2 (ja) * 2008-12-25 2013-02-13 株式会社アルバック 真空処理装置
EP2656378B1 (fr) 2010-12-20 2015-03-18 Ev Group E. Thallner GmbH Système de logement pour la retenue de plaquettes
JP2013141651A (ja) * 2012-01-11 2013-07-22 Lintec Corp エネルギー線照射装置
JP5778054B2 (ja) * 2012-02-13 2015-09-16 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、および、基板処理方法
WO2014084228A1 (fr) * 2012-11-30 2014-06-05 株式会社ニコン Appareil d'aspiration, procédé de mise à l'arche, système de transport, dispositif d'exposition à la lumière, et procédé de production de dispositif
CN104956465B (zh) * 2012-11-30 2018-05-29 株式会社尼康 搬送系统、曝光装置、搬送方法、曝光方法及器件制造方法、以及吸引装置
CN104179781B (zh) * 2013-05-22 2016-03-16 由田新技股份有限公司 吸附装置及可吸附软性对象的真空吸附设备
JP6184594B2 (ja) * 2015-07-27 2017-08-23 株式会社ニレコ 青果物把持具
CN117612967A (zh) 2016-02-16 2024-02-27 Ev 集团 E·索尔纳有限责任公司 用于接合衬底的方法与设备
CN106505019B (zh) * 2016-11-30 2023-09-08 武汉帝尔激光科技股份有限公司 一种全自动太阳能电池片抗光衰激光加工设备
JP2017085177A (ja) * 2017-02-10 2017-05-18 東京エレクトロン株式会社 基板搬送装置および剥離システム
WO2018171909A1 (fr) * 2017-03-21 2018-09-27 Applied Materials, Inc. Appareil et procédé de maintien d'un substrat, appareil et procédé de chargement d'un substrat dans un module de traitement sous vide, et système de traitement sous vide d'un substrat
GB2572016A (en) 2018-03-16 2019-09-18 Maxwell Wade Colin Vacuum plate
US11420830B2 (en) 2017-08-10 2022-08-23 Kongsberg Precision Cutting Systems Belgium Bv Vacuum lifter
US11235939B2 (en) 2017-08-10 2022-02-01 Kongsberg Precision Cutting Systems Belgium Bv Vacuum lifter
CN108469299B (zh) * 2018-03-13 2020-08-21 四川众望安全环保技术咨询有限公司 一种激光测振仪四自由度夹持装置
CN111115286A (zh) * 2019-12-21 2020-05-08 江苏达晨冠图电气科技有限公司 一种工作流畅度高的氧化锌电阻片自动测试产线
CN113921441A (zh) * 2021-11-18 2022-01-11 苏州尊恒半导体科技有限公司 一种悬浮式晶圆定位装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000246682A (ja) * 1999-03-02 2000-09-12 Sony Corp 吸着装置
JP3565079B2 (ja) * 1999-03-16 2004-09-15 松下電器産業株式会社 導電性ボールの搭載装置および搭載方法
JP3283026B2 (ja) * 1999-04-30 2002-05-20 新光電気工業株式会社 ボール状端子の吸着装置及びボール状端子の搭載方法
JP4437415B2 (ja) * 2004-03-03 2010-03-24 リンク・パワー株式会社 非接触保持装置および非接触保持搬送装置
JP4359885B2 (ja) * 2004-05-27 2009-11-11 信越半導体株式会社 ベルヌーイチャック
JP2006282345A (ja) * 2005-04-01 2006-10-19 Hiroshi Akashi 非接触搬送装置
JP2006341346A (ja) * 2005-06-09 2006-12-21 Fujifilm Holdings Corp 非接触型搬送装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI791561B (zh) * 2017-07-21 2023-02-11 美商伊雷克托科學工業股份有限公司 非接觸式處置器及使用非接觸式處置器處置工件之方法

Also Published As

Publication number Publication date
JP5080090B2 (ja) 2012-11-21
WO2008087796A1 (fr) 2008-07-24
JP2008168413A (ja) 2008-07-24

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