TW200808146A - Apparatus and method for predetermined component placement to a target platform - Google Patents

Abstract

The present invention relates generally to assembly techniques. According to the present invention, the alignment and probing techniques to improve the accuracy of component placement in assembly are described. More particularly, the invention includes methods and structures to detect and improve the component placement accuracy on a target platform by incorporating alignment marks on component and reference marks on target platform under various probing techniques. A set of sensors grouped in any array to form a multiple-sensor probe can detect the deviation of displaced components in assembly.

Description

200808146 IX. Description of the invention: • [Technical field to which the invention pertains] In a broad sense, the present invention relates to assembly techniques in which alignment and probing techniques are used to improve component placement accuracy during assembly; In particular, the present invention includes a method and structure for detecting and improving component placement accuracy on a target platform by incorporating alignment marks onto the component using a plurality of detection techniques and incorporating the reference markers onto the target platform, one of which The sensory benefit of the array-shaped φ form constitutes a multi-sensor probe that can detect the offset and the offset of 70 pieces during assembly. With the described embodiments, the present invention has been applied to the placement of package components on electronic substrates in the manufacture of electrical subsystems. But the present invention is presented

There is a wider range of applications. A • [Previous Technology] Electronic components have been developed for many years. With the complexity of integrated circuits (ICs) and the increase in speed, the number of pins of components often exceeds several hundred or even thousands, and high-speed design The component is an example, which requires more power and = the pair has gradually replaced the input and output pins of the component 曰 / ^ ^ to meet the signal integrity requirements. In addition, as the formation of the if slice t system becomes possible, more and more pins must be added to _ VO to support more functions. In short, many

There is a tendency to increase the number of pins in the package component or the component of the P-mounting pin. The spacing between the adjacent pins of the device is gradually reduced, and the size of the clothing is limited. At this point, the smaller pin pitch (especially when the 200808146 pin pitch is less than 0.5mm) poses a major challenge for placing the component accurately on the target platform, such as a printed circuit board (PCB). When the component is placed on the PCB, the conventional surface mount device uses Cartesian coordinates as the reference point at the center of the target land pattern, but there is no feedback mechanism to monitor the accuracy of component placement, so the accuracy of component placement is not definite. In fact, the accuracy of component placement can be affected by defects in the package outline, deviations between the component's contact array and the ideal grid position, defects in the PCB support reference, aging of the placement equipment, and inherent tolerances. When the cumulative error is close to the pitch size of the contact array, there is a big problem in accurately placing the component on the PCB. The placement of components is often encountered on surface mount assembly lines, especially the placement of fine pitch components. For example, if the BGA component is not accurately placed on the PCB, the BGA contact array will be offset from the ideal pad pattern position, which can result in improper soldering or soldering to adjacent pads on the PCB. On the mat. Fixing these problems is both tedious and costly, especially when it comes to correcting high-cost and high-volume pins on high-density PCBs. In addition, manufacturers often use high-order, high-pin count wafers on the motherboard through sockets, which allows the user to select the appropriate speed grade component or perform a speed upgrade. However, there is currently no convenient way for the user or manufacturer to monitor whether the wafer is properly inserted into the socket or if the wafer is in good contact with the socket in the socket. As can be seen from the above description, techniques for detecting and improving component placement accuracy and detecting contact state are currently required. 200808146 SUMMARY OF THE INVENTION The present invention is broadly related to assembly techniques and describes alignment and detection techniques for placement accuracy of components. More specifically, the invention includes a method and structure for detecting and improving the accuracy of the placement of the eyepiece flats by using a plurality of detection techniques and aligning the marks on the components with reference marks on the target platform, one of which is in array form = = Sensor configuration - Multi-sensor probe, which can be used in the assembly to detect the offset of the offset. With the described embodiments, the present invention has been made to place package components on electronic substrates in the manufacture of electronic systems, but the present invention has a more usable range that can be used for accurate alignment of various articles. s, % In the embodiment, the invention is on the IC or package component (4) - group - or multi-alignment mark, as a solution. ς ^Haicheng's example package component can be packaged in plastic (such as epoxy): ceramic (such as - emulsified! S) or other materials in the integrated circuit components, strong multiple I / O contacts and The plurality of connected to the 1/0 contact member may be a multi-1C stacked component, a multi-counter stacking element, or a stack of an anisotropic conductive elastomer gentleman's structure, etc., wherein the film It is used to connect it to the outside. The set of alignment marks monitors whether the package component is approved in the field: a plurality of externally connected crystal sheets or other packaged components on the cattle or the target substrate such as the target or the 200808146 == and the components are not accurately placed, then aligned The marker can still be biased by the position of the excitation adjustment element. For the sake of simplicity, the κ: and the closure elements are referred to herein as components.

In the implementation of - (d), the alignment mark is a reference on the component. The probe can use the alignment mark to monitor the accuracy of the component at the target. The alignment mark on the 70 pieces may be on the element: 电": the conductance path of the connecting surface area of the part, as a direct pair = 1:: may also be a non-path connecting two surface areas at the bottom of the 71 pieces 'As an indirect alignment mark. Except for the outer diameter of the element, the alignment mark can also be the mark on the element J = single = the detection method used. The structure of the alignment mark can be an early Column structure 2: Each alignment mark on a piece, a reference mark can be added to the object for reference. In a specific embodiment, Hairpin:::J road board, mother board, ceramic board, bare crystal IC chip or other two for the group - or multiple reference marks placed in the predetermined sub-area of the two sets of tea test 'as the target substrate Or the component on the platform is connected to the reference mark, and the other reference mark of the 5it flat can be connected by a conductive electric path and can be connected to the target: - the ground point, or it can be simply on the target platform - surface rods, depending on the method of detection used. In the preferred embodiment, the present invention provides for accurate component placement: Γ:: solution. The probe can be a single sensor probe 乂疋-sensor array. The single sensor probe can Detects the accuracy of the placement of the components on the platform and the state of the component contact conditions. The multi-sensor probe consisting of the sensor array can utilize the alignment of the component on the - or multi-alignment mark, the probe position that has been aligned with the reference mark Adjust the offset of the offset component. = Multi-sensor probe can detect the offset of the component and feed back the information to the sigh to correct the positional deviation. The single alignment mark can correct the component's offset error. The quasi-marker is more capable of correcting the position error of the placement. 聋^ Person-type gripper, electric valley probe, optical probe or group of the scratch head 5. Resistive probe 剌 open/M amount, capacitive probe

^系Γ = The relative area of the sensor surface and the target reference overlaps A = is used to measure the W == probe, the capacitive probe and the optical probe are the mountain π wood, the sensation is on the head. The extent of the detector can be automatically determined by the size of the sensing target reference mark. In a specific embodiment, the present invention provides a method of aligning components on a target platform. In the case of the scorpion, the platform or multi-aligned marker is placed on the target and the probe is placed on the target. The area on the target platform contains the target structure. -In other words, there are _ moxibustion testers on the tan joint pattern - the alignment mark and the standard mark relative to the bottom of the component ^^ ': the pair of tea test mark material welding area „ work 3 (four), the matching method also includes Align multi-inductance on the target pattern::=:= 200808146 The effective range of the multi-sensing n, _ the position of the quasi-probe. °. That is, the relative of the element - the manufacturing of the alignment mark relative to the phase element Or the accuracy of the component packaging process =: the relationship between the quasi-marker and the contact column on the component or package. This makes the space between the entity and the drowning female j. ...丄== The method in the specific embodiment, at this time, the non-compliant component that causes the problem due to the corresponding non-ir:r of the entity, the contact_m is used for the group skirt. Because of the component in the component: Molding allows for a large tolerance, so the component produces a car =: Borrow = financial invention 'more to turn the way The point can be: • The technology provides an easy to use and traditional technology side / in some examples, the method provides a means to improve the yield, reduce and improve the placement accuracy. In addition, the financial law provides The process is compatible with the conventional clothing technology, so that the conventional equipment and the process need not be significantly modified. The invention is particularly useful for components having ultra-fine contact pitch and more than hundreds or even thousands of contacts. The present invention provides a method of monitoring the placement of components that are encapsulated with an anisotropic conductive elastomer (ACE) as an interconnect interface. For the application of 10 200808146, the method is effective and accurate for non-welding. The ball-based package assembly is assembled to the target platform or PCB. The anisotropic conductive elastomer contains = a large amount of conductive current in a certain direction and is embedded in the elastic insulating resin film, which is already in high density. And the high-pin-count test socket is used as an interconnect structure, and has been tested by IC components to provide excellent contact weight and "Southern frequency characteristics, and can be used as components and packages. Surface interconnect structure. A component or part laminated with ACE can be directly mounted on the target substrate. When a precise placement technique is achieved, a flip cover can be used to hold the components together without It is necessary to solder the component to the target substrate. This alignment technique makes it possible to assemble the ace laminated component on the electronic system. The above embodiments have one or more advantages, which will also be more in this description. DETAILED DESCRIPTION OF THE INVENTION Other various objects, features and advantages of the present invention will be apparent from the description of the accompanying drawings. Alignment and probing techniques that improve the accuracy of component placement in Group 1. More specifically, the present invention includes the use of a variety of probing techniques to bond alignment marks onto components and to incorporate reference marks onto the target. A structure and method for detecting and improving the accuracy of component placement on a flat panel. A set of sensors consisting of multiple sensor probes in an array form can detect the deviation of the displacement component during assembly. By way of example, the present invention has been applied to the placement of packaged semiconductor elements 200808146 on electronic substrates in the manufacture of electronic systems. However, the present invention has a wider range of applications, which can be used. The exact alignment of the objects. Further details of the invention can be found throughout the specification. Alignment mark, in the embodiment of the present invention, the alignment mark is on the element - the reference area enables the (four) material mark to monitor the component on the target platform, and the alignment mark can be - read conductive mark The surface area of the connecting element from the top to the bottom is guided by the surface area & Α #aligning mark; or may be another different guiding circuit k which connects the two surface area markings at the bottom of the element. The top-down guide is used as an indirect pair to the bottom of the 戎 ¥ 书 书 书 书 书 书 书 书 书 书 书 , , , , , , , 书 书 书 书 书 书 书 书 书 书 书 书 书 书 书 书 书 书 书 书 书The position of the associated bottom contact. The surface area of the guide package at the bottom can be dedicated + action point... each -4 触点 contact on the contact station array or different ._ ·, , ' divided by 70 Outside the conductive path, the alignment mark can also be determined according to the detection method used. (4)": is a single-alignment mark or - group to the dry knowledge, a common pair The target, and or orientation, needs to be adjusted to change the alignment mark. The azimuth of the material can be added to the imaginary welding m A reading and the deviation from the 卞 J knife will be obvious because the azimuth error is small and less obvious. Deviation of 70 pieces 12 200808146 Depending on the detection technique, the probe can be in direct or indirect contact with the alignment mark when the probe is used to monitor the placement of the component. If the position of the alignment mark is monitored by the electric probe, it needs to be in direct contact; if the position of the alignment probe is monitored by the capacitive probe, the material needs to be directly contacted, and the alignment mark is an electrical alignment mark. Because Μ + = , the over-aligned mark 'but' is the direct current (DC) current, and the other parent current (AC) current. If the -optical probe monitors the reflection from the alignment rod = face, then the alignment mark is the optical alignment mark. Therefore, the reflective conductive marks on the top surface of the two pieces can be considered as the configuration technique of the alignment mark as _electric = or for the horse-optical alignment mark. Use the board reference mark if\ corresponding: the target platform is added - remember your contact threshold with the contact array. Aligning the welding area of the standard on 70 pieces: 2; = standard: the reference mark on the stage and the part of the target platform are in contact with the pattern of the splicing area. The part of the pattern is the technical and manufacturing requirements. The reference mark may or may not be ^ Then:; the bottom of the direct contact. In the case where the reference mark is only a special one on the target platform: and if the alignment surface element is aligned with 椤#沾π Μ dry clothes %β, the touch on the pattern can be Select to make it match the weld zone on the flat for additional reference marks (four).松目^ 13 200808146 One of the advantages of component placement is that the placement accuracy is no longer related to the physical contour of the component, nor to the accuracy of the grid between the contact array and the component edge. . For example, if the molding process causes a small tilt in the finished package, and thus the array of contacts on the package is not completely parallel to the edge of the package (becoming a tilted package), it will be difficult to The package is correctly placed on the land pattern, especially when the package size is large and the array pitch size is small, and the package with the contact array offset relative to the ideal grid position (grid-off package) )is also like this. Conventional placement equipment uses Cartesian coordinates as a reference point in the center of the weld pattern, to place components on it, based on the assumption that the physical outline of the component is not defective, and that its contact array is accurate in the mechanical specifications of the package. Set on each edge. An example of an ideal package is shown in Figure 1A, which has a good physical profile and all package contacts are located at predetermined grid locations. Figure 1B shows an example of a slanted package in which the array of contacts is not parallel to the body outline of the package and deviates from the desired grid position as viewed from the outline of the package. Figure 1C shows a different example of a substandard package in which the contact array is not properly molded relative to the center point and deviates from the ideal grid position from the package outline. The package in Figs. 1B and 1C is physically inconsistent, so that it is difficult to assemble by conventional surface mounting methods, but the drawings are shown in an exaggerated manner for such defective systems to clearly express the concept. 14 200808146 The case is to place the off-grid element 200 in the target weld zone. Figure 2〇9" Ding----. As shown in the figure, the contact array on the component 200 has an offset amount 207 downward, and after the component is placed, the point on the component 2〇7〇 is the same as the deviation of the deviation from the target detail map. Greater than the one at the center. The addition of the occupant alignment mark to the component can significantly reduce the ringing caused by the lack of r in the package outline, and can eliminate the deviation of the contact array from the ideal grid position in the package outline to meet the specification problem: === for the element (10) The distance is. / The presence of the contour of the body or the alignment mark between the edge of the package causes the device to behave unreasonably, so it has a small: = contact array package that wants to look at the grid position, or adjacent two doors are ideal. The bare crystals and the like that were previously formed in the production; ^^ are not equally cut into the system. The structure of the structure is described as follows, and the entire specification also provides two =: will be touched two = is: a conductive circuit on the component or the position of the workpiece on the package can be set in the slave Financial (test signal can be 200808146 = surface (matching electric shock point on the target platform or reference pad can be connected to: surface), where the conductive path on the component and the matching reference on the target platform constitute - the placement of the monitoring component The object of accuracy is accurately placed on the target platform, and the matching reference pad will appear under the bottom surface of the conductive circuit (4), and the conduction current will be detected when the electric current is applied to the component surface. Table -#图rJ An example of placing the element _ on the target platform 310. The point array 309 has a plurality of external connection structures and one or more conduction circuits as alignments. On the target platform, the read package of =π302 303 The body Α contact zone pattern 308 and a set of reference pads 306, 307 are pre-manufactured. The awning is referenced, the reference 塾3〇6, 307^m and the land pattern 308 are paired with the main two τ^ in the conductive path 302. At the bottom of 303, the application for the invention Scope, should not be improperly considered to limit many variants, modifications and ^man technology can be inferred according to its inference:: as =, the piece can be soldered with the solder of the ceramic core of the bare crystal, sealed in and In ancient times, the integrated circuit in the body or plastic package, or, as the external interconnect structure, but the combination of the field elements, or the combination of the above, the ACE pancreas layer on the bundle = 0 The conductive path may be - or more than the conductive path 3 extending irregularly from the top in the element. With the conductive path, 3〇3 =: with the point 3〇4, 305 may be - a simple circular pad, - Other shapes are also applicable, such as square, rectangular, triangular, and the combination of the shapes of the ladder Li 16 200808146. In addition, the resistive probe is placed on the externally actuatable points 304, 305 to monitor the state of placement accuracy, the conductive path It can be a metal, doped semiconductor path or other detectable entity.In Figure 3, a set of reference pads 3〇6, 3〇7 are preformed on the target platform and used as a target reference to guide the placement of the components. The reference pad can be a simple circular pad, but other as a square Shapes, rectangles, triangles, trapezoids, a set of grounding points, etc., and combinations thereof are also possible shapes. The reference pads 306, 3〇7 on the target platform 310 are referred to as "reference marks," for the component ^-pair For the quasi-marker, the setting principle of the corresponding reference mark being added to the position of the reference mark on the target platform 310 is as follows: reference marks 3〇6, 3〇7 and the weld zone map on the target platform The relationship between 3(10) and the alignment mark on the component, 3〇3 and the contact array 309 are matched. The dimensions of the component are determined by the component outline, the contact array, the sighting platform, and the device precision. , mechanical aging and database simplification of the system to determine the variability of the system, and there is a large tiring 6 + one ^ 乂 乂 和 和 和 和 和 和 和 和 和 和 放置 需要 需要 需要 需要 需要 需要 需要 需要 需要 需要 需要 需要 需要 需要 需要 需要 需要 需要 需要^ ^ The size of the 叉 计 should be large enough for t = T - the initial placement of the component should be at least partially recorded in the target reference to suppress the fine day according to the placement of the database alignment or pre-draft pattern The coordinates are. In addition, the same or smaller than the reference mark can affect the accuracy of the component placement, which will be in addition to the upper and lower structures (one test point associated with the conductive path 4〇2 on the top surface of the element 17 200808146) Outside the form, the two test points 4n, 4i2 can also be at the same side as the contact array 409' as shown in FIG. At this time, two: the added line control 406, 407 is added to the target platform 41, = TM411, 412 is connected to the target platform 4. 4 2; The power and ground of the resistive probe can be sensed by the =: - externally applied points 403, 404 to detect if there is conduction in the 'and thus determine whether the component has been correctly placed in the target soldering area: thousands. The above has two test points located on the same side as the contact array. The path is called an indirect alignment path, and the contact is called an indirect pair. The number of indirect alignment paths on the right side of the same line is connected to a series of chains on the target platform, and the technique can be used to monitor the contact conditions of the series of chain members or check all the components in the one.

2 is in place. This technique is useful for electronic systems with solderless components (female ACEs as components of the interconnect interface), and indirect alignment paths for components with cold attached ACEs can be connected into a single potential chain or several shorter chain. At this point, the supply voltage and the check (4) (eg, two =) can be connected to the rider chain to monitor all the connection states in the chain. The method of aligning the mark on a component can not only detect the accuracy of the placement of the target platform, but also correct the position of the component after placement: however, the function of the alignment mark is determined by the test probe. The single test point probe (ie, the single-sensing inspection state and the interface condition, and the multi-test point 200808146, ie, the sensor probe) can detect the component placement bias. Move direction and readiness, which will be explained in the following ten. ° and Figure 5 show an example of using a single test point on the TW-S da platform 510 to monitor the target 2 5 = quasi-state. It is assumed that the component 5 包含 containing the two pairs of 仏 仏 50 502 has been aligned with the upper pattern of the target platform, wherein the splicing pattern has a corresponding set of reference marks 3 and 504, and a slave probe 52 〇 The more the supply end is recorded on the target platform 51, the dry path is formed, and the conductive path of the 5G3 is formed into a reference mark formed on the alignment marks 5〇2 to 510. On 504. Down to the first, in order to prevent the two tea test marks 503, 504 from forming a float during the test, the two reference marks 503, 504 should be connected to an inner plane 507' on the target platform 51 (). A surface contact 5〇5 is connected to a known reference voltage, or the two reference marks 5Q3, 5〇4 ▲ may be connected internally. After placing the component, the probe can be utilized to exemplify the connection, if the supply end of the probe 52A is applied to the top surface of the alignment 501i 501, and the ground 515 is applied to the alignment mark 50. ^ The top surface, and assume that if the component 5 is on the target platform. The above-mentioned standard has a closed current loop to detect a probe from the probe & test end 521, and through the alignment mark 5〇1, reference mark 5〇3, internal, 'spring or plane 507 and Returning to reference mark 504 and alignment mark 502, and most, winter (10)_ to the grounding current 515 of the conduction current. Although the above description is made with two pairs of marks, if the orientation error of the component placement is not likely, a single alignment mark is sufficient. 200808146 - Funeral ί = If the reference pad 5G3, 504 is connected to the inner plane, and 503^50^ or ground 5〇8 is applied to the surface contact 5〇5, then the reference pad / will have the reference power grounded. Since the test end 52] is finely applied to the top surface of the alignment mark on the component 500, and the second grounding system is connected to the 'starter', then the (four) loop is passed through the alignment mark, the corresponding reference mark, and (4) Grounding, and then formed on the ground of the wire. As shown in Fig. 5, a test probe 520 can include a resistor crying 522, a two-emitting diode cut, and a sound buzzer or galvanometer to prevent it from being placed. Resistor H 5 2 2 is used to limit flow through the probe and alignment

Note: = current, LED 523 is used to provide a visible signal to J Γ Γ Γ 正确 正确 ' 声音 声音 声音 声音 声音 声音 524 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 the amount. The probe can be placed in the immersive position for monitoring the placement state, and can also be used as a four-point probe for improving component placement accuracy as shown in Figure 6. The multi-detection point probe is used to correct the component placement. In the example, a four-point resistive probe having a measurement of R, H, Β, c, and d is used. In the figure, the circular reference mark 6G2 is shown by a large dotted circle, and the ^ mark_ is shown by a large solid circle. To make the drawing simpler, this example = the size of the alignment mark 6G1 is the same as the size of the reference mark 6 () 2, and the four test points of the probe used in the placement match the condition of the reference 602. If the square is referenced, all four points on the head can match the four corners of the square after the head position is aligned with the reference mark. ^ ^ 56 households manually check component placement accuracy and contact conditions. 20 200808146 = Deviation of component placement' First all test points on the probe, C and D shall be moved to or near the edge of the target reference mark. Align the position of the probe according to the position of the probe. Next, the information recorded in the component library is moved and placed on the seat of the target weld zone pattern. If the component placement is offset, 6±01 will only partially detect this local overlap with the target reference mark_22 probe on the target platform. For example, the mark 6 is connected to the second angle two:::: The pilot C is in the lower left corner with the current aligned to the ground tea test mark 6〇2, and there is no test object 4 in the test. This side runs A and Bu in _ It is not conductive on the external area. Using this test result = the process will continue, and the position of the special point contact on the u material will stop, and the component can be accurately positioned. Long ί ^ ^ Ι 601 after the placement makes two test points (such as the position of the 2 left conduction 2_ conduction current, then the alignment mark and the meta-thorac == straight? It reaches all four test points can detect the current two m her head The reference mark and the alignment mark are all aligned, and the yak is accurately placed, and the pick-up head in which the equipment towel is placed can be independently adjusted. The k-head and the 70-piece are adjusted at the beginning of each-component adjustment test probe. To align the target 21 200808146 The reference mark is to ensure that there is no element between the accurate sound and the reference mark in this special case, the probe reference mark is reached, wherein the probe two: =, the offset of the hoe contact can pass the monitoring conductive test point The method of judging; the direction of the current is not detected at the midpoint of the tea. (3) °5 Type 4® Two seconds of eucalyptus position, the probe can be used to check the tea, this is the probe alignment step 1. Multi-test point probe is better on the monitoring component placement. 'Single test point resistive probe 匕 = := test _, object detection and provide offset test 1:::=20%:-to Test the probe. If the test point array 2 == mark Dimensions, more than one, and the decision of the New Mosquito group can be in the form of a class of money. = = is determined to be able to pass the lowered probe (assuming it is a resistive two heads) to make contact with the tea test mark, and The electric test is applied to the array 7〇1 to measure all the test points in order to observe which test points are electrically conductive. All the conductive test points on the right are internal test points in the array, then the internal test point 7G2 for detecting current can be selected to facilitate Perform the component placement, the test point 7〇3 in the array will be ignored in the current component placement, and the internal test point in the array to be activated for component position adjustment is the working test point 7〇2 And the test point that is ignored in the position adjustment is the invalid test point 703. Since the center position of the multi-test point probe is known from the probe structure, 22 200808146 = and the work point is the heavy position to make the multi-test point probe The heart is for the rest of the head. The XU is simpler. 'This can be achieved by locating the new position until all the internal work is ruined, and the new work is done in the central area of the test point. new Position i, the center of the test probe mark is aligned, the edge of the dice from, 3丨4, /, 曰知苍考. The outer range of the test point matches the reference mark guide. (4) The rib is at the edge of the multi-column, At this time, the size of the hoe is too small, and the position is not too small with the reference header size, that is, less than the size of the moxibustion moxibustion to remove the μ 疋 目 才 ^ ^ ^ 目 目 目 目 目 目 目 目 目 目 目 目 目 目 目 目 目 目 目 目 目 目 目 目The component position adjustment caused by (4) in the quasi-reference mark is not = the range of the test probe is compatible or larger than the reference mark. If the probe position is not aligned with the reference mark, the center of the working test point in the column should be adjusted. The center of the quasi-reference mark. A set of non-synchronous SR flash locks can be placed on the electronics of the test probe." Each test point on the probe corresponds to a sr flash lock:. For the sub-groups of the test points on the building that are activated to monitor component placement, the ::RP-1 lock subgroup corresponds to ' to indicate the working position of each component placement. The entire set of SR ask locks is = ordered at the beginning of each component placement. In addition, the writable lock can also be used to execute the S R flash lock. △ Figure 8 shows the method of using the set of flash locks to align the center of the test probe. In order to place the multi-test point resistive probe Dong: ^ test mark 'after the contact reference mark, (4) the test point guide should be 'set the SR _ device is set; if the corresponding test point is detected as no power 200808146 flow' then the SR latch The lock is reset all the rows on the latch (4) The number 4 is used to scan the set of SR sarcophagi, to identify the most detected "1" of the arranging column ^ the most measured rows and columns The exchange is used to find the medium-to-point with the most η, such as 仏. With the temporary crying can be m s § § tens, the column counter, the comparator and the group multiplexer are the same. :Over =; = lose eight The scope of the invention. By having the highest number

The number of rows and the number of columns are compared. (4) The amount of displacement can be determined, and the probe can thus be aligned with the center of the test mark. In the ^ position: lock =, zero, to record the fine on the probe: the SR^ locker set at this stage contains information about the set of working test points aligned with the reference mark. In order to align the components, another part of the probe can be added to the electronic part of the probe to track the instantaneous V-electricity of all test points when each probe is changed to a new position. The contents of the transparent flash lock are recorded. The overlap between the tag marks 'This content will be compared to the contents of the SR flash locker. If the contents of the two groups match, the component is judged to be on the exact land pattern. Figure 9 is an illustration of the use of two sets of latches to obtain the direction and displacement of the offset element. The first bit in the binary pair is the condition of the set of transparent locks indicating the overlap between the alignment mark and the reference mark; the second bit in the binary is the set of SR latches The condition, which points to the location of the work test point.曰 24 200808146 The error is calculated by comparing the values of the squares of the components of the two sets of the locks. The value of the fly is a value of the carry-pair. Improper mm m. For the sake of simpler explanation, it is assumed that the alignment mark is one bit earlier than the first order, and the size of the test is the same. The first < t table misalignment mark overlaps the reference mark, ",, ^ ^ in the first digit of the figure, the position of the "U" point in Figure 9. Through the reference area (available through simple AND logic, ^ - the range of the test inside the right-hand shot), all the S "01" contained in the Maibga* 3 column, and all the included in the ^ "G1", so the placement device knows that θ is offset by three digits on the right side and one thinner is known to the component. 1~+ can correctly reposition the XOR logic to two positions. The scope of the invention. The 读 image is read as an example, which does not represent the circumference. It can expand the adjustment of the offset component. The #Wu H domain header is sufficient for A (ie, if the probe is supported; normal work. Three sets of two pairs of 匕 mark work can be used in the probe electronic components - the first work will be L / out of the effective sub-range of the working test point, then the alignment mask, two:: small:: mark 'and the third group of flashes The lock is regarded as the effective value of the offset displacement of the workpiece. 〇1,, Yuan Wai. = The third digit in the 〇 〇 指 指 指 指 + + “ “ “ “ 111" million "mi" J卞 consumes W' and the two digits of the two digits are "1". The number of the oblique digits is indicated to be used for the smaller alignment 栌-二二=标者Μ°determined by the reference mark size The range of "measurement" is used to detect the alignment mark pair 25 200808146 quasi-k. The target that has been aligned is the sub-range of the working test point. Find the overlapping area between Ltrt in the third. The three-bit array "Gil" indicates alignment 2, ‘: the area where the second test mark is aligned. In the right side of the sub-norm of the target of Fig. 10, there are two columns containing "011", "ln" = two rows containing "GU", so the component is displaced upwards by two positions and then the pair = two positions can still be completely aligned The mark is aligned with the reference mark, even if the alignment is smaller than the reference mark. The actual sub-range of the jade test points associated with the smaller alignment marks can be hunted by the diameter information of the alignment marks in the database or by using one of the image sensors associated with the device. The mark is straight (four) way to know. Μ里对 Figure 11 shows an illustration of the use of a general test probe to correct the position of the offset element. In this example, the alignment mark 1101 reflecting the position of the element is smaller than the McCaw mark 11G2. Before starting to place each component, the range of test points on the probe should be predetermined by moving the probe to the top of the test mark 11〇2 with no components present and applying voltage to all test points. Determined by knowing the conductive test points. Since the center of the test probe is known, it is possible to select the set of test points for the test: align the probe with the center of the reference mark 11〇2 and bring the outermost test point closer to the boundary of the reference mark 1102. In Figure η, the test on the probe is not actuated, 1104 is represented by a dashed circle, and the working test point 11〇3 is represented by a solid circle and a solid black dot. By using an image sensor inside the placement device to measure the diameter of the alignment mark, or refer to the diameter information of the 26 200808146 alignment mark recorded in the placement database, to be used to make the work test point smaller The sub-ranges that have been aligned with the reference mark can be dynamically learned. After the initial component is placed, the alignment on the component is in or out of the working test point range defined by the reference mark 11G2 = assuming that the initial component is placed with an offset, and only one angle is assumed The working test point 1105 (shown as a solid black dot in Figure n) is used to check the flow, and the placement device can aim the right side of the working test point subgroup with the right and 7 moving alignment marks, the direct riding standard mark and the working test point. 1106 The entire subgroup (shown by the large dashed circle in the center of Figure 11) matches. Therefore, even if the mark is smaller than the reference mark, the component can be accurately aligned with the target weld. Conversely, if the area of the alignment mark is much larger than the area of the reference mark, the accuracy of placement will be reduced because the range of working test points defined by the small reference mark is quite limited. Since sufficient feedback is not available to indicate that the center of the large alignment mark on the component has been moved and the limited electrical work test spot is made, the component adjustment processing cannot continue to enter the lamp. For electricity (4) (4), the effect of aligning the mark is similar to that of using a single-point probe, where the area covered by the single-test point probe is very narrow similar to the effect of a smaller test probe or a smaller reference mark. However, the smaller tea test mark can detect higher placement accuracy when using a single-test point probe unless the reference mark is too small to be detected. After the initial placement, the component is placed outside of the reference mark, and no active current is detected at any of the working test points. This indicates that the placement of the component 27 200808146 is incorrect or underestimates the worst case placement of the component. The offset causes the size marker to go outside the reference mark that is too small, so incorrect system settings or operational errors can be easily monitored. To improve the durability of the test probe and ensure good contact between the alignment mark and the reference mark, the anisotropic conductive elastomer (ACE) i2〇5 can be layered on the surface of the general resistive probe 12〇〇. The interconnection interface is shown in the figure. In the figure, each test point is composed of a conductive tube 1202 inside the probe 1200, but the figure is only an example and should not be construed as limiting the scope of the invention. For example, the probe shown in the figure has a circular shape of a rectangle, a triangle, a trapezoid, another irregular shape, and other shapes. In addition, although the test points are shown in a regular array in the figure, the real γ Bu,, —, τ material (4) towel points can be placed in any configuration according to the application. In order to solve the azimuth error of the component placement, the components are combined with the two oblique car light #. Heavy, & 1, 1,引脚 Pin &_&Γ. It is easier to have a direction error in the case of a large contact array or a super-fine contact pin. ^^1L does not combine two alignments on several pieces. Mark to correct component placement, _:L ΰ falsely placed at initial placement The elements are along the same time. In the figure: 'Sub: the size of the alignment mark and the size of the reference mark 1302 \ Line 81 represents the two alignment marks 1301, 1302 on the element, and is connected to the two ^ for Qianshan , ^ 郢 禚 禚 5 already] 30], 】 】 】 】 】 】 】 】 】 】 】 】 】 】 】 】 】 】 】 】 】 】 】 】 】 】 】 】 】 】 】 】 】 】 】 】 】 】 】 】 】 】 】 】 】 】 】 】 】 God is bald with a large dashed circle, through an imaginary and not 4 target orientation, the acute angle of the solid line and the dotted line 28 200808146 is the azimuth error after the initial placement of f. If there is no displacement error, then the center of the element 1300 is forked, and it is assumed that the two test probes are f [to the placement of the component containing the two alignment marks, although the alignment mark works on the mother detection day. It is sufficient to use one of the test points and the center of the test probe as long as one is used. The probe must be aligned with the target reference mark before placing the component. For the private resistance type #木, the alignment work is performed by bringing the probe into contact with the reference mark. It has been determined that the working test point is relative to the range of the reference mark and the coordinate spoon. Next, as the probe moves up, the component is picked up and placed at the target weld pattern. If the component placement has no azimuth error, then the two alignment marks 130b 1302 will be exactly at the top of the reference mark 1303, 1304 $top and match the range of the working test point with m-bit error: 'then on the probe' - some of the guard test points will In the range of the alignment mark two = no turn-on conduction. If the component pick-up head in the component is adjusted at the rr angular position of the assembly, the direction of the conductive state of the working test point is monitored, that is, the current is not detected by the component or the alignment mark. Rotate on one side. In Figure U, the two alignment marks 13〇1, 13(10) on the component = the lower position. If the counterclockwise azimuth error occurs after the component is placed, the detection guide for the upper detection is tilted on the left hand side, and the test point 1305 is used to test the conductive test point at the lower part of the test.

Will tilt on the right hand side. By rotating the component from the side of the work_A to the side where no current is detected, that is, along the second: the azimuth error of the piece can be corrected. However, if the current sensed that the test points appear on the same side during the two probes in 2008 2008146, if both are on the left hand side then the displacement block difference has occurred and the component should be displaced to the displacement error. Also / alignment technology can be adapted to a variety of application needs. For example, if the placement system itself is skewed such that the placement error of one direction is larger than that of the other direction, a rectangular reference mark can be selected, and the long side of the rectangular reference mark corresponds to a direction with a larger offset, wherein The probe tip is better than the reference mark size to make it better to align the probe and automatically determine the size of the work test point on the probe. The size of the transfer mark is greater than or better than the alignment mark size. s Resistive detection requiring direct contact may cause soldering in the target land pattern as it is required to move the placed component on the target platform. This is not the case for components with ACE as the interconnect interface. The XI components laminated with the ACE interconnect interface also have good contact with the land pattern on the target platform.

To avoid the possible adverse effects of solder contamination, the pad pattern on the PCB can also be laminated with a thin layer of solder on the surface of the pad. This is similar to the solder ball material on the package during pCB fabrication. Then, the solder paste printing step of the surface adhesion assembly = can be omitted, and thus there is no solder paste contamination. , T The above-mentioned upper and lower alignment mark design and indirect electrical alignment path can be simultaneously used on one component, wherein the upper and lower alignment mark design can improve the placement accuracy, and the indirect alignment path can be connected in series to monitor The contact state of all components in the chain is shown in Figure 14. This joint design is especially useful for assembling components that are stacked with an ACE interconnect structure into an electronic system. 30 30 200808146 Head alignment design Electrical alignment can also be achieved by using a non-contact method. At this time, the resistive probe directly measures the on/off resistance at the contact point, and a capacitive probe is used for non-contact. The method aligns the components. Package =5 shows Li0n Presi〇n 〇f st·Paul, an example of a capacitive sensor made by Minnes. In order to improve measurement accuracy, the electric field from Sensing Jay 1502 must be limited to the surface of the sensor and the space of the reference target. A separate conductor maintains the same private voltage as the sensor itself. The conductor is used as a guard around the side and rear of the sensor: when a parent flow signal is applied to the sensor, a discrete circuit is The protector applies exactly the same excitation voltage; there is no electric field between them because there is no = pressure difference between the senser and the protector. In addition to the sensor, any other conductors beside or behind the capacitive head 1501 form a field with a protective body (not a sense, port). Only the unprotected front end of the sensor forms an electric field of $target. And the electric field generated by the sensor is the size and shape of the cast / emperor + σ and the circular sensor can add a cylinder to a reference target: in the capacitive sensor of Li〇n Presion, The cylindrical electric field can be extended by up to 30% at an effective range of 4 G% of the sensor diameter. Since the parent ml L is applied to the surface of the sensor, the current flows through the shape of the salt and the target, and the size of the flow depends on the capacitance between the sensor and the target reference. The size of the surfaces and the degree of overlap are determined. If the sensor is completely aligned with the tea test target, the capacitance formed in the gap is the largest, and the AC current is the most 31 200808146. If the detector is completely outside the reference target, there is no surface area. Irrelevant 'as long as it is not within the sensor range next to the reference target. As shown in Figure 16, a set of protected capacitive sensors _ can be composed - an array - a multi-sensor capacitive type for non-contact electrical detection: The controller in 1^1 can also be selectively activated according to the application requirements; 2-f and: Figure 16 is not a probe for a nine-sensors, but if only the sensing at the four corners of the slave is activated When used for placement detection, it becomes a capacitive probe for a four-sensor. ... ☆ f Detecting the alignment, the exact electricity detected by each sensor on the probe: not the main problem 'because the capacitive sensor is not used in the alignment application == the exact spacing between the bodies, so accurate The capacitance reading is not necessarily the 'relative' of the relative capacitance of the overlap between the #head surface and the target reference area. If there is no external guidance ^ = _ interference relative capacitance measurement, multi-sensor capacitance type: 7 The effective range of the measurement accuracy of the Dong is greater than the single-sensor range because all the effective sensors on the eucalyptus wood are Communicate and excite, and if the head element is fully aligned with the reference target, all the feelings at this time;::: fruit sense;, = two if there is misalignment, the effective sensor is in the probe detection area ^ Mai Kao target The overlapped portion has the maximum on current, while the reference target::: the effective sensor portion has the minimum on current. By the relative magnitude of the AC current in the array of political sensors, the direction of the offset can be adjusted by aligning the component alignment marks or pieces under 200808146. In the process, : or component contact. The target and capacitive sensors are typically calibrated relative to a grounded target. Head: The external body of the body is electrically connected to the ground to improve "accurate two needs to be properly grounded. Without proper grounding, it will reduce the capacitance between the probe and the ground, such as the component pick-up head. ^妾,= Under, the large capacitor will eventually short-circuit the target reference to the ground. It is beneficial to connect the reference mark on the second floor to the ground plane or connect the = to the local ground plane, but it is not necessary. The ratio of the capacitance to the capacitance of the target to the sensor is large enough to be =: one: in the case of series connection, the capacitance difference of the ratio exceeds 1%. The difference between the capacitance measurement is less than 10%. When aligning the S piece, only the component of the component is related. The surface area of the alignment mark on the top of the component determines = 2 senses the measured capacitance value, and the day shirt is like the Osaki test: :::: The top-to-bottom conduction path acts as an electrical alignment mark, but the top: the direct alignment between the sub-mark and the contact array at the bottom of the component = matches the reference mark and the target weld pattern on the target platform. The mosquito surface has been aligned with the reference mark, then under h The purpose of the alignment mark alignment can be performed by moving the alignment mark on the capacitive probe and detecting all active sensors above the alignment mark 33 200808146 to a point where the minimum (four) phase (four) flow is exceeded. After the alignment marks are aligned with the probe, the aligned elements can be lowered and placed exactly on the target land pattern. And the probe detection (such as capacitance detection) to align the probe with the target reference ^ alignment mark alignment probe can be done independently, so as long as the probe is large enough to cover the alignment mark on the component (4) ^ n size relationship is not In the case of contact detection conditions - in addition to the non-contact detection, the flaws with large alignment marks can still be accurately aligned on the smaller reference marks. , time shot: can also be used to monitor the accuracy of the stacked wafer stack, this (four): to the bottom can be inserted - conduction path as electricity: ions;: top to bottom can be set to a conductive path, and get sub / Master, diffusion or other methods are formed. 17, shows a dry component stack using electrical alignment techniques to monitor the stack of components: 'i: several variants' to illustrate application examples in different situations. The accuracy of the piece: M: can be obtained by directly aligning the top and bottom elements of the mark with the aligning/aligning elements of the stack. If the ground reference point is connected to the cut surface from = 礼#, the ground-surface-monitoring path is generated. Alternatively, it is also possible to connect the leads to be stacked in the support surface for the probe to monitor the top of the alignment mark on the stacking element: - at this time, the small circle represents the other stack 4 elements or support surface 34 200808146 Contact pin for contact. Two electric pairs = two other objects aligned with the two objects, four angles: 1 ^ = the array of benefits combined with the array of the first field (four) for the reference target combined into the two objects 'rib monitoring pair Quasi-standard. The four are referenced by four reference marks, which can also be joined together to form the following::::, body=four sensors can be measured by contact measurement—head or non-recumbent square—(iv) capacitive , , · · The first = set with a similar square red. False ^ ― Object is deviated to the lower left :: Two Alignment on the left side of the object _ the range of the sensor array and the outside of the reference array. If it is assumed that the object is shifted to the right hand side, ―, buckle 7. But on the object of the object, the reference pole zone 2: the lower right sensor will then fall in the second part of the test, crying still iron in the shackles: shape C, D) 'at this time two two two two two During the test, the four alignment sensors can be moved about two = two objects 'the two objects are aligned. In the dry circumference of the '圯', and finally &β ^ Ψ If the alignment of the component of the page is highly reflective, then the first sight of the number of thousands of dollars on the reference mark 19, for J = ^The cutting head is used for (4) alignment. As shown in the figure, it can also be a transparent optical path 35 200808146 1901 which allows the laser beam to pass through the following reference mark and be reflected back from the reference mark 5 . The reflective surface marks on the top of the component or the optical path on the component can be considered as light alignment marks. In light detection, there is no need to ground the alignment mark or optical path on the component or ground the reference mark on the target platform. However, the alignment of the top 彳 indicates the spatial relationship between a and the contact array at the bottom of the component.

This matches the spatial relationship between the Cang test mark and the associated land pattern on the target platform, which is the same as other detection techniques. Figure 2A shows an array of detectors or photodiodes that are used as non-contact probed multi-sensor optical probes. The sensors in the array can be selectively aggregated according to resolution requirements. For example, the target of the sixteen sensor is shown, but if the boundary of the reflected beam is out of focus and slightly pasted 'or if the size of the reflected beam is quite large, then the tenth (four) on the optical probe Into four groups, to form a four-sensor light-drying wood, eight reset sensor operation can be achieved by resetting the input signal to the probe electronics. In the other-display money ^ = first beam adjustment and focus, then only need to select the four center of the probe center 2 target sensor to increase the total range of sixteen sensors for f As an effective ❹丄: Add the search range of the beam.曰-type probe, / 耻 成 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - The weight between the surface of the substate and the target reference is 36 200808146. In the case of an optical probe, a photocurrent is detected at each photodetector, which current represents the position of the reflected beam. When using optical alignment, the probe position must be aligned with the center of the reference mark on the target platform at the beginning of component placement. In optical alignment, the reference mark can be a simple reflective pad, and the diameter of the incident beam preferably matches the size of the reference mark. Otherwise, whether the size of the incident laser beam is too large or the size of the mark is too large, it will be generated. Uncertainty. On the detector side, the incoming beam should be properly focused to ensure it is within the range of the photodetector. After aligning the probe to the center of the reference mark, move the component into and place it at the weld pattern. Next, align the position of the alignment mark with the position of the probe. For non-contact detection, the final accuracy of component placement is determined by a two-stage indirect alignment method. According to the optical collimation method of the beam, the relative sizes of the alignment marks and the reference marks are not as important as in the case of resistance detection. Figure 21 shows an example of an optical pickup head that includes a probe with four photodetectors 2001 and associated I/V amplifiers for detecting offset component offsets. Each I/V amplifier includes a current to voltage converter and a voltage amplifier. As light is incident on the probe, the photodetector produces a current that is then amplified by the I/V amplifier. The figure also shows a circular beam 2002 reflected from the target reference; when the component is fully aligned with the reference target, the reflected beam will be at the center of the optical pickup. In Figure 21, the optical pickup produces four different voltages VA, VB, VC, and VD. The voltage outputs of the I/V amplifiers can be compared by a set of comparators, with each I/V amplifier being The output voltage is compared with a predetermined threshold voltage to determine the above adjustment direction, wherein the comparator detects a high output 37 200808146 ^pressure 'generation means that there is an overlap area between the probe and the target reference, and the comparison is crying, then the low output voltage' represents the corresponding The area is not yet aligned, by shifting the yuan::=: the height of the high-measurement input (four) to a relatively low-end package! The position, misalignment can be corrected. If and crying: = ^ over _ value potential (ντ), then there is no relevant anti-skin heart 2 22 =? \ component completely misaligned or optical probing threshold value of money potential to reach pre-Φ ^ 1IL then For accurate alignment on the target platform. The following procedure for improving component placement accuracy using alignment techniques will be briefly described as 'Place a. When placing components in the season', some relevant information is first entered into the (4) library of the system. This information is useful in placement automation, such as soldering. The coordinates of the center of the pattern center or the coordinates of the soldering area of the target platform, the coordinates of the probe, the probe structure, and the components to be placed, indicate the size of the §. b. Load the target platform to the assembly device. At this time, use the $. point on the target platform as the origin to match the origin of the coordinate system in the database. 'The probe can be a single sensor probe for monitoring placement accuracy, or a multi-sensor probe for offset. In order to correct the offset of the mouse, the probe must be placed in the target platform to align the target reference mark. The probe can be a resistive probe that measures the probe sensor through direct alignment. Mark to reference 200808146 tc turn on or not. The probe can also be a capacitive probe that utilizes the degree of overlap between the non-detected probe and the target reference. In addition, the pair is the photon-type pole' degree of light alignment between the measuring probe and the target reference. ^When the wood i is moved to the coordinates of the reference mark recorded by the grazing library, adjust the position of the probe until all the senses of the detected current are crying around the center of the probe, so that the probe can be aligned. For direct resistance probes, the probe must be lowered to two ==;.f: non-direct contact with the capacitive probe, the probe needs to be optically "cold object in the range of its electric field range; for reference direct protection. , j, to be tuned to the same degree, so that the beam matching target for the probe on the probe will be based on the internal sense of the material , current, H 5 has to measure 1 to use the correct adjustment The center of the sensor = the center of the sensor can be automatically α ^ quasi-marked when the center of the 1 = and the circumference is the position of the pair on the component to be aligned m, 'position and target. Multi-sensor probe Can accurately set the feedback mechanism for the 'single-sensing probe can only detect the sun and the secret picking components, and put it on the target weld zone pattern, hold the 詈:: according to the coordinates of the center of the target weld zone pattern or Reference mark e e adjustment element pickup head, head stop, which is adjusted The direction of the knot until the position of the component alignment mark is aligned so that more work monitors detect the direction of current 39 200808146. When the alignment mark is on the probe and all working sensors are able to detect their presence, The quasi-work is completed. Since the spatial relationship between the reference mark and the pattern of the land on the target platform can be pre-manufactured to match the relationship between the component alignment mark and the contact array, the component can be accurately aligned with the target land. Patterns. When this alignment technique is used, 'some slightly out-of-spec components can still be used in assembly. f. For components with embedded in-line alignment paths, all indirect alignment paths can be connected as chains. To form a series of aligned chains or a plurality of shorter alignment chains. When the entire system is used, the alignment chain can be used to detect the connection state of all components in the chain. The above sequence of steps illustrates the method of the present invention. In an embodiment, the sequence can be added in steps, one or more steps removed, or one or more steps appear in another different program, so other The method embodiments are not limited to the scope of the patent application scope of the present application. This alignment technique is not limited to the assembly of components placed on a PCB, and can be used in various applications, such as chip packaging. Monitoring, at this time, the wafer to be mounted on the substrate is regarded as a component, and the substrate of the package is regarded as a target platform. This alignment mark and detection technology can be applied to a multi-package stack, a bare crystal stack, and more The wafer carrier module component, the module component, the package card component, the motherboard component, etc. Many variations, modifications, or alternatives to the like can be deduced from those skilled in the art. 40 200808146 [Simplified Schematic] FIG. 1A is an ideal package An example of a tilted package; the figure is a diagram of a substandard package with a contact array offset from the grid, with the V4:= placement of the component on the land pattern shifted by the same offset The amount of the pattern of the splicing area is shown in FIG. 3 as an explanatory diagram of the component having the conductive path of the set being placed on the flat hall, and the gentleman in the bean is not the case and the clock, and has two Matching weld zone map W ' Μ check placement accuracy and contact conditions; gas::::^ different alignment mark settings 'all of which can be measured « on the same side, and the alignment marks are A simplified diagram of the indirect alignment path and the indirect alignment mark; ... Figure 5 shows an illustration of an example of using a single-detection probe to check placement accuracy and component contact conditions; Figure 6 is a 7F test using a four-point probe An illustration of an example of the placement displacement of a component; # Figure 7 曰 不 - 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由The process is determined; Figure 8 is not the use of the group SR_, which is used to track the position of the working test point, and aligns the center of the test probe with the center of the target reference mark, where the set of SR flash locks The device can be replaced by a set of latches with an actuation function write 41 200808146. The square L9:: is the use of the T1 lock, which is used to determine the direction and displacement of the offset element, and its towel status is shown in the _ binary only the number of latch latches indicating alignment marks and references The tongue can stand up, and the r-spoon can be added. The overlap between the two: the grievances are not shown in the second digit. The second digit of the second digit indicates the position of the working test point; ,, ',, Figure 10 shows the three groups of locks. Use, it is used to make a small

t is the t-reference mark, where the third bit in the bit number is not, and the effective range of the working test point is aligned with a smaller test point; Figure 11 is not the correct offset component. Graphical description of the general test probe 'where the size of the alignment mark on the component is smaller than the size of the reference mark; Figure 12 is a simplified test on which a test probe is laminated with an anisotropic conductive elastomer (ACE) as an interconnect interface. The elastomer is used to improve the contact conditions between the test and the alignment, such as between the test points and the reference mark; FIG. 13 is to combine the two alignment marks on the component to correct the orientation in the component placement. Figure 14 is a simplified diagram of a series-aligned chain on a target platform; Figure 15 is a simplified diagram of a capacitive sensor that uses a shield to focus the electric field of the sensor; Figure 16 A simplified diagram of a set of capacitive sensors that form an array to form a multi-sensor capacitive probe for contactless electrical alignment; Figure 17A shows an example of using an electric field alignment technique to monitor component stacking Figure; 42 200808146 Figure 18 A different application of electrical alignment technology, which is used to align objects with four senses and alignment marks on the second object of _ note; monthly office> The transparent optical path can be used as a light gentleman inlet, 隹, and a matching reflective pad combination on the target can be used to improve the accuracy of component placement; Photodetector array probe; and 'simplified diagram of forming a multi-detector optical pattern for component alignment, the optical configuration and having four: photodetector and four I/v amplifiers To adjust the offset element offset. [Main component symbol description 207 deviation amount 209 contact array 301 package 303 conductive path 305 action point 3 0 7 reference art 310 target platform 400 component 4〇3 action point

200 offset grid element 208 target land pattern 300 element 302 conductive path 304 work point 306 reference pad 308 tandem pattern 309 contact array 402 conductive path 43

200808146 404 operative point 407 wire diameter 410 target platform 412 test point 500 element 502 alignment mark 503 reference mark / pad 520 probe 507 inner plane 508 reference voltage or ground 515 ground terminal 522 resistor 523 light emitting diode 602 circular reference Mark 701 Test Point Array 702 Internal Test Point 1101 Alignment Mark 1104 Test Point 1105 Work Test Point 1205 Anisotropic Conductive Elastomer 1202 Conductive Tube 1301 Alignment Mark 1303 Reference Mark 1305 Working Test Point 406 Wire Diameter 409 Contact Array 411 Test Point 408 Target land pattern 501 Alignment mark 510 Target platform 504 Reference mark/pad 521 Supply/test end 505 Surface contact 510 Target platform 520 Probe 524 Sound buzzer / ammeter 601 Circular alignment mark 700 Reference mark 703 Test point 1102 reference mark 1103 work test point 1106 work test point 1200 resistive probe 1300 element 1302 alignment mark 1304 reference mark 1307 work test point 44 200808146 1501 capacitive probe 1600 capacitive probe 1901 transparent optical path 2001 light detector 1502 sense Detector 1601 sensor 2002 round beam

45

Claims (1)

200808146 X. Patent Application Scope 1. A system for assembling one or more components onto one or more target platforms. The system includes a set of alignment marks on an element comprising a contact area, the set of pairs The quasi-label includes at least one of a plurality of alignment marks, wherein the plurality of alignment marks are selected from the group consisting of: ^ a conductive path for conducting a current in one region of the element to another region, and Detecting the position of the component on the target platform; no light detection region can receive and convert an incident light into a current for conducting the current through a current path to another region of the component = a light detection a region capable of receiving and converting an incident light as a current for conducting the current through a current path to a region of the component to convert the current into an optical signal in the light emitting region; an optical transmission region, Another optical transmission region for connecting the component through an optical path; a private circuit for transmitting signals from a group of regions of the component to another set of regions of the component And used to obtain a position displacement amount and a direction error of the component placed on the target platform; a geometric mark on the surface of the component is used for a non-contact alignment operation to assist in detecting the The positional accuracy of the component placement of the target platform; or the multi-geometric mark on the surface of the component to assist in detecting the positional accuracy and direction error of the component placement on the target; wherein the component is on the component The set of alignment marks is placed at a predetermined spatial position relative to the contact area of the element 46 200808146. Declaring the system described in item 1 of the patent scope for the system on the one or one or one multi-target platform, the t-area is the evening zone to the domain, and the other zone is a second edge zone, - The edge zone is a system on the stage for powering m pieces as described in the patent specification (4), wherein the component is selected from the following ^ and one or any combination. · An integrated circuit component, Zhuangkou* ι Through the packaged wafer, a crystallization of the wafer ^: ~ Τ, a bare die 'a film of the integrated circuit component layer is abundant - anisotropic conductive thin 4-Γ multi = 4 fan _ item To assemble a multi-component platform or a combination of 5: a substrate, an m-printing-road board, a base of a stacked wafer or a multi-wafer carrier. One of the closure bodies = the system for assembling the ❹ ride to the column, as described in item 1 of the scope of the patent application, wherein the set of geometric markers is selected from the group 'below' ', 〉, or any Combination: round, square, rectangular, two-form, trapezoidal or a set of points. A system for assembling a - or multi-component to: or a multi-target platform as described in claim 1 of the patent application, further comprising a group reference mark, the second and the group alignment mark being used together to align the element To the target platform, the group: the test includes at least one of a plurality of reference marks, the plurality of reference h § has been selected from: a reference pad, located on a surface of the target platform, 47 200808146 current Conducting to an inner diameter of the target platform; a tea test pad on a surface of the target platform for conducting a current to an inner diameter of the target platform; a geometric mark on the target platform For use in a non-contact alignment operation; or the contact point 'is located within a component land pattern on the target platform; wherein the set of alignment marks is spatially closed to the contact area of the component system. The reference numeral has been matched with respect to a spatial relationship of the target welding pattern of one of the target platforms. 7. The system for assembling one or more components to one or more target platforms as described in the scope of the patent application, further comprising a single reference mark for assisting placement of the edge component on the target platform The detection of spatial accuracy. 8_如申> The system for assembling one or more components to one or more target platforms as described in the scope of the patent, further comprising a plurality of reference marks for assisting the component on the target platform A spatial displacement and a direction error placed. The system for assembling one or more components to a geometric marker is selected from the group consisting of the following, square, triangular, rectangular, and the use of one or more target platforms as described in claim 1 of the patent application, wherein at least the group One or any combination: a circular trapezoid or a set of points. 10. The system for assembling a component on a multi-target platform as described in the scope of the patent application, wherein the seven paths associated with the group of components are associated with a conductive circuit on the target platform. Connecting to form - or a plurality of continuous conductive chains on the "target platform" for monitoring the placement and electrical contact of the set of components 48 200808146 on the target platform. Multi-component assembled to a system on a multi-target platform, wherein associated with one of the plurality of components (four) of the set of conductive paths is selected from the group consisting of a non-welded component comprising one or more at the interconnect interface The set of conductive paths on the elements stacked with the anisotropic conductive film layer are included in the -series arrangement on the assembly platform to monitor the assembly target, : Placement and electrical contact of the components of the group. 12. As described in the scope of claim 1 (), the system for the group of devices - or the system of the imams & amps, where the - or Multiple continuous guide packages ^ to the following multiple detection devices Less - the light-emitting diode photodetection π electric micrometer, current sensing device, thermal sensing device or audio to monitor the conductive state of the - or more continuous conductive chains. '< species include - or multiple probes The target platform includes: - the component is placed on the beam - h senses a reference mark or an alignment _ to the relative position of the early titanium raft relative to the pick head 'where the component contains the alignment mark, the target platform comprises: Reference markers, at least one of which includes at least one or a combination of the following groups: a single sensor contact probe; a single sense non-contact probe; a multi-sensor contact probe, · or a multi-sensor non-contact probe. 14 · If you apply for a patent Fan 笫 ^ - 0 0 includes one or more probes to sense a reference mark or an alignment mark when the target is in the hall 49 200808146 Recording relative to the relative position of the probe; the probe: the page or multi-sensor contact probe is selected from the early contact of the contact body == set; the current sensing device, _^ bit body frequency, Or open/short detection device. 〖5. If Shen: Green patent scope item 13 Included - a device that senses the relative position of a parameter when the wind is in sight. The single sensor is not a body. The pen sensor, the optical sensor, the light detector or Photodiode = Part (4) 13 includes - a probe to sense when the q piece is placed on the target platform - reference mark or - alignment of the relative position of the probe relative to the probe, wherein the Sensing ^ within the sensing range. The Go Cup test shows that it is located in the 13 items of the probe including - or multiple probes to sense a reference mark or an alignment when the target platform is used; p : phase: means for the relative position of the probe, wherein the multi-sensor probes ::: will: place the component into the target platform to detect the work - including the ten, the indication of 5 or the target of the reference mark The offset from a region of the probe. j. A device comprising - or a plurality of probes as described in claim 13 for sensing - the reference mark or - the relative position of the alignment mark relative to the probe when the component is placed on the target platform, wherein The multi-sensor contact 50 200808146 probe includes at least one of the following: a four-point probe or a test point array in which the test point array is in contact with the target to detect the test point array The amount of deviation from the center. No-component placement device, the device includes a set of capacitive sensors in a non-contact alignment worker: Γ: Γ = 'the set of capacitive sensors are = 阵 ^, to form a multi-sensor a detector capacitance probe, the multi-sensing, the head is configured to determine a relative (four) η-offset of the probe by using a relative capacitance value, wherein the relative capacitance value is for detecting one or more electricity: sensing is between the target and the target - obtained when the space overlaps. An I. 20. The component group capacitance sensor of claim 19 is used to apply itself to - a comparison in the capacitive sensor array to utilize an offset of the probe. The relative amplitude value of the current is used to determine a type of 7L piece placement device. The device includes a set of optical sensors in the probe, which are integrated in the array to form a multi-sensor optical. Probe, :==: The original head is used to judge the relative position of the probe (4)...- 22. The component is placed in the evening as described in claim 21 of the patent application. The basin learner sensor is used to compare the photocurrents used to sense n from L, and (iv) compare the offset between the markers.抑 与 该 该 该 — — — — 23 23 23 23 23 23 23 23 23 23 23 23 23 23 23 23 23 23 23 23 23 23 23 23 23 23 23 23 23 23 23 23 23 23 23 23 23 23 23 23 23 23 23 23 23 23 The -_ in the lock is associated with the - in the probe to indicate whether the test point is aligned with the target during sensing. γ At the beginning of a sensing process, the group keeps the flash lock cleared to ί. (4) During the sensing process, the sub-flash lock group of the group is set to be a one-shaped bear with a test point aligned with the target, and the sensing state is not maintained after the sensing process. ;u "A lock group bias = protect the lock is used to determine the probe and a target between the two ^ two shift!, and one or more to maintain a flash lock to determine the heart position, two two The position of the center of the sea is protected by the central area of the plurality of flash locks (4) and is used to adjust - _ _ $ shift amount 1 central L i 5 hai group one or more flash locks are located in the plurality of flashes The middle door lock of the lock is a plurality of (four) locks in the central area of the group to maintain an active test area in the head. j used for 4. 2 4. Scope 2 3 The subsequent alignment process is - for the purpose of a post-morbidity, the process of the region. ^ Transfer to the test application for the multi-sensor device described in item 23 of the test application Relevant. 4 Measured in the master and multiple senses = patent = the multi-sensor probe described in item 23, which includes the - McCaw mark 'and the group keeps the lock at any time providing the target 52 200808146 The size is poor and continues to be used for subsequent component placement or alignment processes, where the size information of the "Huimu tea test mark is not stored in a library of a device during the subsequent component placement or alignment process. The multi-sensor probe of claim 23, wherein the retention latch is selected from one of the group consisting of: Λ a set-reset latch; a write enable Controlled latch a set-reset flip-flop device; a write enable control flip-flop; an electrically erasable programmable memory; a flash memory; or a memory for simulating the set of latch-ups Body unit. 2 Department 8. "Multiple sensor probes, including - group sensing device, this group of sensing! / The multi-sensor probe probe electronic components _, and used to make up the Shanghai target and the search The quasi-work carries out the signal of the f, and the phase = whether the target is in the same state as the probe towel or the multi-sensor, by comparing the signals of the set of sensing devices and the retention associated with the probe The state of the state inside the latch is:, =·, as in the case of the patent application, the multi-sensor (4) probe, (4) is - the alignment probe, the target is - the place to be placed - the alignment Between the probes ^ 30 · a variety of multi-processor probes, including - group of protection (10), the lock from the (four) multi-turned device to explore the electronic components ^ a plurality of 53 200808146 闩 闩 该 该 该 08 08 08 08 08 08 08 08 08 08 08 08 08 08 08 08 08 08 08 08 08 08 08 08 08 08 08 08 08 08 08 08 08 08 08 08 08 08 08 08 08 08 08 08 08 08 — the piece contains the smaller alignment mark, #^, 1 is the door lock, the month is zero, the detector probe senses'· the smaller alignment mark is set to the multi-sensory in the sensing process In the middle, the group keeps asking the lock to be - the test point aligned with the target is separated by one: and is held by the 5 again after the sensing process. Setting a hold lock to record the alignment mark to assist the smaller alignment work area to work on the hard center area to set the larger reference mark - the set-reset latch Lock; a write-enabled latch; a set-reset flip-flop device; a write-enabled trigger; an electrically erasable programmable memory; a flash memory Or a memory unit used to simulate the set of latches. f A device for placing a component, comprising: using a multi-sensor to probe a set of alignment marks on a target platform, the device comprising a set of latching latches for assisting in aligning a probe with a target; and 54 200808146, sensing garments for capturing an indication of the positional relationship between the alignment mark and the pair of 'woods' A signal to assist in aligning the element with the aligned probe. ^申明专利|The device for placing a component as described in Item 32, (4), the group of the sensation of the sensation of the heart sensor (4) assisting the component and absorbing the defect in the shape of the component package or the target substrate Defects on the. 34. A placement system for aligning a probe with a probe for a target Α ' μ ' includes the reference mark vtfui: a reference mark to the top and a pair of heads on a component The alignment mark is treated as a target, and a set of alignment conditions associated with the memory is stored in the system. The sensor 2 includes a lighter connection to the probe electronic component. A sensing device in the sensing device is associated with the plurality of sensing devices. The sensing device is configured to capture a signal of a two-finger state for determining the multi-sensor second. Whether the sensor is aligned with the target, the 肀 or 夕 state, and the alignment between the two sets of alignment conditions and the target. To assist the head of the head-multiple sensor probes - the target platform method sub-system utilizes a plurality of latch-on latches associated with the probe::=, the method comprising the following steps: The way of locking the door is to place the probe at the predetermined coordinate of the target; 55 200808146 π senses the target with the hammer, and the group remains latched; , keep the latch in the middle: the group maintains the state of the latch adjustment sub-sensing, so that the machine - ΜΛ μβί work position in the plurality of retaining axes: broken target. ^ a羼 to align the oscillating head to the 36. The target platform on the target platform of the ninth item of claim 4, the target aligning reference mark, the target platform is characterized by: The target platform is used to compensate for the space defects of the target platform. . 37. If the scope of the patent application is 3#, the household is on the target platform. The -wm ί oxi sensor probe is aligned with the position of the 亥 Ί姊 Ί姊 〃 〃 〃 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 目 目 目 目 目 目 。 。 。 。 The means for assembling the component to a target of a target platform includes a set of alignment bars in the memory of the plurality of sensing devices and placement devices associated with the probe. The target, and then the method of aligning the two points on the subject to be placed with the multi-sensing probe, the assembly method comprising: placing the probe on the target platform - the target - predetermined coordinates; Sensing the target with the probe, wherein one of the plurality of sensing devices captures a signal indicating a relationship between the probe and the target, that is, μ; adjusting a spatial position of the probe to enable the captured The position of the signal referred to as 56 200808146 is 'sorrow' in the two domains specified in the alignment condition, or matches the structure of the infant &β; J Xiang on the target platform - a predetermined coordinate; a centered "heart; an alignment mark" of one of the plurality of sensing chambers; the probe and the alignment mark adjust the component to a threshold A plurality of sensing skirts ^ 1 ^ = catch ^ The positional geometry of the component specified in the positional component =: and or the alignment of the alignment bar is marked to read the placement process to place the aligned component in the target 3 9. As claimed in claim 3 The target is a straightforward method of arbitrarily arranging a piece of equipment for assembling a piece to a raft. The target is a item; a reference mark of #卜, the special target of the target platform is "Thousands of dollars" The rod is used for a ten-to-four-inch convergence with a space defect, which is used to compensate for the space defect of the target platform. 〇· As for the application of the patent scope, one of the 38 platforms is far from being used - The peach is assembled to the target and the target is two: the square: go to the 'the probe is in the position of the probe is tuned into the knowledge, and then the probe is aligned. The 38th item is used to The method of assembling to - sign is 4 2 = 'compensates for the space defect of the special shape of the component package shape. The middle and the pair of parts have a plurality of alignment marks on the element, the glow 57 200808146 There are a plurality of reference marks on the eucalyptus wood, and the probe is used to align a reference mark. The system includes: one or more reference marks associated with the land pattern to be placed by the component are placed at a predetermined spatial location, and the predetermined spatial location and one or more alignment marks are relative to the component - Contact array - matching; 相对 the relative displacement of the alignment mark on a component relative to a reckless test point in the contact array of the component is pre-stored in a placement device; and the test; The C coordinate can be used to check the tomb of the money device (the placement coordinate of the piece is - the center point of the alignment probe - ^ out) and the coordinate is a reference to the reference mark relative to the position of the position The relative displacement amount is adjusted. The 4-element 3 or multi-sensor probe includes a set of alignment marks including: a device on the target platform including the group reference mark, the sensing device of the compensation probe , is used to _ Rosie commented on the signal of the outer alignment of the squad, the captured; the instantaneous positional relationship between the hybrid and the alignment mark, stored in the set of alignment conditions In the device, the location status of the package is distributed or Surface geometry.戊幻衣44.- A method of assembling a hyperfine contact, the method comprising the following steps: 目心千玄上58 200808146 提 i, & a plurality of contact zone contact area spacing characteristics less than or equal to ^, In the middle of 24, one or more probes will be one or more probes F + 0a thousand orders; ^ thousand! Aligning the probe with the component; the number has become one or more by the knife: the entire component and the target area on the target platform = or the material is provided The color and/or direction error between the component and the target; and placing the component on the target platform. = Assembly of the range of 4 - including the method of superfine contact 1 - i a target platform, wherein the reference mark comprises a 1 foot and a first reference mark and a second size - The second reference second and second dimensions are used to provide alignment between the first alignment mark and the alignment mark, wherein one of the reference marks has a larger spatial scale. To compensate for a large error associated with the placement process, a coarse adjustment position adjustment is performed to cause the smaller reference mark to be used for a more accurate position adjustment. = A method of assembling a component comprising a hyperfine contact to a target platform as described in claim 44, wherein the reference mark has a symmetrical shape or an asymmetrical shape. 47. A method of assembling a component comprising hyperfine contacts to a target platform as described in claim 44, wherein the reference mark comprises a first spatial dimension and a second spatial dimension, the second spatial The scale is greater than the first spatial dimension of the 59 200808146 to compensate for a larger block difference that is placed over a first alignment direction. The error associated with placing a correlation along a first alignment direction is small. 48. A method for assembling - or a plurality of components to a target area in a target platform, the method comprising the steps of: providing - an element comprising a first alignment mark and a second pair = 5' red member has a plurality of contact regions, and one or more of the plurality of contact regions have a predetermined pitch size; placing the component onto a target region of a target platform; identifying the space of the component Positioning, by sensing the first-alignment: = one of the first reference marks provided on the target platform: one sensing the second alignment mark relative to the plurality of objects provided on the target The second reference mark of the reference mark determines the "positional deviation" between the element and the target area; the position = resolves between the element and the target area, and the component is placed in the target platform of the target platform The following method of the target area of the thousand thousand halls, wherein the identification step includes the probe::::=:: the first _alignment mark 'and the "two i° to the like:: two two circumferences: item Used to group - or multiple components A method of a target area in a thousand halls, wherein the identification step package 200808146 is a first conductive type of one set of effective sensors in a picking head, and a second conductive part of another set of effective sensors in the second probe A method for grouping one or more component group target regions, wherein the step of performing an angular position error between the target regions is reduced, and the conductive states of the two sets of effective sensors are valid if the two groups are valid The V electrical state is in the opposite direction relative to the two sets of effective senses, then the -direction error exists; and W = the component position is rotated in the target region, and the system is sensed by The electrical state is determined by the non-conducting direction of the effective sensor sensor, which is used to adjust the angular position error. The following steps are included: detecting the first state; and detecting the first state. The first part of the patent application scope is fixed to a target platform to solve a component and the following steps are included. The method for grouping one or more components to solve a binary domain, wherein the step of performing a positional adjustment of a linear position error between the target regions comprises the steps of: identifying at least two sets of effective senses The conductive state of the detector, if the two sets of effective sensors are guided by lightning, and the packet-like complaints are located in the same direction with respect to the centers of the two sets of effective sensors, respectively, a displacement error exists; Rotating the component position in the target area, and adjusting the conduction state from the effective sensing &amplifying conductive state to the effective sensor sensor non-conducting direction This angular position error. 53.- A target printed circuit board platform comprising: a target substrate member; and a 俨 柘 ” 接 material, placed in a target to be placed on the object = strong - or multi-welded area pattern - On the surface, and in the assembly process of the women's clothing, it has nothing to do with a solder paste printing process. 54. For example, please focus on the target of the third item (4) circuit board platform, The material of the piece is used to hold the element on the pattern of the tangential area of the target substrate. 55. A multi-sensor probe comprising: a plurality of sensors; and - or a plurality of sub-groups of the plurality of sensors, the - or more sub-reproducing parameters from the plurality of senses The manner in which the second or the last sensed signals of the detector are grouped again. 56. - for placing - or a plurality of components on a target platform, the system comprising placement means for moving a component to a target platform, the component comprising a contact area and one or more alignment marks The target platform includes a monolithic 5-way area pattern and/or a plurality of associated or associated scotch-marks associated with the target solder-area pattern, the solder-area pattern being used to respectively mark one or more alignment marks of the component The one or more reference marks associated with the weld zone pattern match the contact area of the component; / ' a test probe for sensing whether one or more alignment marks of the component are respectively associated with the weld zone pattern One or more reference mark alignments, two true = the 62 200808146 component is aligned with the target platform; and between one or more reference marks for the one or more alignment marks of the component and the weld zone pattern An alignment relationship corrects a spatial position of the element relative to the pattern of the weld zone. 57. A system for placing one or more components on a target platform as described in claim 56, wherein the alignment path is such that the laser beam is allowed to pass. 58. A system for placing one or more components on a target platform as described in claim 56, wherein the alignment marks comprise a conductive path 'from one edge to the other of the component A system of the same type as described in claim 56, wherein the test probe comprises an array of one or more sensors, the one or more senses The detector is selected from one or more of the following or any combination: an optical sensor, a photodetector for sensing reflection from the target platform = light, a t-sensor, a current sensor, a thermal sensation Detector, audio sensor, or resistance sensor. 60. The system for placing _ or a plurality of components on a flat surface as described in claim 56 of claim 4, wherein the alignment mark and the contact space of the contact array of the component The relationship actually matches a second spatial relationship between the reference mark mark and one of the target weld zone patterns. 61. A system for placing one or more components, as described in claim 56, on a target platform, wherein the reference markers comprise reflective markers on the surface of the target, the markers being The incident light is reflected to the test probe through a transparent light 63 200808146 4* path. The system of claim 56, wherein the reference mark includes a reference 位于 'the # reference pad on the surface is used to conduct Λ丨 所述 申请 申请 申请 申请 第 第 第 申请 申请 , , , , , L to an internal wire diameter or face of the target platform. m. The ribs described in item 56 of the patent application - or a plurality of components - the system on the target platform wherein the plurality of contact regions comprise a two ttt conductive elastomer for the feature of the interconnecting interface. •—The monthly patent is described in section 56 for placing—or multiple components:: a system on a platform where the test probe is interconnected to an anisotropic conductive elastomer, the elastomer stack Placed on the test probe to assist in the detection of contact detection. Optical sensing method for detecting the placement accuracy of a component on a target platform, the system comprising: a diameter I: a member: a brother-mark, the first-mark includes - an optical path 2 and an element Included in the target platform: $ && , , ^ on the target platform includes a second reflector of an optical reflector: a soldering area pattern for the first label: Matching the contact array; and a test probe, including _out, detecting from the second mark to the =1th light=tester for the part to indicate the photon of the element and the center: Tiger's - part.曰铩 thousand s: alignment between the upper contact arrays 66. - through the detection of a first mark on a piece of the object and a second mark on the 64 200808146 no, the upper part includes a surface reflector The method of optical transmission detecting the placement accuracy of the component on the target platform, the 1 element in the basin comprising a - contact array 'the contact array matching the pattern of the area on the target platform, the method comprising the following steps: - an optical component, which is transmitted to the - "a mark on the component" a sensor array 'for receiving a first portion of the light beam reflected from the surface through the first mark when the first mark is partially matched with the surface reflector in a - spatial position; and according to the The under-reflected beam portion determines whether the contact array matches the soldering region (4) and determines the direction in which the component is adjusted. 67. A system for aligning a component on a target platform using an electrical sensing method, the system comprising: the target platform comprising a reference mark; the component comprising an alignment mark; 4 wood comprising a capacitor An array of sensors, the probe being used, aligned with the reference mark, and being sensed by sensing the array of capacitive sensors and the _-first capacitor of the 4 tea test Aligning the read with the target platform and transmitting a sense of the capacitive sensor array and a second capacitor between the alignment marks on the component; and a placement device is used to The second capacitor corrects the placement of the component. 68--A method for aligning a component on a target platform, the method comprising the following steps: 65 200808146 Electric Valley Detector constitutes △ ▼... A π 诛 对准 aligns with the target platform - the McCaw mark, By sensing the capacitive sensor array and the reference mark; 瞽 adjusting the culvert according to the first capacitance & 参考 the reference mark; n 撼 position ' to align the probe And placing a component on the target platform; sensing the capacitive sensor array and a second capacitor of the component; and correcting the placement of the component according to the second capacitance. '·a component on a target platform, the component comprising: to interface with other components, the contact area is matched by a pattern of soldering regions for indicating a thousand $; and - or more alignment Marking, disposed in a pre-pitched space region disposed relative to the contact area, such that the component is aligned - an alignment mark in the target or multi-alignment mark includes a = two: one on the target platform The reference mark contacts, receives a letter, and the contact with the reference mark ^, «V ψ ^ 0 t transmits the number to the reference field. "The contact area of the platform of the tandem area of the platform is matched with the 区 兮 兮 〆 如 如 如 如 如 如 如 第 第 、 放置 放置 放置 放置 放置 放置 放置 放置 放置 放置 放置 放置 放置 放置 放置 放置 放置 放置 放置 放置 放置 放置 放置Or any combination: an integrated-dominant conductive film: a sheet, a stacked component, or an integrated circuit component of a stacked 电/, V-electric film. • As described in claim 69. An element for placement on the target platform 66 200808146, the contact area being selected from at least one of the following: a contact pad or an array of contacts. 72. A target platform for placement of a component, the target platform includes : a set of splicing area patterns disposed on a surface of the target platform, wherein the pattern of the soldering area in the pattern of the dry area is used to match an array of contacts on the component to be placed; The first one - 咏〒 格 兴 兴 元件 元件 元件 元件 元件 : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : Match the pattern of the weld area on the target platform. The probe's ϋ includes a plurality of pick-ups, and an anisotropic conductive film is placed on the cover to change the contact conditions between the Κ and the external contact area. 67