CN113921441A - 一种悬浮式晶圆定位装置 - Google Patents

一种悬浮式晶圆定位装置 Download PDF

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CN113921441A
CN113921441A CN202111372763.5A CN202111372763A CN113921441A CN 113921441 A CN113921441 A CN 113921441A CN 202111372763 A CN202111372763 A CN 202111372763A CN 113921441 A CN113921441 A CN 113921441A
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wafer
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陈云利
唐小峄
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Suzhou Zunheng Semiconductor Technology Co ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
    • H01L21/67787—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks with angular orientation of the workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

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Abstract

本发明涉及晶圆搬运装置领域，尤其是一种悬浮式晶圆定位装置。该装置包括圆形盆体、上盘体、底板、气囊，所述圆形盆体的环状边沿处设有环形定位槽，环形定位槽内设有数个吸孔，圆形盆体位于上盘体和底板之间，圆形盆体和底板之间设有气囊，上盘体和底板通过连接组件连接在一起，上盘体的上表面设有数个吹气孔，圆形盆体上分布有数个出气口，上盘体位于圆形盆体内。本发明通过环形定位槽内的吸孔来吸附导电密封圈。通过上盘体吹气来使得晶圆悬浮，并与导电密封圈配合。通过鼓胀的气囊将晶圆吸附在圆形盆体内。本申请可以将晶圆悬浮牵引在导电密封圈上，避免在搬运的时候损坏晶圆上的电路。

Description

一种悬浮式晶圆定位装置
技术领域
本发明涉及晶圆搬运装置领域，尤其是一种悬浮式晶圆定位装置。
背景技术
晶圆表面分布很多电路，在搬运晶圆的时候，可能会因为碰触到晶圆表面而损坏晶圆上的电路。
发明内容
本发明要解决的技术问题是：为了解决背景技术中描述的技术问题，本发明提供了一种悬浮式晶圆定位装置。通过环形定位槽内的吸孔来吸附导电密封圈。通过上盘体吹气来使得晶圆悬浮，并与导电密封圈配合。通过鼓胀的气囊将晶圆吸附在圆形盆体内。本申请可以将晶圆悬浮牵引在导电密封圈上，避免在搬运的时候损坏晶圆上的电路。
本发明解决其技术问题所采用的技术方案是：
一种悬浮式晶圆定位装置，包括圆形盆体、上盘体、底板、气囊，所述圆形盆体的环状边沿处设有环形定位槽，环形定位槽内设有数个吸孔，圆形盆体位于上盘体和底板之间，圆形盆体和底板之间设有气囊，上盘体和底板通过连接组件连接在一起，上盘体的上表面设有数个吹气孔，圆形盆体上分布有数个出气口，上盘体位于圆形盆体内。
具体地，所述上盘体上的数个吹气孔的孔道倾斜向外。
具体地，所述连接组件由螺栓、螺母、弹簧组成，螺栓上螺纹连接有螺母，螺栓穿过弹簧，螺栓的杆体依次穿过上盘体、圆形盆体、底板，上盘体和底板位于螺栓的栓头和螺母之间。
具体地，所述圆形盆体的环形定位槽内固定有环形胶垫，环形胶垫上分布有数个吸孔。
本发明的有益效果是：本发明提供了一种悬浮式晶圆定位装置。通过环形定位槽内的吸孔来吸附导电密封圈。通过上盘体吹气来使得晶圆悬浮，并与导电密封圈配合。通过鼓胀的气囊将晶圆吸附在圆形盆体内。本申请可以将晶圆悬浮牵引在导电密封圈上，避免在搬运的时候损坏晶圆上的电路。
附图说明
下面结合附图和实施例对本发明进一步说明。
图1是本发明的第一视角的结构示意图；
图2是本发明的第二视角的结构示意图；
图3是本发明的圆形盆体的结构示意图；
图4是本发明的连接组件的结构示意图；
图中1.圆形盆体，2.上盘体，3.底板，4.气囊，5.吹气孔,6.出气口，7.螺栓，8.螺母，9.弹簧，10.环形胶垫，11.吸孔。
具体实施方式
现在结合附图对本发明作进一步详细的说明。这些附图均为简化的示意图，仅以示意方式说明本发明的基本结构，因此其仅显示与本发明有关的构成。图1是本发明的第一视角的结构示意图；图2是本发明的第二视角的结构示意
图；图3是本发明的圆形盆体的结构示意图；图4是本发明的连接组件的结构示意图。
一种悬浮式晶圆定位装置，包括圆形盆体1、上盘体2、底板3、气囊4，所述圆形盆体1的环状边沿处设有环形定位槽，环形定位槽内设有数个吸孔，圆形盆体1位于上盘体2和底板3之间，圆形盆体1和底板3之间设有气囊4，上盘体2和底板3通过连接组件连接在一起，上盘体2的上表面设有数个吹气孔5，圆形盆体1上分布有数个出气口6，上盘体2位于圆形盆体1内。
上盘体2上的数个吹气孔5的孔道倾斜向外。
如附图4所示，连接组件由螺栓7、螺母8、弹簧9组成，螺栓7上螺纹连接有螺母8，螺栓7穿过弹簧9，螺栓7的杆体依次穿过上盘体2、圆形盆体1、底板3，上盘体2和底板3位于螺栓7的栓头和螺母8之间。螺栓7和螺母8将上盘体2、圆形盆体1、底板3锁接在一起。上盘体2和底板3会沿着螺栓7移动，而弹簧9可以提供缓冲防护，避免硬接触。
圆形盆体1的环形定位槽内固定有环形胶垫10，环形胶垫10上分布有数个吸孔11。
结合附图1、附图2、附图3所示，导电密封环贴合在环形胶垫10上，真空泵驱使数个吸孔11产生负压吸力，从而将导电密封环吸在环形定位槽内的环形胶垫10上。气泵产生的气体通过上盘体2的内腔，从上盘体2上表面的数个数个吹气孔5吹出。所有吹气孔5的气体都沿着倾斜的气道往外斜向喷出，此时将晶圆放置到上盘体2上，上盘体2上吹出的气体会托住晶圆，使得晶圆悬浮在上盘体2上。接着为气囊4充气，鼓起的气囊4会撑开底板3和圆形盆体1，此时底板3就会通过连接组件将上盘体2往圆形盆体1的盆内拉。当上盘体2下沉到一定位置之后，上盘体2在晶圆下方喷出的气体就会从分布在圆形盆体1盆底周围的数个出气口6流出。此时晶圆下方持续喷出的空气流速会快于晶圆上方的空气，根据伯努利原理，流速大的地方静压小，流速小的地方静压大，这样利用压差，就可以将晶圆以悬浮状态压在圆形盆体1内，这样该吸盘移动的时候，就可以避免直接接触晶圆表面。
以上述依据本发明的理想实施例为启示，通过上述的说明内容，相关工作人员完全可以在不偏离本项发明技术思想的范围内，进行多样的变更以及修改。本项发明的技术性范围并不局限于说明书上的内容，必须要根据权利要求范围来确定其技术性范围。

Claims (4)

1.一种悬浮式晶圆定位装置，其特征是，包括圆形盆体(1)、上盘体(2)、底板(3)、气囊(4)，所述圆形盆体(1)的环状边沿处设有环形定位槽，环形定位槽内设有数个吸孔，圆形盆体(1)位于上盘体(2)和底板(3)之间，圆形盆体(1)和底板(3)之间设有气囊(4)，上盘体(2)和底板(3)通过连接组件连接在一起，上盘体(2)的上表面设有数个吹气孔(5)，圆形盆体(1)上分布有数个出气口(6)，上盘体(2)位于圆形盆体(1)内。
2.根据权利要求1所述的一种悬浮式晶圆定位装置，其特征在于：所述上盘体(2)上的数个吹气孔(5)的孔道倾斜向外。
3.根据权利要求1所述的一种悬浮式晶圆定位装置，其特征在于：所述连接组件由螺栓(7)、螺母(8)、弹簧(9)组成，螺栓(7)上螺纹连接有螺母(8)，螺栓(7)穿过弹簧(9)，螺栓(7)的杆体依次穿过上盘体(2)、圆形盆体(1)、底板(3)，上盘体(2)和底板(3)位于螺栓(7)的栓头和螺母(8)之间。
4.根据权利要求1所述的一种悬浮式晶圆定位装置，其特征在于：所述圆形盆体(1)的环形定位槽内固定有环形胶垫(10)，环形胶垫(10)上分布有数个吸孔(11)。
CN202111372763.5A 2021-11-18 2021-11-18 一种悬浮式晶圆定位装置 Pending CN113921441A (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI812190B (zh) * 2022-04-25 2023-08-11 盛詮科技股份有限公司 晶圓懸浮手臂

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008087796A1 (ja) * 2007-01-15 2008-07-24 Lintec Corporation 保持装置及び保持方法
CN102201354A (zh) * 2010-03-23 2011-09-28 日东电工株式会社 工件输送方法和工件输送装置
CN204332929U (zh) * 2014-12-17 2015-05-13 王义正 非接触式晶圆搬运装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008087796A1 (ja) * 2007-01-15 2008-07-24 Lintec Corporation 保持装置及び保持方法
CN102201354A (zh) * 2010-03-23 2011-09-28 日东电工株式会社 工件输送方法和工件输送装置
CN204332929U (zh) * 2014-12-17 2015-05-13 王义正 非接触式晶圆搬运装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI812190B (zh) * 2022-04-25 2023-08-11 盛詮科技股份有限公司 晶圓懸浮手臂

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Application publication date: 20220111