TWI378755B - - Google Patents

Download PDF

Info

Publication number
TWI378755B
TWI378755B TW096110506A TW96110506A TWI378755B TW I378755 B TWI378755 B TW I378755B TW 096110506 A TW096110506 A TW 096110506A TW 96110506 A TW96110506 A TW 96110506A TW I378755 B TWI378755 B TW I378755B
Authority
TW
Taiwan
Prior art keywords
electrically insulating
conductor
wiring board
multilayer wiring
substrate
Prior art date
Application number
TW096110506A
Other languages
English (en)
Chinese (zh)
Other versions
TW200803686A (en
Inventor
Hideki Higashitani
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2006087037A external-priority patent/JP4797743B2/ja
Priority claimed from JP2006087036A external-priority patent/JP4797742B2/ja
Application filed by Panasonic Corp filed Critical Panasonic Corp
Publication of TW200803686A publication Critical patent/TW200803686A/zh
Application granted granted Critical
Publication of TWI378755B publication Critical patent/TWI378755B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H05K3/462—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar double-sided circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2072—Anchoring, i.e. one structure gripping into another
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1056—Perforating lamina

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
TW096110506A 2006-03-28 2007-03-27 Multilayer wiring board and its manufacturing method TW200803686A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006087037A JP4797743B2 (ja) 2006-03-28 2006-03-28 多層配線基板の製造方法
JP2006087036A JP4797742B2 (ja) 2006-03-28 2006-03-28 多層配線基板とその製造方法

Publications (2)

Publication Number Publication Date
TW200803686A TW200803686A (en) 2008-01-01
TWI378755B true TWI378755B (cg-RX-API-DMAC10.html) 2012-12-01

Family

ID=38563380

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096110506A TW200803686A (en) 2006-03-28 2007-03-27 Multilayer wiring board and its manufacturing method

Country Status (3)

Country Link
US (1) US20100224395A1 (cg-RX-API-DMAC10.html)
TW (1) TW200803686A (cg-RX-API-DMAC10.html)
WO (1) WO2007114111A1 (cg-RX-API-DMAC10.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104244614A (zh) * 2013-06-21 2014-12-24 富葵精密组件(深圳)有限公司 多层电路板及其制作方法

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5436774B2 (ja) * 2007-12-25 2014-03-05 古河電気工業株式会社 多層プリント基板およびその製造方法
JP2011187769A (ja) * 2010-03-10 2011-09-22 Fujitsu Ltd 多層プリント配線板の製造方法及び多層プリント配線板
KR20110113980A (ko) * 2010-04-12 2011-10-19 삼성전자주식회사 필름을 포함한 다층 인쇄회로기판 및 그 제조 방법
KR101767381B1 (ko) * 2010-12-30 2017-08-11 삼성전자 주식회사 인쇄회로기판 및 이를 포함하는 반도체 패키지
US20120298412A1 (en) * 2011-05-25 2012-11-29 Samsung Electro-Mechanics Co., Ltd. Printed circuit board and method of manufacturing the same
KR20140008923A (ko) * 2012-07-13 2014-01-22 삼성전기주식회사 코어리스 인쇄회로기판 및 그 제조 방법
KR20140047967A (ko) * 2012-10-15 2014-04-23 삼성전기주식회사 다층형 코어리스 인쇄회로기판 및 그 제조 방법
US9821541B2 (en) * 2015-07-14 2017-11-21 uBeam Inc. Laminate material bonding
JP6696996B2 (ja) * 2015-11-10 2020-05-20 株式会社村田製作所 樹脂多層基板およびその製造方法
CN219627994U (zh) * 2023-02-23 2023-09-01 瑞声光电科技(常州)有限公司 一种柔性线路板

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3786600T2 (de) * 1986-05-30 1993-11-04 Furukawa Electric Co Ltd Mehrschichtige gedruckte schaltung und verfahren zu ihrer herstellung.
US5808874A (en) * 1996-05-02 1998-09-15 Tessera, Inc. Microelectronic connections with liquid conductive elements
JP4043115B2 (ja) * 1998-09-24 2008-02-06 イビデン株式会社 多数個取り多層プリント配線板
US6753483B2 (en) * 2000-06-14 2004-06-22 Matsushita Electric Industrial Co., Ltd. Printed circuit board and method of manufacturing the same
JP3855774B2 (ja) * 2002-01-15 2006-12-13 株式会社デンソー 多層基板の製造方法
TW200505304A (en) * 2003-05-20 2005-02-01 Matsushita Electric Industrial Co Ltd Multilayer circuit board and method for manufacturing the same
US7332821B2 (en) * 2004-08-20 2008-02-19 International Business Machines Corporation Compressible films surrounding solder connectors

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104244614A (zh) * 2013-06-21 2014-12-24 富葵精密组件(深圳)有限公司 多层电路板及其制作方法

Also Published As

Publication number Publication date
US20100224395A1 (en) 2010-09-09
TW200803686A (en) 2008-01-01
WO2007114111A1 (ja) 2007-10-11

Similar Documents

Publication Publication Date Title
TWI362910B (cg-RX-API-DMAC10.html)
TWI259038B (en) Circuit board, electric insulating material therefor and method of manufacturing the same
CN1247053C (zh) 多层电路板及制造多层电路板的方法
JP3969192B2 (ja) 多層配線基板の製造方法
TW201004527A (en) Method of producing rigid-flex printed circuit board and rigid-flex printed circuit board
TW200803686A (en) Multilayer wiring board and its manufacturing method
WO2007116855A1 (ja) 多層プリント配線基板及びその製造方法
JP2000077800A (ja) 配線基板とその製造方法
TWI309146B (en) Circuit board and method for producing the same
TWI336225B (en) Wiring board, multilayer wiring board, and method for manufacturing the same
TW200522831A (en) Method of manufacturing circuit board
JP2026012559A (ja) プリント配線板及びプリント配線板の製造方法
JPWO2006040942A1 (ja) 多層回路基板の製造方法
JP2004273575A (ja) 多層プリント配線基板及びその製造方法
JPWO2006118141A1 (ja) 多層配線基板およびその製造方法
CN101411253B (zh) 多层布线基板及其制造方法
WO2018037434A1 (ja) 回路基板の製造方法
JP2002368364A5 (cg-RX-API-DMAC10.html)
JP2005251949A (ja) 配線基板及びその製造方法
JP2000183526A (ja) 多層配線基板およびその製造方法
JP4797743B2 (ja) 多層配線基板の製造方法
JP2007266165A (ja) 多層配線基板の製造方法
JP2004221236A (ja) 回路基板の製造方法
JP2003283087A (ja) プリント配線基板およびその製造方法
JP4892924B2 (ja) 多層プリント配線基板及びその製造方法

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees