WO2009075315A1 - 記憶装置および情報再記録方法 - Google Patents

記憶装置および情報再記録方法 Download PDF

Info

Publication number
WO2009075315A1
WO2009075315A1 PCT/JP2008/072488 JP2008072488W WO2009075315A1 WO 2009075315 A1 WO2009075315 A1 WO 2009075315A1 JP 2008072488 W JP2008072488 W JP 2008072488W WO 2009075315 A1 WO2009075315 A1 WO 2009075315A1
Authority
WO
WIPO (PCT)
Prior art keywords
power supply
voltage
supplied
reduced
storage device
Prior art date
Application number
PCT/JP2008/072488
Other languages
English (en)
French (fr)
Inventor
Tsunenori Shiimoto
Tomohito Tsushima
Shuichiro Yasuda
Original Assignee
Sony Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corporation filed Critical Sony Corporation
Priority to CN200880119293.8A priority Critical patent/CN101889311B/zh
Priority to US12/747,832 priority patent/US8369128B2/en
Publication of WO2009075315A1 publication Critical patent/WO2009075315A1/ja

Links

Classifications

    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0007Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements comprising metal oxide memory material, e.g. perovskites
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0004Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements comprising amorphous/crystalline phase transition cells
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021Auxiliary circuits
    • G11C13/0069Writing or programming circuits or methods
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021Auxiliary circuits
    • G11C13/0069Writing or programming circuits or methods
    • G11C2013/0071Write using write potential applied to access device gate
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021Auxiliary circuits
    • G11C13/0069Writing or programming circuits or methods
    • G11C2013/0073Write using bi-directional cell biasing
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021Auxiliary circuits
    • G11C13/0069Writing or programming circuits or methods
    • G11C2013/009Write using potential difference applied between cell electrodes
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C2213/00Indexing scheme relating to G11C13/00 for features not covered by this group
    • G11C2213/50Resistive cell structure aspects
    • G11C2213/56Structure including two electrodes, a memory active layer and a so called passive or source or reservoir layer which is NOT an electrode, wherein the passive or source or reservoir layer is a source of ions which migrate afterwards in the memory active layer to be only trapped there, to form conductive filaments there or to react with the material of the memory active layer in redox way
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C2213/00Indexing scheme relating to G11C13/00 for features not covered by this group
    • G11C2213/70Resistive array aspects
    • G11C2213/79Array wherein the access device being a transistor
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C2213/00Indexing scheme relating to G11C13/00 for features not covered by this group
    • G11C2213/70Resistive array aspects
    • G11C2213/82Array having, for accessing a cell, a word line, a bit line and a plate or source line receiving different potentials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Semiconductor Memories (AREA)
  • Read Only Memory (AREA)

Abstract

 制御を要する電圧を減らし、周辺回路規模を小さくすることのできる記憶装置を提供する。可変抵抗素子10の電極11にはビット線BLRを介して第1電源21より第1パルス電圧(VBLR)、トランジスタ20の制御端子20cにはワード線WLを介して第2電源22よりセル選択用の第2パルス電圧(VWL)、トランジスタ20の第2入出力端子20bにはビット線BLTを介して第3電源23より第3パルス電圧(VBLT)がそれぞれ供給される。情報の再書き込み時において、調整回路24により第3電源23の電圧値(VBLT)を調整することにより、セル電圧およびセル電流を変更(減少または増加)する。
PCT/JP2008/072488 2007-12-12 2008-12-11 記憶装置および情報再記録方法 WO2009075315A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN200880119293.8A CN101889311B (zh) 2007-12-12 2008-12-11 存储装置及信息再记录方法
US12/747,832 US8369128B2 (en) 2007-12-12 2008-12-11 Storage device and information rerecording method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007320578A JP2009146478A (ja) 2007-12-12 2007-12-12 記憶装置および情報再記録方法
JP2007-320578 2007-12-12

Publications (1)

Publication Number Publication Date
WO2009075315A1 true WO2009075315A1 (ja) 2009-06-18

Family

ID=40755555

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/072488 WO2009075315A1 (ja) 2007-12-12 2008-12-11 記憶装置および情報再記録方法

Country Status (6)

Country Link
US (1) US8369128B2 (ja)
JP (1) JP2009146478A (ja)
KR (1) KR20100097678A (ja)
CN (1) CN101889311B (ja)
TW (1) TWI400706B (ja)
WO (1) WO2009075315A1 (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4635235B2 (ja) * 2008-10-30 2011-02-23 独立行政法人産業技術総合研究所 固体メモリ
JP4846813B2 (ja) * 2009-03-12 2011-12-28 株式会社東芝 不揮発性半導体記憶装置
JP5604844B2 (ja) * 2009-10-02 2014-10-15 日本電気株式会社 記憶装置、及び記憶装置の動作方法
JP5418147B2 (ja) * 2009-10-26 2014-02-19 日本電気株式会社 素子制御回路、スイッチング素子及び素子制御方法
US8921821B2 (en) 2013-01-10 2014-12-30 Micron Technology, Inc. Memory cells
JP5830655B2 (ja) * 2013-04-30 2015-12-09 パナソニックIpマネジメント株式会社 不揮発性記憶素子の駆動方法
WO2017150028A1 (ja) * 2016-02-29 2017-09-08 ソニー株式会社 半導体回路、半導体回路の駆動方法、および電子機器
CN108962313A (zh) * 2017-05-23 2018-12-07 旺宏电子股份有限公司 存储器操作方法及存储器操作装置
CN109271742B (zh) * 2018-10-29 2022-11-08 成都师范学院 磁控忆阶元

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004185755A (ja) * 2002-12-05 2004-07-02 Sharp Corp 不揮発性半導体記憶装置
JP2004185723A (ja) * 2002-12-03 2004-07-02 Sharp Corp 半導体記憶装置およびそのデータ書き込み制御方法
JP2006202411A (ja) * 2005-01-20 2006-08-03 Sharp Corp 不揮発性半導体記憶装置及びその制御方法
JP2007018615A (ja) * 2005-07-08 2007-01-25 Sony Corp 記憶装置及び半導体装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6909633B2 (en) 2002-12-09 2005-06-21 Applied Spintronics Technology, Inc. MRAM architecture with a flux closed data storage layer
JP4113493B2 (ja) * 2003-06-12 2008-07-09 シャープ株式会社 不揮発性半導体記憶装置及びその制御方法
JP4475174B2 (ja) * 2005-06-09 2010-06-09 ソニー株式会社 記憶装置
KR20070075812A (ko) * 2006-01-16 2007-07-24 삼성전자주식회사 스토리지 노드에 비정질 고체 전해질층을 포함하는 저항성메모리 소자

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004185723A (ja) * 2002-12-03 2004-07-02 Sharp Corp 半導体記憶装置およびそのデータ書き込み制御方法
JP2004185755A (ja) * 2002-12-05 2004-07-02 Sharp Corp 不揮発性半導体記憶装置
JP2006202411A (ja) * 2005-01-20 2006-08-03 Sharp Corp 不揮発性半導体記憶装置及びその制御方法
JP2007018615A (ja) * 2005-07-08 2007-01-25 Sony Corp 記憶装置及び半導体装置

Also Published As

Publication number Publication date
US20110149635A1 (en) 2011-06-23
KR20100097678A (ko) 2010-09-03
TW200943297A (en) 2009-10-16
JP2009146478A (ja) 2009-07-02
CN101889311B (zh) 2013-07-24
US8369128B2 (en) 2013-02-05
CN101889311A (zh) 2010-11-17
TWI400706B (zh) 2013-07-01

Similar Documents

Publication Publication Date Title
WO2009075315A1 (ja) 記憶装置および情報再記録方法
CN101636792B (zh) 电阻变化型存储器件
US8947924B2 (en) Data readout circuit of phase change memory
US7719873B2 (en) Memory and semiconductor device with memory state detection
WO2009069690A1 (ja) メモリセル
US8213214B2 (en) Storage device and information rerecording method
GB2432701B (en) Control of memory devices possessing variable resistance characteristics
TW200620276A (en) Nonvolatile semiconductor memory device and read method
JP2005267837A5 (ja)
KR20140080945A (ko) 비휘발성 메모리 장치
WO2007008701A3 (en) Apparatus and method for programming an array of nonvolatile memory cells including switchable resistor memory elements
TW200710678A (en) Apparatus and method for reading an array of nonvolatile memory cells including switchable resistor memory elements
WO2007078885A3 (en) Multi-level memory cell sensing
TW200709398A (en) Process for erasing chalcogenide variable resistance memory bits
EP1571673A3 (en) Memory device
WO2008126166A1 (ja) 不揮発性半導体記憶装置及びその読み出し方法
CN104036824A (zh) 半导体装置和信息读取方法
TW200614235A (en) Data readout circuit and semiconductor device having the same
TW200723280A (en) Resistive memory devices including selected reference memory cells and methods of operating the same
JP2009259379A5 (ja)
US20080043513A1 (en) Intergrated circuit having memory with resistive memory cells
GB2457408A (en) Sensing device for floating body cell memory and method thereof
CN107195323A (zh) 基于忆阻器的双差分负反馈数据读取电路及其方法
JP2006073165A5 (ja)
TW200723306A (en) Semiconductor memory device and method of controlling sub word line driver thereof

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200880119293.8

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08859231

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 20107012517

Country of ref document: KR

Kind code of ref document: A

WWE Wipo information: entry into national phase

Ref document number: 12747832

Country of ref document: US

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08859231

Country of ref document: EP

Kind code of ref document: A1