TW200802526A - Substrate treatment apparatus and substrate treatment method - Google Patents

Substrate treatment apparatus and substrate treatment method

Info

Publication number
TW200802526A
TW200802526A TW096111285A TW96111285A TW200802526A TW 200802526 A TW200802526 A TW 200802526A TW 096111285 A TW096111285 A TW 096111285A TW 96111285 A TW96111285 A TW 96111285A TW 200802526 A TW200802526 A TW 200802526A
Authority
TW
Taiwan
Prior art keywords
substrate
brush
substrate treatment
holding mechanism
pushing pressure
Prior art date
Application number
TW096111285A
Other languages
English (en)
Other versions
TWI360154B (en
Inventor
Nobuyasu Hiraoka
Tsuyoshi Okumura
Akiyoshi Nakano
Hajime Ugajin
Original Assignee
Dainippon Screen Mfg
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2006095553A external-priority patent/JP2007273611A/ja
Priority claimed from JP2006095554A external-priority patent/JP4719052B2/ja
Priority claimed from JP2006095552A external-priority patent/JP4719051B2/ja
Application filed by Dainippon Screen Mfg, Sony Corp filed Critical Dainippon Screen Mfg
Publication of TW200802526A publication Critical patent/TW200802526A/zh
Application granted granted Critical
Publication of TWI360154B publication Critical patent/TWI360154B/zh

Links

Classifications

    • B08B1/32—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02082—Cleaning product to be cleaned
    • H01L21/02087—Cleaning of wafer edges
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
TW096111285A 2006-03-30 2007-03-30 Substrate treatment apparatus and substrate treatm TWI360154B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006095553A JP2007273611A (ja) 2006-03-30 2006-03-30 基板処理装置および基板処理方法
JP2006095554A JP4719052B2 (ja) 2006-03-30 2006-03-30 基板処理装置および基板処理方法
JP2006095552A JP4719051B2 (ja) 2006-03-30 2006-03-30 基板処理装置および基板処理方法

Publications (2)

Publication Number Publication Date
TW200802526A true TW200802526A (en) 2008-01-01
TWI360154B TWI360154B (en) 2012-03-11

Family

ID=38556735

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096111285A TWI360154B (en) 2006-03-30 2007-03-30 Substrate treatment apparatus and substrate treatm

Country Status (3)

Country Link
US (1) US7979942B2 (zh)
KR (1) KR100892809B1 (zh)
TW (1) TWI360154B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112582298A (zh) * 2019-09-30 2021-03-30 芝浦机械电子株式会社 基板处理装置

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JP4928343B2 (ja) * 2007-04-27 2012-05-09 大日本スクリーン製造株式会社 基板処理装置
JP5039468B2 (ja) * 2007-07-26 2012-10-03 株式会社Ｓｏｋｕｄｏ 基板洗浄装置およびそれを備えた基板処理装置
JP2009088244A (ja) * 2007-09-28 2009-04-23 Tokyo Electron Ltd 基板クリーニング装置、基板処理装置、基板クリーニング方法、基板処理方法及び記憶媒体
JP4939376B2 (ja) * 2007-11-13 2012-05-23 株式会社Ｓｏｋｕｄｏ 基板処理装置
CN101869898B (zh) * 2010-03-26 2011-12-07 华东交通大学 便携机械式垃圾广告清理器
US20140310895A1 (en) * 2013-04-19 2014-10-23 Applied Materials, Inc. Scrubber brush force control assemblies, apparatus and methods for chemical mechanical polishing
JP6178019B2 (ja) * 2014-10-31 2017-08-09 株式会社荏原製作所 基板洗浄装置及び基板洗浄方法
KR101574111B1 (ko) 2015-08-28 2015-12-03 (주)패스트 세정브러시를 구비하는 패널세정장치
JP6508721B2 (ja) 2015-09-28 2019-05-08 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP6684191B2 (ja) * 2016-09-05 2020-04-22 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄装置およびそれを備える基板処理装置
US11139182B2 (en) * 2017-12-13 2021-10-05 Tokyo Electron Limited Substrate processing apparatus and substrate processing method
US10786939B2 (en) 2017-12-21 2020-09-29 The Boeing Company Apparatuses for depositing an extrudable substance onto a surface
US10933435B2 (en) 2017-12-21 2021-03-02 The Boeing Company Apparatuses for depositing an extrudable substance onto a surface
US10791825B2 (en) * 2017-12-21 2020-10-06 The Boeing Company Apparatuses for dispensing a brushable substance onto a surface
US10799910B2 (en) 2017-12-21 2020-10-13 The Boeing Company Apparatuses for dispensing a brushable substance onto a surface
US10781029B2 (en) 2017-12-21 2020-09-22 The Boeing Company Apparatuses for depositing an extrudable substance onto a surface
US10575628B2 (en) 2018-02-07 2020-03-03 The Boeing Company Apparatuses for cleaning a surface
US10905228B2 (en) 2018-02-07 2021-02-02 The Boeing Company Apparatuses for cleaning a surface
US10881192B2 (en) 2018-02-07 2021-01-05 The Boeing Company Apparatuses and methods for cleaning a surface
CN110767536A (zh) * 2019-10-30 2020-02-07 上海华力微电子有限公司 晶圆清洗方法
US11664213B2 (en) * 2019-12-26 2023-05-30 Taiwan Semiconductor Manufacturing Company, Ltd. Bevel edge removal methods, tools, and systems

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JP2003197592A (ja) 2001-12-27 2003-07-11 Dainippon Screen Mfg Co Ltd 基板端面洗浄装置および基板処理装置
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112582298A (zh) * 2019-09-30 2021-03-30 芝浦机械电子株式会社 基板处理装置

Also Published As

Publication number Publication date
TWI360154B (en) 2012-03-11
KR20070098606A (ko) 2007-10-05
US20070226926A1 (en) 2007-10-04
US7979942B2 (en) 2011-07-19
KR100892809B1 (ko) 2009-04-10

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