TW200822828A - Preparing device for boring contact bores on multi-layer conducting plate - Google Patents

Preparing device for boring contact bores on multi-layer conducting plate Download PDF

Info

Publication number
TW200822828A
TW200822828A TW095141600A TW95141600A TW200822828A TW 200822828 A TW200822828 A TW 200822828A TW 095141600 A TW095141600 A TW 095141600A TW 95141600 A TW95141600 A TW 95141600A TW 200822828 A TW200822828 A TW 200822828A
Authority
TW
Taiwan
Prior art keywords
circuit board
layer
contact hole
drilling
contact
Prior art date
Application number
TW095141600A
Other languages
English (en)
Chinese (zh)
Inventor
Alfred Reinhold
Original Assignee
Comet Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Comet Gmbh filed Critical Comet Gmbh
Publication of TW200822828A publication Critical patent/TW200822828A/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Structure Of Printed Boards (AREA)
TW095141600A 2005-11-08 2006-11-10 Preparing device for boring contact bores on multi-layer conducting plate TW200822828A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102005053202A DE102005053202A1 (de) 2005-11-08 2005-11-08 Vorrichtung zum Vorbereiten einer Mehrschicht-Leiterplatte auf das Bohren von Kontaktierungsbohrungen

Publications (1)

Publication Number Publication Date
TW200822828A true TW200822828A (en) 2008-05-16

Family

ID=37596297

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095141600A TW200822828A (en) 2005-11-08 2006-11-10 Preparing device for boring contact bores on multi-layer conducting plate

Country Status (7)

Country Link
US (1) US20070114210A1 (de)
EP (1) EP1784071A1 (de)
JP (1) JP2007134707A (de)
KR (1) KR20070049562A (de)
CN (1) CN1984537A (de)
DE (1) DE102005053202A1 (de)
TW (1) TW200822828A (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL1031654C2 (nl) * 2006-04-21 2007-10-23 Allseas Group Sa Geleidingsinrichting, in het bijzonder voor gebruik bij het lassen.
DE102008064166A1 (de) * 2008-12-22 2010-06-24 Schmoll Maschinen Gmbh Automatisierte Werkzeugmaschine und Verfahren zum Einbringen von Referenzbohrungen in Leiterplatten
CN101697001B (zh) * 2009-01-22 2011-07-13 依利安达(广州)电子有限公司 一种检测多层印制电路板层间位置偏移的方法
CN101885078B (zh) * 2010-06-09 2011-11-30 高德（无锡）电子有限公司 使用机械钻孔机对印刷电路电池板钻圆孔和槽孔的方法
CN103037639B (zh) * 2011-09-30 2016-02-10 无锡江南计算技术研究所 Pcb基板的封装方法
CN104260147A (zh) * 2014-08-21 2015-01-07 宁波赛特信息科技发展有限公司 一种挠性线路板钻孔方法
CN104708158A (zh) * 2015-02-13 2015-06-17 佛山市中科源自动化设备有限公司 一种电路板自动焊接方法
CN105392287A (zh) * 2015-11-16 2016-03-09 景旺电子科技(龙川)有限公司 一种镭射钻孔定位方法
CN110539350B (zh) * 2019-07-25 2021-05-11 沪士电子股份有限公司 一种用于印制电路板高对准度背钻的制作方法
DE102020113134A1 (de) 2020-05-14 2021-11-18 Skybrain Vermögensverwaltungs Gmbh Bearbeitungsstation und Verfahren zur Bearbeitung von Werkstücken
CN112504183B (zh) * 2020-11-07 2022-04-19 奥士康科技股份有限公司 一种孔偏检测方法
CN114565610B (zh) * 2022-04-28 2022-07-08 惠州威尔高电子有限公司 基于计算机视觉的pcb钻孔偏移检测方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4790694A (en) * 1986-10-09 1988-12-13 Loma Park Associates Method and system for multi-layer printed circuit board pre-drill processing
US5111406A (en) * 1990-01-05 1992-05-05 Nicolet Instrument Corporation Method for determining drill target locations in a multilayer board panel
US6030154A (en) * 1998-06-19 2000-02-29 International Business Machines Corporation Minimum error algorithm/program
ATE255482T1 (de) * 1999-07-23 2003-12-15 Heidelberg Instruments Mikrotechnik Gmbh Verfahren zur erzeugung von mikrobohrungen
KR20040035673A (ko) * 2001-07-06 2004-04-29 비아시스템즈 그룹, 인코포레이티드 보드간 통신을 위한 ｐｃｂ에의 광계층 집적 시스템 및집적방법
JP2003131401A (ja) * 2001-10-26 2003-05-09 Adtec Engineeng Co Ltd 多層回路基板製造におけるマーキング装置

Also Published As

Publication number Publication date
DE102005053202A1 (de) 2007-05-10
US20070114210A1 (en) 2007-05-24
CN1984537A (zh) 2007-06-20
JP2007134707A (ja) 2007-05-31
EP1784071A1 (de) 2007-05-09
KR20070049562A (ko) 2007-05-11

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