TW200803686A - Multilayer wiring board and its manufacturing method - Google Patents

Multilayer wiring board and its manufacturing method Download PDF

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Publication number
TW200803686A
TW200803686A TW096110506A TW96110506A TW200803686A TW 200803686 A TW200803686 A TW 200803686A TW 096110506 A TW096110506 A TW 096110506A TW 96110506 A TW96110506 A TW 96110506A TW 200803686 A TW200803686 A TW 200803686A
Authority
TW
Taiwan
Prior art keywords
conductor
substrate
electrically insulating
wiring board
wiring
Prior art date
Application number
TW096110506A
Other languages
English (en)
Chinese (zh)
Other versions
TWI378755B (cg-RX-API-DMAC10.html
Inventor
Hideki Higashitani
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2006087037A external-priority patent/JP4797743B2/ja
Priority claimed from JP2006087036A external-priority patent/JP4797742B2/ja
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of TW200803686A publication Critical patent/TW200803686A/zh
Application granted granted Critical
Publication of TWI378755B publication Critical patent/TWI378755B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H05K3/462—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar double-sided circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2072—Anchoring, i.e. one structure gripping into another
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1056—Perforating lamina

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
TW096110506A 2006-03-28 2007-03-27 Multilayer wiring board and its manufacturing method TW200803686A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006087037A JP4797743B2 (ja) 2006-03-28 2006-03-28 多層配線基板の製造方法
JP2006087036A JP4797742B2 (ja) 2006-03-28 2006-03-28 多層配線基板とその製造方法

Publications (2)

Publication Number Publication Date
TW200803686A true TW200803686A (en) 2008-01-01
TWI378755B TWI378755B (cg-RX-API-DMAC10.html) 2012-12-01

Family

ID=38563380

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096110506A TW200803686A (en) 2006-03-28 2007-03-27 Multilayer wiring board and its manufacturing method

Country Status (3)

Country Link
US (1) US20100224395A1 (cg-RX-API-DMAC10.html)
TW (1) TW200803686A (cg-RX-API-DMAC10.html)
WO (1) WO2007114111A1 (cg-RX-API-DMAC10.html)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5436774B2 (ja) * 2007-12-25 2014-03-05 古河電気工業株式会社 多層プリント基板およびその製造方法
JP2011187769A (ja) * 2010-03-10 2011-09-22 Fujitsu Ltd 多層プリント配線板の製造方法及び多層プリント配線板
KR20110113980A (ko) * 2010-04-12 2011-10-19 삼성전자주식회사 필름을 포함한 다층 인쇄회로기판 및 그 제조 방법
KR101767381B1 (ko) * 2010-12-30 2017-08-11 삼성전자 주식회사 인쇄회로기판 및 이를 포함하는 반도체 패키지
US20120298412A1 (en) * 2011-05-25 2012-11-29 Samsung Electro-Mechanics Co., Ltd. Printed circuit board and method of manufacturing the same
KR20140008923A (ko) * 2012-07-13 2014-01-22 삼성전기주식회사 코어리스 인쇄회로기판 및 그 제조 방법
KR20140047967A (ko) * 2012-10-15 2014-04-23 삼성전기주식회사 다층형 코어리스 인쇄회로기판 및 그 제조 방법
CN104244614A (zh) * 2013-06-21 2014-12-24 富葵精密组件(深圳)有限公司 多层电路板及其制作方法
US9821541B2 (en) * 2015-07-14 2017-11-21 uBeam Inc. Laminate material bonding
JP6696996B2 (ja) * 2015-11-10 2020-05-20 株式会社村田製作所 樹脂多層基板およびその製造方法
CN219627994U (zh) * 2023-02-23 2023-09-01 瑞声光电科技(常州)有限公司 一种柔性线路板

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3786600T2 (de) * 1986-05-30 1993-11-04 Furukawa Electric Co Ltd Mehrschichtige gedruckte schaltung und verfahren zu ihrer herstellung.
US5808874A (en) * 1996-05-02 1998-09-15 Tessera, Inc. Microelectronic connections with liquid conductive elements
JP4043115B2 (ja) * 1998-09-24 2008-02-06 イビデン株式会社 多数個取り多層プリント配線板
US6753483B2 (en) * 2000-06-14 2004-06-22 Matsushita Electric Industrial Co., Ltd. Printed circuit board and method of manufacturing the same
JP3855774B2 (ja) * 2002-01-15 2006-12-13 株式会社デンソー 多層基板の製造方法
TW200505304A (en) * 2003-05-20 2005-02-01 Matsushita Electric Industrial Co Ltd Multilayer circuit board and method for manufacturing the same
US7332821B2 (en) * 2004-08-20 2008-02-19 International Business Machines Corporation Compressible films surrounding solder connectors

Also Published As

Publication number Publication date
TWI378755B (cg-RX-API-DMAC10.html) 2012-12-01
US20100224395A1 (en) 2010-09-09
WO2007114111A1 (ja) 2007-10-11

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