TW200821599A - Electronic component testing apparatus - Google Patents
Electronic component testing apparatus Download PDFInfo
- Publication number
- TW200821599A TW200821599A TW096132855A TW96132855A TW200821599A TW 200821599 A TW200821599 A TW 200821599A TW 096132855 A TW096132855 A TW 096132855A TW 96132855 A TW96132855 A TW 96132855A TW 200821599 A TW200821599 A TW 200821599A
- Authority
- TW
- Taiwan
- Prior art keywords
- electronic component
- tested
- test
- tray
- component
- Prior art date
Links
- 238000012360 testing method Methods 0.000 title claims abstract description 275
- 230000007246 mechanism Effects 0.000 claims description 89
- 238000001179 sorption measurement Methods 0.000 claims description 38
- 238000003860 storage Methods 0.000 claims description 21
- 230000014759 maintenance of location Effects 0.000 claims description 3
- TVEXGJYMHHTVKP-UHFFFAOYSA-N 6-oxabicyclo[3.2.1]oct-3-en-7-one Chemical compound C1C2C(=O)OC1C=CC2 TVEXGJYMHHTVKP-UHFFFAOYSA-N 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- 238000012546 transfer Methods 0.000 abstract description 5
- 239000011295 pitch Substances 0.000 description 42
- 238000000034 method Methods 0.000 description 15
- 238000010586 diagram Methods 0.000 description 14
- 238000005470 impregnation Methods 0.000 description 14
- 238000006243 chemical reaction Methods 0.000 description 13
- 230000009471 action Effects 0.000 description 11
- 230000008859 change Effects 0.000 description 11
- 239000000463 material Substances 0.000 description 5
- 238000013459 approach Methods 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 238000012937 correction Methods 0.000 description 3
- 230000002950 deficient Effects 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 229920003002 synthetic resin Polymers 0.000 description 3
- 239000000057 synthetic resin Substances 0.000 description 3
- 230000008646 thermal stress Effects 0.000 description 3
- 238000009825 accumulation Methods 0.000 description 2
- 230000001186 cumulative effect Effects 0.000 description 2
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- 108090000749 Aurora kinase B Proteins 0.000 description 1
- 235000009854 Cucurbita moschata Nutrition 0.000 description 1
- 240000001980 Cucurbita pepo Species 0.000 description 1
- 235000009852 Cucurbita pepo Nutrition 0.000 description 1
- 241000237858 Gastropoda Species 0.000 description 1
- 102100020718 Receptor-type tyrosine-protein kinase FLT3 Human genes 0.000 description 1
- 241000555745 Sciuridae Species 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 210000000078 claw Anatomy 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000003306 harvesting Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 235000012054 meals Nutrition 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 235000020354 squash Nutrition 0.000 description 1
- 238000005496 tempering Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Packaging Frangible Articles (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2006/319870 WO2008041334A1 (en) | 2006-10-04 | 2006-10-04 | Electronic component testing apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200821599A true TW200821599A (en) | 2008-05-16 |
| TWI345063B TWI345063B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 2011-07-11 |
Family
ID=39268202
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW096132855A TW200821599A (en) | 2006-10-04 | 2007-09-04 | Electronic component testing apparatus |
Country Status (5)
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI621858B (zh) * | 2013-05-17 | 2018-04-21 | Seiko Epson Corp | Processor and inspection device |
| TWI641847B (zh) * | 2013-05-20 | 2018-11-21 | 日商精工愛普生股份有限公司 | Processor and inspection device |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101499573B1 (ko) * | 2010-06-16 | 2015-03-10 | (주)테크윙 | 테스트핸들러에서의 반도체소자 언로딩방법 |
| JP2013044684A (ja) * | 2011-08-25 | 2013-03-04 | Seiko Epson Corp | ハンドラー、及び部品検査装置 |
| JP2013137285A (ja) * | 2011-12-28 | 2013-07-11 | Advantest Corp | ピッチ変更装置、電子部品ハンドリング装置、及び電子部品試験装置 |
| JP2013137284A (ja) | 2011-12-28 | 2013-07-11 | Advantest Corp | 電子部品移載装置、電子部品ハンドリング装置、及び電子部品試験装置 |
| KR102053081B1 (ko) * | 2013-10-08 | 2019-12-06 | (주)테크윙 | 테스트핸들러 |
| CN104133173B (zh) * | 2014-08-14 | 2017-02-01 | 潍坊路加精工有限公司 | 一种全自动测试装置 |
| KR20160109484A (ko) | 2015-03-11 | 2016-09-21 | 가부시키가이샤 어드밴티스트 | 반송 캐리어, 반송 장치, 및 베이스부 |
| CN106405369A (zh) * | 2015-07-31 | 2017-02-15 | 精工爱普生株式会社 | 电子部件输送装置以及电子部件检查装置 |
| CN106813888B (zh) * | 2015-11-27 | 2019-01-04 | 环维电子(上海)有限公司 | 冲击试验模块及其测试板 |
| KR20170078209A (ko) * | 2015-12-29 | 2017-07-07 | (주)테크윙 | 반도체소자 테스트용 핸들러 |
| JP2020012748A (ja) * | 2018-07-19 | 2020-01-23 | セイコーエプソン株式会社 | 電子部品搬送装置および電子部品検査装置 |
| KR102053091B1 (ko) * | 2019-06-20 | 2019-12-06 | (주)테크윙 | 테스트핸들러 |
| KR102779986B1 (ko) * | 2023-11-21 | 2025-03-13 | 한미반도체 주식회사 | 본딩장치 |
| KR102762417B1 (ko) * | 2023-11-21 | 2025-02-05 | 한미반도체 주식회사 | 본딩장치 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06302670A (ja) * | 1993-04-15 | 1994-10-28 | Hitachi Electron Eng Co Ltd | 小形角型ワーク用非接触吸着ヘッド |
| JP2001004702A (ja) * | 1999-06-22 | 2001-01-12 | Advantest Corp | 半導体試験装置のｉｃハンドラ装置 |
| KR100349942B1 (ko) * | 1999-12-06 | 2002-08-24 | 삼성전자 주식회사 | 램버스 핸들러 |
| JP2001264387A (ja) * | 2000-03-16 | 2001-09-26 | Nippon Eng Kk | バーンインボード用ローダアンローダ装置における吸着ヘッドおよびその制御システム |
| AU2003242260A1 (en) * | 2003-06-06 | 2005-01-04 | Advantest Corporation | Transport device, electronic component handling device, and transporting method for electronic component handling device |
-
2006
- 2006-10-04 CN CN2006800139501A patent/CN101258415B/zh active Active
- 2006-10-04 WO PCT/JP2006/319870 patent/WO2008041334A1/ja active Application Filing
- 2006-10-04 KR KR1020097026216A patent/KR20100017827A/ko not_active Withdrawn
- 2006-10-04 KR KR1020077024582A patent/KR100942527B1/ko active Active
- 2006-10-04 JP JP2007540849A patent/JPWO2008041334A1/ja not_active Ceased
-
2007
- 2007-09-04 TW TW096132855A patent/TW200821599A/zh unknown
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI621858B (zh) * | 2013-05-17 | 2018-04-21 | Seiko Epson Corp | Processor and inspection device |
| TWI641847B (zh) * | 2013-05-20 | 2018-11-21 | 日商精工愛普生股份有限公司 | Processor and inspection device |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20080057206A (ko) | 2008-06-24 |
| KR20100017827A (ko) | 2010-02-16 |
| KR100942527B1 (ko) | 2010-02-12 |
| TWI345063B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 2011-07-11 |
| JPWO2008041334A1 (ja) | 2010-02-04 |
| CN101258415A (zh) | 2008-09-03 |
| WO2008041334A1 (en) | 2008-04-10 |
| CN101258415B (zh) | 2011-01-19 |
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