TW200804839A - Electronic component testing apparatus - Google Patents

Electronic component testing apparatus Download PDF

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Publication number
TW200804839A
TW200804839A TW096117208A TW96117208A TW200804839A TW 200804839 A TW200804839 A TW 200804839A TW 096117208 A TW096117208 A TW 096117208A TW 96117208 A TW96117208 A TW 96117208A TW 200804839 A TW200804839 A TW 200804839A
Authority
TW
Taiwan
Prior art keywords
test
carrier
electronic component
test carrier
tst
Prior art date
Application number
TW096117208A
Other languages
English (en)
Chinese (zh)
Other versions
TWI327224B (ja
Inventor
Koya Karino
Yoshihito Kobayashi
Kazuyuki Yamashita
Akihiko Ito
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Publication of TW200804839A publication Critical patent/TW200804839A/zh
Application granted granted Critical
Publication of TWI327224B publication Critical patent/TWI327224B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
TW096117208A 2006-05-18 2007-05-15 Electronic component testing apparatus TW200804839A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2006/309955 WO2007135710A1 (ja) 2006-05-18 2006-05-18 電子部品試験装置

Publications (2)

Publication Number Publication Date
TW200804839A true TW200804839A (en) 2008-01-16
TWI327224B TWI327224B (ja) 2010-07-11

Family

ID=38723025

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096117208A TW200804839A (en) 2006-05-18 2007-05-15 Electronic component testing apparatus

Country Status (3)

Country Link
KR (1) KR101042652B1 (ja)
TW (1) TW200804839A (ja)
WO (1) WO2007135710A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI394960B (zh) * 2008-07-08 2013-05-01 Advantest Corp Electronic component test methods, inserts, trays and electronic component test devices

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010146709A1 (ja) * 2009-06-19 2010-12-23 株式会社アドバンテスト 電子部品移載装置及び電子部品の移載方法
WO2010146708A1 (ja) * 2009-06-19 2010-12-23 株式会社アドバンテスト 電子部品移載装置及びそれを備えた電子部品試験装置
JP2022021239A (ja) * 2020-07-21 2022-02-02 株式会社アドバンテスト 電子部品ハンドリング装置及び電子部品試験装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW379285B (en) * 1997-07-02 2000-01-11 Advantest Corp Testing device for semiconductor components and the testing trays used in the testing apparatus
JP2000065895A (ja) * 1998-08-24 2000-03-03 Ando Electric Co Ltd オートハンドラおよびオートハンドラのキャリアの搬送方法
JP4109368B2 (ja) * 1999-01-14 2008-07-02 株式会社アドバンテスト 電子部品試験装置用マッチプレート
JP3813772B2 (ja) * 1999-09-27 2006-08-23 株式会社ルネサステクノロジ 半導体装置の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI394960B (zh) * 2008-07-08 2013-05-01 Advantest Corp Electronic component test methods, inserts, trays and electronic component test devices

Also Published As

Publication number Publication date
TWI327224B (ja) 2010-07-11
KR20090015938A (ko) 2009-02-12
KR101042652B1 (ko) 2011-06-20
WO2007135710A1 (ja) 2007-11-29

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