TW200746145A - Programming a normally single phase chalcogenide material for use as a memory or FPLA - Google Patents

Programming a normally single phase chalcogenide material for use as a memory or FPLA

Info

Publication number
TW200746145A
TW200746145A TW096112889A TW96112889A TW200746145A TW 200746145 A TW200746145 A TW 200746145A TW 096112889 A TW096112889 A TW 096112889A TW 96112889 A TW96112889 A TW 96112889A TW 200746145 A TW200746145 A TW 200746145A
Authority
TW
Taiwan
Prior art keywords
memory
fpla
programming
chalcogenide material
single phase
Prior art date
Application number
TW096112889A
Other languages
English (en)
Other versions
TWI342023B (en
Inventor
George A Gordon
Ward D Parkinson
John M Peters
Tyler Lowrey
Stanford Ovshinsky
Guy C Wicker
Ilya V Karpov
Charles C Kuo
Original Assignee
Ovonyx Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ovonyx Inc filed Critical Ovonyx Inc
Publication of TW200746145A publication Critical patent/TW200746145A/zh
Application granted granted Critical
Publication of TWI342023B publication Critical patent/TWI342023B/zh

Links

Classifications

    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0004Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements comprising amorphous/crystalline phase transition cells
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021Auxiliary circuits
    • G11C13/004Reading or sensing circuits or methods
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021Auxiliary circuits
    • G11C13/0069Writing or programming circuits or methods
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B63/00Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
    • H10B63/80Arrangements comprising multiple bistable or multi-stable switching components of the same type on a plane parallel to the substrate, e.g. cross-point arrays
    • H10B63/82Arrangements comprising multiple bistable or multi-stable switching components of the same type on a plane parallel to the substrate, e.g. cross-point arrays the switching components having a common active material layer
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/20Multistable switching devices, e.g. memristors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801Constructional details of multistable switching devices
    • H10N70/821Device geometry
    • H10N70/826Device geometry adapted for essentially vertical current flow, e.g. sandwich or pillar type devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801Constructional details of multistable switching devices
    • H10N70/881Switching materials
    • H10N70/882Compounds of sulfur, selenium or tellurium, e.g. chalcogenides
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801Constructional details of multistable switching devices
    • H10N70/881Switching materials
    • H10N70/882Compounds of sulfur, selenium or tellurium, e.g. chalcogenides
    • H10N70/8828Tellurides, e.g. GeSbTe
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021Auxiliary circuits
    • G11C13/004Reading or sensing circuits or methods
    • G11C2013/0054Read is performed on a reference element, e.g. cell, and the reference sensed value is used to compare the sensed value of the selected cell
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021Auxiliary circuits
    • G11C13/0069Writing or programming circuits or methods
    • G11C2013/009Write using potential difference applied between cell electrodes
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021Auxiliary circuits
    • G11C13/0069Writing or programming circuits or methods
    • G11C2013/0092Write characterized by the shape, e.g. form, length, amplitude of the write pulse
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C2213/00Indexing scheme relating to G11C13/00 for features not covered by this group
    • G11C2213/70Resistive array aspects
    • G11C2213/77Array wherein the memory element being directly connected to the bit lines and word lines without any access device being used

Landscapes

  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Semiconductor Memories (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
TW096112889A 2006-04-20 2007-04-12 Programming a normally single phase chalcogenide material for use as a memory TWI342023B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/407,573 US7414883B2 (en) 2006-04-20 2006-04-20 Programming a normally single phase chalcogenide material for use as a memory or FPLA

Publications (2)

Publication Number Publication Date
TW200746145A true TW200746145A (en) 2007-12-16
TWI342023B TWI342023B (en) 2011-05-11

Family

ID=38476121

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096112889A TWI342023B (en) 2006-04-20 2007-04-12 Programming a normally single phase chalcogenide material for use as a memory

Country Status (6)

Country Link
US (2) US7414883B2 (zh)
JP (2) JP2009534835A (zh)
KR (2) KR101196933B1 (zh)
CN (1) CN101427396B (zh)
TW (1) TWI342023B (zh)
WO (1) WO2007127014A2 (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI572574B (zh) * 2015-03-20 2017-03-01 英特爾公司 硫族玻璃組成物及硫族開關裝置
TWI698980B (zh) * 2018-07-17 2020-07-11 旺宏電子股份有限公司 開關元件與記憶體元件
US11183633B2 (en) 2016-10-04 2021-11-23 Sony Semiconductor Solutions Corporation Switch device, storage apparatus, and memory system

Families Citing this family (57)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7414883B2 (en) * 2006-04-20 2008-08-19 Intel Corporation Programming a normally single phase chalcogenide material for use as a memory or FPLA
JP2008085204A (ja) * 2006-09-28 2008-04-10 Toshiba Corp 半導体記憶装置及びその製造方法
JP5539610B2 (ja) * 2007-03-02 2014-07-02 ピーエスフォー ルクスコ エスエイアールエル 相変化メモリのプログラム方法と読み出し方法
US9203024B2 (en) * 2007-07-25 2015-12-01 Intel Corporation Copper compatible chalcogenide phase change memory with adjustable threshold voltage
US7729163B2 (en) * 2008-03-26 2010-06-01 Micron Technology, Inc. Phase change memory
US20090257275A1 (en) * 2008-04-09 2009-10-15 Karpov Ilya V Seasoning phase change memories
US20100090189A1 (en) * 2008-09-15 2010-04-15 Savransky Semyon D Nanoscale electrical device
US8377741B2 (en) * 2008-12-30 2013-02-19 Stmicroelectronics S.R.L. Self-heating phase change memory cell architecture
US8148707B2 (en) * 2008-12-30 2012-04-03 Stmicroelectronics S.R.L. Ovonic threshold switch film composition for TSLAGS material
KR101333751B1 (ko) * 2009-09-11 2013-11-28 도호쿠 다이가쿠 상변화 재료 및 상변화형 메모리 소자
US8345472B2 (en) * 2010-12-21 2013-01-01 Intel Corporation Three-terminal ovonic threshold switch as a current driver in a phase change memory
JP5524115B2 (ja) * 2011-03-22 2014-06-18 株式会社東芝 不揮発性半導体記憶装置
KR101431656B1 (ko) 2013-04-05 2014-08-21 한국과학기술연구원 저머늄 및 셀레늄을 이용한 칼코지나이드 스위칭 소자 및 그 제조방법
US8953387B2 (en) 2013-06-10 2015-02-10 Micron Technology, Inc. Apparatuses and methods for efficient write in a cross-point array
US9214229B2 (en) * 2013-06-21 2015-12-15 Macronix International Co., Ltd. Phase change memory material and system for embedded memory applications
US9312005B2 (en) 2013-09-10 2016-04-12 Micron Technology, Inc. Accessing memory cells in parallel in a cross-point array
JP6151650B2 (ja) * 2014-01-17 2017-06-21 ソニーセミコンダクタソリューションズ株式会社 記憶装置
US10084017B2 (en) 2014-01-17 2018-09-25 Sony Semiconductor Solutions Corporation Switch device and storage unit having a switch layer between first and second electrodes
US9324423B2 (en) 2014-05-07 2016-04-26 Micron Technology, Inc. Apparatuses and methods for bi-directional access of cross-point arrays
WO2016052097A1 (ja) * 2014-09-30 2016-04-07 ソニー株式会社 スイッチ素子および記憶装置
CN104966779B (zh) * 2015-07-31 2017-08-01 华中科技大学 基于数字双向脉冲对相变存储单元非晶态和晶态剪裁的方法
US9978810B2 (en) 2015-11-04 2018-05-22 Micron Technology, Inc. Three-dimensional memory apparatuses and methods of use
US10134470B2 (en) * 2015-11-04 2018-11-20 Micron Technology, Inc. Apparatuses and methods including memory and operation of same
JP6567441B2 (ja) * 2016-02-09 2019-08-28 株式会社東芝 超格子メモリ及びクロスポイント型メモリ装置
JP2017224688A (ja) * 2016-06-14 2017-12-21 ソニー株式会社 回路素子、記憶装置、電子機器、回路素子への情報の書き込み方法、および回路素子からの情報の読み出し方法
US10446226B2 (en) 2016-08-08 2019-10-15 Micron Technology, Inc. Apparatuses including multi-level memory cells and methods of operation of same
US10157670B2 (en) 2016-10-28 2018-12-18 Micron Technology, Inc. Apparatuses including memory cells and methods of operation of same
US10727405B2 (en) 2017-03-22 2020-07-28 Micron Technology, Inc. Chalcogenide memory device components and composition
US10163977B1 (en) * 2017-03-22 2018-12-25 Micron Technology, Inc. Chalcogenide memory device components and composition
US10381075B2 (en) 2017-12-14 2019-08-13 Micron Technology, Inc. Techniques to access a self-selecting memory device
US10546632B2 (en) * 2017-12-14 2020-01-28 Micron Technology, Inc. Multi-level self-selecting memory device
CN111771274A (zh) * 2018-03-02 2020-10-13 索尼半导体解决方案公司 开关元件、存储装置和存储器系统
US11196401B2 (en) 2018-08-14 2021-12-07 Newport Fab, Llc Radio frequency (RF) module using a tunable RF filter with non-volatile RF switches
US10978639B2 (en) 2018-08-14 2021-04-13 Newport Fab, Llc Circuits for reducing RF signal interference and for reducing DC power loss in phase-change material (PCM) RF switches
US10749109B2 (en) 2018-08-14 2020-08-18 Newport Fab, Llc Read out integrated circuit (ROIC) for rapid testing and characterization of resistivity change of heating element in phase-change material (PCM) radio frequency (RF) switch
US10529922B1 (en) 2018-08-14 2020-01-07 Newport Fab, Llc Substrates and heat spreaders for heat management and RF isolation in integrated semiconductor devices having phase-change material (PCM) radio frequency (RF) switches
US10862477B2 (en) 2018-08-14 2020-12-08 Newport Fab, Llc Read out integrated circuit (ROIC) for rapid testing of functionality of phase-change material (PCM) radio frequency (RF) switches
US10944052B2 (en) 2018-08-14 2021-03-09 Newport Fab, Llc Phase-change material (PCM) radio frequency (RF) switch using a chemically protective and thermally conductive layer
US10739290B2 (en) 2018-08-14 2020-08-11 Newport Fab, Llc Read out integrated circuit (ROIC) for rapid testing and characterization of conductivity skew of phase-change material (PCM) in PCM radio frequency (RF) switches
US10593404B2 (en) * 2018-08-14 2020-03-17 Newport Fab, Llc Array architecture for large scale integration of phase-change material (PCM) radio frequency (RF) switches
US11158794B2 (en) 2018-08-14 2021-10-26 Newport Fab, Llc High-yield tunable radio frequency (RF) filter with auxiliary capacitors and non-volatile RF switches
KR102636534B1 (ko) * 2018-08-20 2024-02-15 에스케이하이닉스 주식회사 칼코게나이드 재료 및 이를 포함하는 전자 장치
KR102635268B1 (ko) * 2018-08-20 2024-02-13 에스케이하이닉스 주식회사 칼코게나이드 재료 및 이를 포함하는 전자 장치
JP2020047316A (ja) * 2018-09-14 2020-03-26 キオクシア株式会社 不揮発性記憶装置
KR102614852B1 (ko) 2018-11-14 2023-12-19 삼성전자주식회사 메모리 장치, 메모리 셀 및 메모리 셀 프로그래밍 방법
KR20200139499A (ko) 2019-06-04 2020-12-14 에스케이하이닉스 주식회사 전자 장치 및 메모리 셀의 동작 방법
US11443805B2 (en) 2019-06-04 2022-09-13 SK Hynix Inc. Electronic device and method of operating memory cell in the electronic device
DE112020007189T5 (de) 2020-05-13 2023-04-20 Micron Technology, Inc. Zählerbasierte verfahren und systeme zum zugreifen auf speicherzellen
US11367484B1 (en) 2021-01-21 2022-06-21 Micron Technology, Inc. Multi-step pre-read for write operations in memory devices
CN112863573B (zh) * 2021-01-27 2023-04-14 长江先进存储产业创新中心有限责任公司 一种确定用于对存储器执行操作的参考电压的方法
JP2022147118A (ja) * 2021-03-23 2022-10-06 ソニーセミコンダクタソリューションズ株式会社 不揮発性記憶装置
US11514983B2 (en) 2021-04-02 2022-11-29 Micron Technology, Inc. Identify the programming mode of memory cells based on cell statistics obtained during reading of the memory cells
US11664073B2 (en) 2021-04-02 2023-05-30 Micron Technology, Inc. Adaptively programming memory cells in different modes to optimize performance
US11615854B2 (en) 2021-04-02 2023-03-28 Micron Technology, Inc. Identify the programming mode of memory cells during reading of the memory cells
US11664074B2 (en) 2021-06-02 2023-05-30 Micron Technology, Inc. Programming intermediate state to store data in self-selecting memory cells
US11694747B2 (en) 2021-06-03 2023-07-04 Micron Technology, Inc. Self-selecting memory cells configured to store more than one bit per memory cell
US11996145B2 (en) 2022-05-03 2024-05-28 Western Digital Technologies, Inc. Cross-point array with threshold switching selector memory element

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4199692A (en) 1978-05-16 1980-04-22 Harris Corporation Amorphous non-volatile ram
US4236231A (en) * 1979-10-09 1980-11-25 Harris Corporation Programmable threshold switchable resistive memory cell array
US5534712A (en) 1991-01-18 1996-07-09 Energy Conversion Devices, Inc. Electrically erasable memory elements characterized by reduced current and improved thermal stability
JP3454821B2 (ja) * 1991-08-19 2003-10-06 エナージー・コンバーション・デバイセス・インコーポレーテッド 電気的に消去可能な、直接重ね書き可能なマルチビット単セルメモリ素子およびそれらから作製したアレイ
US5825046A (en) * 1996-10-28 1998-10-20 Energy Conversion Devices, Inc. Composite memory material comprising a mixture of phase-change memory material and dielectric material
US6570784B2 (en) * 2001-06-29 2003-05-27 Ovonyx, Inc. Programming a phase-change material memory
EP1324345A1 (en) * 2001-12-27 2003-07-02 STMicroelectronics S.r.l. Single supply voltage, nonvolatile memory device with cascoded column decoding
JP4103497B2 (ja) * 2002-04-18 2008-06-18 ソニー株式会社 記憶装置とその製造方法および使用方法、半導体装置とその製造方法
US6831856B2 (en) * 2002-09-23 2004-12-14 Ovonyx, Inc. Method of data storage using only amorphous phase of electrically programmable phase-change memory element
EP1420412B1 (en) * 2002-11-18 2008-07-09 STMicroelectronics S.r.l. Circuit and method for temperature tracing of devices including an element of chalcogenic material, in particular phase change memory devices
US6828081B2 (en) * 2002-12-10 2004-12-07 Macronix International Co., Ltd. Method and system for lithography using phase-change material
US7589343B2 (en) * 2002-12-13 2009-09-15 Intel Corporation Memory and access device and method therefor
JP2004241535A (ja) * 2003-02-05 2004-08-26 Matsushita Electric Ind Co Ltd 抵抗変化素子および製造方法
KR100486306B1 (ko) * 2003-02-24 2005-04-29 삼성전자주식회사 셀프 히터 구조를 가지는 상변화 메모리 소자
EP1609154B1 (en) * 2003-03-18 2013-12-25 Kabushiki Kaisha Toshiba Phase change memory device
JP4792714B2 (ja) * 2003-11-28 2011-10-12 ソニー株式会社 記憶素子及び記憶装置
KR100733147B1 (ko) * 2004-02-25 2007-06-27 삼성전자주식회사 상변화 메모리 장치 및 그 제조 방법
JP5281746B2 (ja) * 2004-05-14 2013-09-04 ルネサスエレクトロニクス株式会社 半導体記憶装置
US20060056233A1 (en) * 2004-09-10 2006-03-16 Parkinson Ward D Using a phase change memory as a replacement for a buffered flash memory
JP4254688B2 (ja) * 2004-10-29 2009-04-15 ティアック株式会社 光ディスク装置及びそのデータ記録装置
US7307268B2 (en) * 2005-01-19 2007-12-11 Sandisk Corporation Structure and method for biasing phase change memory array for reliable writing
KR100794654B1 (ko) * 2005-07-06 2008-01-14 삼성전자주식회사 상 변화 메모리 장치 및 그것의 프로그램 방법
US20070249086A1 (en) * 2006-04-19 2007-10-25 Philipp Jan B Phase change memory
US7414883B2 (en) * 2006-04-20 2008-08-19 Intel Corporation Programming a normally single phase chalcogenide material for use as a memory or FPLA

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI572574B (zh) * 2015-03-20 2017-03-01 英特爾公司 硫族玻璃組成物及硫族開關裝置
US11183633B2 (en) 2016-10-04 2021-11-23 Sony Semiconductor Solutions Corporation Switch device, storage apparatus, and memory system
TWI698980B (zh) * 2018-07-17 2020-07-11 旺宏電子股份有限公司 開關元件與記憶體元件

Also Published As

Publication number Publication date
US20080273379A1 (en) 2008-11-06
KR20080114801A (ko) 2008-12-31
US20070247899A1 (en) 2007-10-25
WO2007127014A3 (en) 2008-06-26
JP2009534835A (ja) 2009-09-24
JP5678118B2 (ja) 2015-02-25
CN101427396A (zh) 2009-05-06
JP2013179311A (ja) 2013-09-09
US7414883B2 (en) 2008-08-19
US7864567B2 (en) 2011-01-04
TWI342023B (en) 2011-05-11
KR101196933B1 (ko) 2012-11-05
WO2007127014A2 (en) 2007-11-08
CN101427396B (zh) 2012-06-27
KR20110046563A (ko) 2011-05-04
KR101238503B1 (ko) 2013-03-04

Similar Documents

Publication Publication Date Title
TW200746145A (en) Programming a normally single phase chalcogenide material for use as a memory or FPLA
TW200733358A (en) Memory cell comprising switchable semiconductor memory element with trimmable resistance
TWI410973B (en) Memory device program window adjustment
GB2433647B (en) Phase change memory materials, devices and methods
TW200516794A (en) Phase change access device for memories
WO2007008699A3 (en) Apparatus and method for reading an array of nonvolatile memory cells including switchable resistor memory elements
EP1858021A2 (en) Phase change memory having temperature budget sensor
TW200603154A (en) Phase change memories and/or methods of programming phase change memories using sequential reset control
WO2011037703A3 (en) Methods of reading and using memory cells
TW200733113A (en) Reversible resistivity-switching metal oxide or nitride layer with added metal
TW200634826A (en) Non-volatile memory and method with power-saving read and program-verify operations
DE602004031139D1 (de) Programmierungsverfahren auf der basis des verhaltens nichtflüchtiger speicherzellen
WO2012044635A3 (en) Sensing for nand memory based on word line position
WO2009061093A3 (en) Storage array including a local clock buffer with programmable timing
ATE521972T1 (de) Programmierung eines nicht-flüchtigen speichers mit selbst-regulierender maximaler programmschleife
WO2007078885A3 (en) Multi-level memory cell sensing
IT1392578B1 (it) Metodo di programmazione multilivello di celle di memoria a cambiamento di fase utilizzante impulsi di reset adattativi
JP2009541909A5 (zh)
EP2193545A4 (en) VERTICAL DIODE-BASED MEMORY CELLS WITH A REDUCED PROGRAMMING VOLTAGE AND MANUFACTURING METHOD THEREFOR
US20080130351A1 (en) Multi-bit resistive memory
KR20140080945A (ko) 비휘발성 메모리 장치
TW200623119A (en) Nonvolatile ferroelectric memory device
GB2498281A (en) Storage element reading using ring oscillator
WO2009075315A1 (ja) 記憶装置および情報再記録方法
DE60320116D1 (de) Zusammensetzung enthaltend ein flüssigkristallines Material und einen Zusatzstoff

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees