TW200734419A - Thermal-and chemical-resistant acid protection coating material and spin-on thermoplastic adhesive - Google Patents
Thermal-and chemical-resistant acid protection coating material and spin-on thermoplastic adhesiveInfo
- Publication number
- TW200734419A TW200734419A TW096103324A TW96103324A TW200734419A TW 200734419 A TW200734419 A TW 200734419A TW 096103324 A TW096103324 A TW 096103324A TW 96103324 A TW96103324 A TW 96103324A TW 200734419 A TW200734419 A TW 200734419A
- Authority
- TW
- Taiwan
- Prior art keywords
- spin
- thermal
- chemical
- coating material
- thermoplastic adhesive
- Prior art date
Links
- 239000000853 adhesive Substances 0.000 title abstract 2
- 230000001070 adhesive effect Effects 0.000 title abstract 2
- 239000002253 acid Substances 0.000 title 1
- 239000011248 coating agent Substances 0.000 title 1
- 238000000576 coating method Methods 0.000 title 1
- 239000000463 material Substances 0.000 title 1
- 239000000126 substance Substances 0.000 title 1
- 229920001169 thermoplastic Polymers 0.000 title 1
- 239000004416 thermosoftening plastic Substances 0.000 title 1
- 239000000203 mixture Substances 0.000 abstract 4
- 239000002904 solvent Substances 0.000 abstract 3
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 abstract 1
- 229920002943 EPDM rubber Polymers 0.000 abstract 1
- 239000013032 Hydrocarbon resin Substances 0.000 abstract 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 abstract 1
- 239000000975 dye Substances 0.000 abstract 1
- 229920001971 elastomer Polymers 0.000 abstract 1
- 229920006270 hydrocarbon resin Polymers 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 239000011253 protective coating Substances 0.000 abstract 1
- 239000004094 surface-active agent Substances 0.000 abstract 1
- 150000003505 terpenes Chemical class 0.000 abstract 1
- 235000007586 terpenes Nutrition 0.000 abstract 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J193/00—Adhesives based on natural resins; Adhesives based on derivatives thereof
- C09J193/04—Rosin
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D121/00—Coating compositions based on unspecified rubbers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D193/00—Coating compositions based on natural resins; Coating compositions based on derivatives thereof
- C09D193/04—Rosin
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J121/00—Adhesives based on unspecified rubbers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L21/00—Compositions of unspecified rubbers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
- C08L2666/08—Homopolymers or copolymers according to C08L7/00 - C08L21/00; Derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L9/00—Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31652—Of asbestos
- Y10T428/31667—Next to addition polymer from unsaturated monomers, or aldehyde or ketone condensation product
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Paints Or Removers (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/348,143 US8268449B2 (en) | 2006-02-06 | 2006-02-06 | Thermal- and chemical-resistant acid protection coating material and spin-on thermoplastic adhesive |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200734419A true TW200734419A (en) | 2007-09-16 |
Family
ID=38334906
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW096103324A TW200734419A (en) | 2006-02-06 | 2007-01-30 | Thermal-and chemical-resistant acid protection coating material and spin-on thermoplastic adhesive |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US8268449B2 (enExample) |
| EP (1) | EP2007836A4 (enExample) |
| JP (1) | JP2009529065A (enExample) |
| KR (1) | KR20080096646A (enExample) |
| CN (1) | CN101790570A (enExample) |
| SG (1) | SG169384A1 (enExample) |
| TW (1) | TW200734419A (enExample) |
| WO (1) | WO2007092689A2 (enExample) |
Families Citing this family (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080200011A1 (en) * | 2006-10-06 | 2008-08-21 | Pillalamarri Sunil K | High-temperature, spin-on, bonding compositions for temporary wafer bonding using sliding approach |
| JP5788173B2 (ja) | 2007-06-25 | 2015-09-30 | ブルーワー サイエンス アイ エヌシー. | 高温スピンオン仮接合用組成物 |
| DE102007059848A1 (de) * | 2007-12-12 | 2009-06-25 | Robert Bosch Gmbh | Elektrische Anordnung und Verfahren zur Herstellung einer elektrischen Anordnung |
| DE112009000140B4 (de) * | 2008-01-24 | 2022-06-15 | Brewer Science, Inc. | Verfahren zum reversiblen Anbringen eines Vorrichtungswafers an einem Trägersubstrat und ein daraus erhaltener Gegenstand |
| US8092628B2 (en) * | 2008-10-31 | 2012-01-10 | Brewer Science Inc. | Cyclic olefin compositions for temporary wafer bonding |
| US8771927B2 (en) * | 2009-04-15 | 2014-07-08 | Brewer Science Inc. | Acid-etch resistant, protective coatings |
| KR101345086B1 (ko) * | 2009-06-11 | 2013-12-26 | 하리마 카세이 가부시키가이샤 | 접착제 조성물 |
| US9018308B2 (en) * | 2009-12-01 | 2015-04-28 | Pbi Performance Products, Inc. | Polybenzimidazole/polyacrylate mixtures |
| US8852391B2 (en) | 2010-06-21 | 2014-10-07 | Brewer Science Inc. | Method and apparatus for removing a reversibly mounted device wafer from a carrier substrate |
| US9263314B2 (en) | 2010-08-06 | 2016-02-16 | Brewer Science Inc. | Multiple bonding layers for thin-wafer handling |
| JP5681502B2 (ja) | 2010-09-30 | 2015-03-11 | 東京応化工業株式会社 | 接着剤組成物 |
| US8962723B2 (en) * | 2011-06-15 | 2015-02-24 | Lion Copolymer Geismar, Llc | Durable substrate coating and process for making |
| JP5661669B2 (ja) | 2011-09-30 | 2015-01-28 | 東京応化工業株式会社 | 接着剤組成物、接着フィルムおよび基板の処理方法 |
| KR101746270B1 (ko) | 2011-10-31 | 2017-06-12 | 도오꾜오까고오교 가부시끼가이샤 | 웨이퍼와 당해 웨이퍼의 지지체를 접착하기 위한 접착제 조성물, 및 그 이용 |
| EP2794743B1 (en) * | 2011-12-23 | 2016-07-27 | Frans Nooren Afdichtingssystemen B.V. | Composition for coating a substrate and method for coating a substrate |
| JP6128837B2 (ja) * | 2012-02-21 | 2017-05-17 | 東京応化工業株式会社 | 接着剤組成物の製造方法、接着剤組成物及び接着フィルム |
| JP6063737B2 (ja) * | 2012-03-12 | 2017-01-18 | 東京応化工業株式会社 | 接着剤組成物、接着フィルムおよび基板の処理方法 |
| US9127126B2 (en) | 2012-04-30 | 2015-09-08 | Brewer Science Inc. | Development of high-viscosity bonding layer through in-situ polymer chain extension |
| JP6216575B2 (ja) | 2012-10-25 | 2017-10-18 | 東京応化工業株式会社 | 接着剤組成物及び接着フィルム |
| US9349643B2 (en) | 2013-04-01 | 2016-05-24 | Brewer Science Inc. | Apparatus and method for thin wafer transfer |
| US10103048B2 (en) | 2013-08-28 | 2018-10-16 | Brewer Science, Inc. | Dual-layer bonding material process for temporary bonding of microelectronic substrates to carrier substrates |
| US9865490B2 (en) | 2014-01-07 | 2018-01-09 | Brewer Science Inc. | Cyclic olefin polymer compositions and polysiloxane release layers for use in temporary wafer bonding processes |
| US9496164B2 (en) | 2014-01-07 | 2016-11-15 | Brewer Science Inc. | Cyclic olefin polymer compositions and polysiloxane release layers for use in temporary wafer bonding processes |
| WO2016014648A2 (en) | 2014-07-22 | 2016-01-28 | Brewer Science Inc. | Polyimides as laser release materials for 3-d ic applications |
| SG11202107879PA (en) | 2019-01-22 | 2021-08-30 | Brewer Science Inc | Laser-releasable bonding materials for 3-d ic applications |
| TW202303826A (zh) | 2021-02-15 | 2023-01-16 | 美商布魯爾科技公司 | 防止熱壓結合中金屬連接變形的臨時結合和脫結製程 |
Family Cites Families (46)
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| BE388487A (enExample) * | 1900-01-01 | |||
| GB488557A (en) * | 1937-01-06 | 1938-07-06 | Dunlop Rubber Co | Improvements in or relating to adhesive compositions |
| DE710987C (de) * | 1937-04-14 | 1941-09-24 | Herbig Haarhaus Akt Ges Lackfa | Anstrichmittel |
| US2279256A (en) | 1938-10-27 | 1942-04-07 | Dewey And Almy Chem Comp | Adhesive composition |
| US3297617A (en) | 1963-12-23 | 1967-01-10 | Velsicol Chemical Corp | Coating slurry containing aggregate and aqueous emulsion of petroleumderived hydrocarbon resin |
| US3987122A (en) | 1972-04-03 | 1976-10-19 | Exxon Research And Engineering Company | Thermoplastic adhesive compositions |
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| US4793337A (en) | 1986-11-17 | 1988-12-27 | E. R. Squibb & Sons, Inc. | Adhesive structure and products including same |
| JPH07119328B2 (ja) | 1987-12-18 | 1995-12-20 | 三井石油化学工業株式会社 | 環状オレフィン系ランダム共重合体組成物 |
| ATE133984T1 (de) | 1987-10-08 | 1996-02-15 | Mitsui Petrochemical Ind | Random-cycloolefin-kopolymerzusammensetzung |
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| US5888650A (en) | 1996-06-03 | 1999-03-30 | Minnesota Mining And Manufacturing Company | Temperature-responsive adhesive article |
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| JP2001139755A (ja) | 1999-11-15 | 2001-05-22 | Kanegafuchi Chem Ind Co Ltd | 光学フィルム用樹脂組成物 |
| DE19956422A1 (de) | 1999-11-24 | 2001-06-13 | Hella Kg Hueck & Co | Lösbare Klebstoffe zum Verbinden von Substraten |
| BR0109653B1 (pt) | 2000-03-30 | 2011-08-09 | composição adesiva que compreende um componente termoplástico particulado. | |
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| TW574753B (en) | 2001-04-13 | 2004-02-01 | Sony Corp | Manufacturing method of thin film apparatus and semiconductor device |
| EP1295926A1 (en) | 2001-09-19 | 2003-03-26 | ExxonMobil Chemical Patents Inc. | Components for adhesive compositions and process for manufacture |
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| KR20060126674A (ko) | 2003-11-27 | 2006-12-08 | 제이에스알 가부시끼가이샤 | 핫멜트형 접착제 조성물 |
| JP2006135272A (ja) | 2003-12-01 | 2006-05-25 | Tokyo Ohka Kogyo Co Ltd | 基板のサポートプレート及びサポートプレートの剥離方法 |
| KR100696287B1 (ko) | 2004-01-28 | 2007-03-19 | 미쓰이 가가쿠 가부시키가이샤 | 반도체 웨이퍼의 보호방법 |
| JP2004156048A (ja) | 2004-02-09 | 2004-06-03 | Polyplastics Co | 環状オレフィン系樹脂組成物フィルム |
| DE102004007060B3 (de) | 2004-02-13 | 2005-07-07 | Thallner, Erich, Dipl.-Ing. | Vorrichtung und Verfahren zum Verbinden von Wafern |
| US7541264B2 (en) | 2005-03-01 | 2009-06-02 | Dow Corning Corporation | Temporary wafer bonding method for semiconductor processing |
| JP5220616B2 (ja) | 2006-12-05 | 2013-06-26 | 三井化学株式会社 | 環状オレフィン系重合体組成物、およびその用途 |
-
2006
- 2006-02-06 US US11/348,143 patent/US8268449B2/en active Active
-
2007
- 2007-01-26 CN CN200780004575A patent/CN101790570A/zh active Pending
- 2007-01-26 EP EP07710318A patent/EP2007836A4/en not_active Withdrawn
- 2007-01-26 SG SG201100807-5A patent/SG169384A1/en unknown
- 2007-01-26 WO PCT/US2007/061110 patent/WO2007092689A2/en not_active Ceased
- 2007-01-26 KR KR1020087017286A patent/KR20080096646A/ko not_active Ceased
- 2007-01-26 JP JP2008553452A patent/JP2009529065A/ja active Pending
- 2007-01-30 TW TW096103324A patent/TW200734419A/zh unknown
-
2008
- 2008-08-20 US US12/195,224 patent/US7678861B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| KR20080096646A (ko) | 2008-10-31 |
| WO2007092689A2 (en) | 2007-08-16 |
| SG169384A1 (en) | 2011-03-30 |
| US20080306207A1 (en) | 2008-12-11 |
| JP2009529065A (ja) | 2009-08-13 |
| EP2007836A2 (en) | 2008-12-31 |
| US20070185310A1 (en) | 2007-08-09 |
| EP2007836A4 (en) | 2013-01-23 |
| US7678861B2 (en) | 2010-03-16 |
| CN101790570A (zh) | 2010-07-28 |
| WO2007092689A3 (en) | 2010-03-04 |
| US8268449B2 (en) | 2012-09-18 |
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