TW200739785A - Object conveyance apparatus, exposure apparatus, object temperature regulation apparatus, object conveyance method, and method of producing microdevice - Google Patents

Object conveyance apparatus, exposure apparatus, object temperature regulation apparatus, object conveyance method, and method of producing microdevice

Info

Publication number
TW200739785A
TW200739785A TW096101181A TW96101181A TW200739785A TW 200739785 A TW200739785 A TW 200739785A TW 096101181 A TW096101181 A TW 096101181A TW 96101181 A TW96101181 A TW 96101181A TW 200739785 A TW200739785 A TW 200739785A
Authority
TW
Taiwan
Prior art keywords
conveyance
microdevice
object conveyance
producing
temperature regulation
Prior art date
Application number
TW096101181A
Other languages
English (en)
Inventor
Takashi Horiuchi
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of TW200739785A publication Critical patent/TW200739785A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Epidemiology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Toxicology (AREA)
  • Public Health (AREA)
  • Atmospheric Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW096101181A 2006-01-12 2007-01-12 Object conveyance apparatus, exposure apparatus, object temperature regulation apparatus, object conveyance method, and method of producing microdevice TW200739785A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006004379 2006-01-12

Publications (1)

Publication Number Publication Date
TW200739785A true TW200739785A (en) 2007-10-16

Family

ID=38232447

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096101181A TW200739785A (en) 2006-01-12 2007-01-12 Object conveyance apparatus, exposure apparatus, object temperature regulation apparatus, object conveyance method, and method of producing microdevice

Country Status (4)

Country Link
US (1) US20070159615A1 (zh)
JP (1) JPWO2007080779A1 (zh)
TW (1) TW200739785A (zh)
WO (1) WO2007080779A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103972134A (zh) * 2013-01-31 2014-08-06 株式会社迪思科 减压处理装置
CN104780750A (zh) * 2014-01-10 2015-07-15 平田机工株式会社 移载方法、保持装置及移载系统

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JP4884180B2 (ja) * 2006-11-21 2012-02-29 東京エレクトロン株式会社 基板処理装置および基板処理方法
US20080187871A1 (en) * 2007-02-02 2008-08-07 Fujifilm Corporation Pattern forming apparatus and method
JP5148944B2 (ja) 2007-08-14 2013-02-20 大日本スクリーン製造株式会社 基板処理システム
JP5236362B2 (ja) * 2008-06-17 2013-07-17 株式会社日立ハイテクノロジーズ プロキシミティ露光装置及びプロキシミティ露光装置の基板搬送方法
NL2002983A1 (nl) * 2008-06-26 2009-12-29 Asml Netherlands Bv A lithographic apparatus and a method of operating the lithographic apparatus.
JP5241368B2 (ja) * 2008-07-31 2013-07-17 キヤノン株式会社 処理装置及びデバイス製造方法
JP5235566B2 (ja) * 2008-09-01 2013-07-10 キヤノン株式会社 露光装置およびデバイス製造方法
KR20100070888A (ko) * 2008-12-18 2010-06-28 삼성전자주식회사 기판 처리 장치
JP5420892B2 (ja) * 2008-12-27 2014-02-19 株式会社ニューフレアテクノロジー 荷電粒子ビーム描画装置
JP5324231B2 (ja) * 2009-01-08 2013-10-23 日東電工株式会社 半導体ウエハのアライメント装置
NL2005244A (en) * 2009-09-22 2011-03-23 Asml Netherlands Bv Support or table for lithographic apparatus, method of manufacturing such support or table and lithographic apparatus comprising such support or table.
US8321055B2 (en) * 2009-11-03 2012-11-27 Jadak, Llc System and method for multiple view machine vision target location
JP2011211063A (ja) * 2010-03-30 2011-10-20 Sinfonia Technology Co Ltd 基板搬送装置
JP2012048165A (ja) * 2010-08-30 2012-03-08 Hitachi High-Technologies Corp 露光装置、露光装置のステージ温度制御方法、及び表示用パネル基板の製造方法
JP2012151407A (ja) * 2011-01-21 2012-08-09 Ushio Inc ワークステージおよびこのワークステージを使った露光装置
NL2009378A (en) * 2011-10-07 2013-04-09 Asml Netherlands Bv Lithographic apparatus and method of cooling a component in a lithographic apparatus.
TWI575103B (zh) * 2011-10-13 2017-03-21 愛發科股份有限公司 真空處理裝置
US20130092186A1 (en) 2011-10-18 2013-04-18 Taiwan Semiconductor Manufacturing Company, Ltd. Removal of particles on back side of wafer
US10195704B2 (en) * 2013-03-15 2019-02-05 Infineon Technologies Ag Lift pin for substrate processing
US9136243B2 (en) * 2013-12-03 2015-09-15 Kulicke And Soffa Industries, Inc. Systems and methods for determining and adjusting a level of parallelism related to bonding of semiconductor elements
JP5784099B2 (ja) * 2013-12-16 2015-09-24 ニチユ三菱フォークリフト株式会社 無人フォークリフト
US10283398B2 (en) * 2014-10-30 2019-05-07 Tokyo Electron Limited Substrate placing table
DE102016212780A1 (de) * 2016-07-13 2018-01-18 Siltronic Ag Vorrichtung zur Handhabung einer Halbleiterscheibe in einem Epitaxie-Reaktor und Verfahren zur Herstellung einer Halbleiterscheibe mit epitaktischer Schicht
CN106773553B (zh) * 2017-03-06 2018-11-30 重庆京东方光电科技有限公司 承载装置和曝光设备
JP6894281B2 (ja) * 2017-04-12 2021-06-30 株式会社Ｓｃｒｅｅｎホールディングス 露光装置、基板処理装置、基板の露光方法および基板処理方法
JP6854187B2 (ja) * 2017-05-16 2021-04-07 東京エレクトロン株式会社 基板処理装置、基板処理方法、及び記憶媒体
WO2019047244A1 (zh) * 2017-09-11 2019-03-14 深圳市柔宇科技有限公司 机械手臂、曝光机前单元和温度控制方法
JP7094204B2 (ja) * 2018-11-08 2022-07-01 三菱電機株式会社 レンズ調芯装置およびレンズ調芯方法
JP7202176B2 (ja) * 2018-12-21 2023-01-11 キヤノン株式会社 搬送装置、基板処理装置、および物品製造方法
JP7467207B2 (ja) 2020-04-03 2024-04-15 キヤノン株式会社 位置合わせ装置、パターン形成装置及び物品の製造方法
US20240120227A1 (en) * 2022-10-06 2024-04-11 Kawasaki Jukogyo Kabushiki Kaisha Substrate handling apparatus and method of handling substrate

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JPH11251402A (ja) * 1998-02-27 1999-09-17 Super Silicon Kenkyusho:Kk 半導体ウエハ搬送装置
JP2000237983A (ja) * 1999-02-22 2000-09-05 Hitachi Electronics Eng Co Ltd 基板チャック装置
JP2001169529A (ja) * 1999-12-06 2001-06-22 Shinko Electric Co Ltd 移動体および移動体システム
JP4724954B2 (ja) * 2001-06-06 2011-07-13 株式会社ニコン 露光装置、デバイス製造システム
JP4030787B2 (ja) * 2002-03-04 2008-01-09 東京エレクトロン株式会社 基板加熱方法、基板加熱装置及び塗布、現像装置
JP4281447B2 (ja) * 2003-07-09 2009-06-17 住友電気工業株式会社 半導体装置の製造方法
US7304715B2 (en) * 2004-08-13 2007-12-04 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103972134A (zh) * 2013-01-31 2014-08-06 株式会社迪思科 减压处理装置
CN104780750A (zh) * 2014-01-10 2015-07-15 平田机工株式会社 移载方法、保持装置及移载系统
CN104780750B (zh) * 2014-01-10 2017-09-26 平田机工株式会社 移载方法、保持装置及移载系统

Also Published As

Publication number Publication date
US20070159615A1 (en) 2007-07-12
WO2007080779A1 (ja) 2007-07-19
JPWO2007080779A1 (ja) 2009-06-11

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