SG169384A1 - Thermal-and chemical-resistant acid protection coating material and spin- on thermoplastic adhesive - Google Patents

Thermal-and chemical-resistant acid protection coating material and spin- on thermoplastic adhesive

Info

Publication number
SG169384A1
SG169384A1 SG201100807-5A SG2011008075A SG169384A1 SG 169384 A1 SG169384 A1 SG 169384A1 SG 2011008075 A SG2011008075 A SG 2011008075A SG 169384 A1 SG169384 A1 SG 169384A1
Authority
SG
Singapore
Prior art keywords
spin
thermal
chemical
coating material
thermoplastic adhesive
Prior art date
Application number
SG201100807-5A
Other languages
English (en)
Inventor
John C Moore
Michelle R Fowler
Original Assignee
Brewer Science Inc Us
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Brewer Science Inc Us filed Critical Brewer Science Inc Us
Publication of SG169384A1 publication Critical patent/SG169384A1/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J193/00Adhesives based on natural resins; Adhesives based on derivatives thereof
    • C09J193/04Rosin
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D121/00Coating compositions based on unspecified rubbers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D193/00Coating compositions based on natural resins; Coating compositions based on derivatives thereof
    • C09D193/04Rosin
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J121/00Adhesives based on unspecified rubbers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L21/00Compositions of unspecified rubbers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/04Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
    • C08L2666/08Homopolymers or copolymers according to C08L7/00 - C08L21/00; Derivatives thereof
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L9/00Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31652Of asbestos
    • Y10T428/31667Next to addition polymer from unsaturated monomers, or aldehyde or ketone condensation product

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Paints Or Removers (AREA)
  • Laminated Bodies (AREA)
SG201100807-5A 2006-02-06 2007-01-26 Thermal-and chemical-resistant acid protection coating material and spin- on thermoplastic adhesive SG169384A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/348,143 US8268449B2 (en) 2006-02-06 2006-02-06 Thermal- and chemical-resistant acid protection coating material and spin-on thermoplastic adhesive

Publications (1)

Publication Number Publication Date
SG169384A1 true SG169384A1 (en) 2011-03-30

Family

ID=38334906

Family Applications (1)

Application Number Title Priority Date Filing Date
SG201100807-5A SG169384A1 (en) 2006-02-06 2007-01-26 Thermal-and chemical-resistant acid protection coating material and spin- on thermoplastic adhesive

Country Status (8)

Country Link
US (2) US8268449B2 (enExample)
EP (1) EP2007836A4 (enExample)
JP (1) JP2009529065A (enExample)
KR (1) KR20080096646A (enExample)
CN (1) CN101790570A (enExample)
SG (1) SG169384A1 (enExample)
TW (1) TW200734419A (enExample)
WO (1) WO2007092689A2 (enExample)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080200011A1 (en) * 2006-10-06 2008-08-21 Pillalamarri Sunil K High-temperature, spin-on, bonding compositions for temporary wafer bonding using sliding approach
JP5788173B2 (ja) 2007-06-25 2015-09-30 ブルーワー サイエンス アイ エヌシー. 高温スピンオン仮接合用組成物
DE102007059848A1 (de) * 2007-12-12 2009-06-25 Robert Bosch Gmbh Elektrische Anordnung und Verfahren zur Herstellung einer elektrischen Anordnung
DE112009000140B4 (de) * 2008-01-24 2022-06-15 Brewer Science, Inc. Verfahren zum reversiblen Anbringen eines Vorrichtungswafers an einem Trägersubstrat und ein daraus erhaltener Gegenstand
US8092628B2 (en) * 2008-10-31 2012-01-10 Brewer Science Inc. Cyclic olefin compositions for temporary wafer bonding
US8771927B2 (en) * 2009-04-15 2014-07-08 Brewer Science Inc. Acid-etch resistant, protective coatings
KR101345086B1 (ko) * 2009-06-11 2013-12-26 하리마 카세이 가부시키가이샤 접착제 조성물
US9018308B2 (en) * 2009-12-01 2015-04-28 Pbi Performance Products, Inc. Polybenzimidazole/polyacrylate mixtures
US8852391B2 (en) 2010-06-21 2014-10-07 Brewer Science Inc. Method and apparatus for removing a reversibly mounted device wafer from a carrier substrate
US9263314B2 (en) 2010-08-06 2016-02-16 Brewer Science Inc. Multiple bonding layers for thin-wafer handling
JP5681502B2 (ja) 2010-09-30 2015-03-11 東京応化工業株式会社 接着剤組成物
US8962723B2 (en) * 2011-06-15 2015-02-24 Lion Copolymer Geismar, Llc Durable substrate coating and process for making
JP5661669B2 (ja) 2011-09-30 2015-01-28 東京応化工業株式会社 接着剤組成物、接着フィルムおよび基板の処理方法
KR101746270B1 (ko) 2011-10-31 2017-06-12 도오꾜오까고오교 가부시끼가이샤 웨이퍼와 당해 웨이퍼의 지지체를 접착하기 위한 접착제 조성물, 및 그 이용
EP2794743B1 (en) * 2011-12-23 2016-07-27 Frans Nooren Afdichtingssystemen B.V. Composition for coating a substrate and method for coating a substrate
JP6128837B2 (ja) * 2012-02-21 2017-05-17 東京応化工業株式会社 接着剤組成物の製造方法、接着剤組成物及び接着フィルム
JP6063737B2 (ja) * 2012-03-12 2017-01-18 東京応化工業株式会社 接着剤組成物、接着フィルムおよび基板の処理方法
US9127126B2 (en) 2012-04-30 2015-09-08 Brewer Science Inc. Development of high-viscosity bonding layer through in-situ polymer chain extension
JP6216575B2 (ja) 2012-10-25 2017-10-18 東京応化工業株式会社 接着剤組成物及び接着フィルム
US9349643B2 (en) 2013-04-01 2016-05-24 Brewer Science Inc. Apparatus and method for thin wafer transfer
US10103048B2 (en) 2013-08-28 2018-10-16 Brewer Science, Inc. Dual-layer bonding material process for temporary bonding of microelectronic substrates to carrier substrates
US9865490B2 (en) 2014-01-07 2018-01-09 Brewer Science Inc. Cyclic olefin polymer compositions and polysiloxane release layers for use in temporary wafer bonding processes
US9496164B2 (en) 2014-01-07 2016-11-15 Brewer Science Inc. Cyclic olefin polymer compositions and polysiloxane release layers for use in temporary wafer bonding processes
WO2016014648A2 (en) 2014-07-22 2016-01-28 Brewer Science Inc. Polyimides as laser release materials for 3-d ic applications
SG11202107879PA (en) 2019-01-22 2021-08-30 Brewer Science Inc Laser-releasable bonding materials for 3-d ic applications
TW202303826A (zh) 2021-02-15 2023-01-16 美商布魯爾科技公司 防止熱壓結合中金屬連接變形的臨時結合和脫結製程

Family Cites Families (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE388487A (enExample) * 1900-01-01
GB488557A (en) * 1937-01-06 1938-07-06 Dunlop Rubber Co Improvements in or relating to adhesive compositions
DE710987C (de) * 1937-04-14 1941-09-24 Herbig Haarhaus Akt Ges Lackfa Anstrichmittel
US2279256A (en) 1938-10-27 1942-04-07 Dewey And Almy Chem Comp Adhesive composition
US3297617A (en) 1963-12-23 1967-01-10 Velsicol Chemical Corp Coating slurry containing aggregate and aqueous emulsion of petroleumderived hydrocarbon resin
US3987122A (en) 1972-04-03 1976-10-19 Exxon Research And Engineering Company Thermoplastic adhesive compositions
US3868433A (en) 1972-04-03 1975-02-25 Exxon Research Engineering Co Thermoplastic adhesive compositions
US3959062A (en) 1972-08-10 1976-05-25 E. I. Du Pont De Nemours And Company Method of joining surfaces using segmented copolyester adhesive
US3970494A (en) 1975-04-18 1976-07-20 Western Electric Co., Inc. Method for adhering one surface to another
JPS5996112A (ja) 1982-11-26 1984-06-02 Toyo Soda Mfg Co Ltd 高純度イソプレン重合体環化物の製造方法
US4793337A (en) 1986-11-17 1988-12-27 E. R. Squibb & Sons, Inc. Adhesive structure and products including same
JPH07119328B2 (ja) 1987-12-18 1995-12-20 三井石油化学工業株式会社 環状オレフィン系ランダム共重合体組成物
ATE133984T1 (de) 1987-10-08 1996-02-15 Mitsui Petrochemical Ind Random-cycloolefin-kopolymerzusammensetzung
JP3221720B2 (ja) 1992-03-25 2001-10-22 出光興産株式会社 環状オレフィン系共重合体組成物
JP3359080B2 (ja) 1993-03-23 2002-12-24 東京応化工業株式会社 耐酸性保護膜形成用塗布液及びそれを用いた半導体素子の製造方法
TW383332B (en) * 1995-02-14 2000-03-01 Toyo Chemicals Co Ltd Pressure-sensitive adhesive for attaching semiconductor wafer onto sheet
US5844309A (en) * 1995-03-20 1998-12-01 Fujitsu Limited Adhesive composition, semiconductor device using the composition and method for producing a semiconductor device using the composition
US5645603A (en) * 1995-07-25 1997-07-08 Peters; William E. Method of enhancing physical properties of non-elastomeric thermoplastic materials and resulting compositions
JPH09176398A (ja) 1995-12-22 1997-07-08 Mitsui Petrochem Ind Ltd 環状オレフィン系樹脂組成物およびその用途
US5888650A (en) 1996-06-03 1999-03-30 Minnesota Mining And Manufacturing Company Temperature-responsive adhesive article
US6054363A (en) 1996-11-15 2000-04-25 Canon Kabushiki Kaisha Method of manufacturing semiconductor article
WO1998033861A1 (en) 1997-01-30 1998-08-06 Mitsui Chemicals, Inc. Hot melt adhesive compositions
JP4164136B2 (ja) * 1997-08-04 2008-10-08 コニシ株式会社 スチレンブロック共重合体ゴム系接着剤組成物
US6110999A (en) 1998-03-06 2000-08-29 Denovus Llc Reusable adhesive composition and method of making the same
US6440259B1 (en) 1999-08-04 2002-08-27 3M Innovative Properties Company One-part storage-stable water-based contact adhesive composition with an internal coagulant
JP2001139755A (ja) 1999-11-15 2001-05-22 Kanegafuchi Chem Ind Co Ltd 光学フィルム用樹脂組成物
DE19956422A1 (de) 1999-11-24 2001-06-13 Hella Kg Hueck & Co Lösbare Klebstoffe zum Verbinden von Substraten
BR0109653B1 (pt) 2000-03-30 2011-08-09 composição adesiva que compreende um componente termoplástico particulado.
KR100314881B1 (ko) * 2000-06-24 2001-12-22 정하승 폴리올레핀 타입의 편향 요크용 핫멜트 조성물
KR20030042454A (ko) 2000-08-22 2003-05-28 제온 코포레이션 필름 적층 방법
TW574753B (en) 2001-04-13 2004-02-01 Sony Corp Manufacturing method of thin film apparatus and semiconductor device
EP1295926A1 (en) 2001-09-19 2003-03-26 ExxonMobil Chemical Patents Inc. Components for adhesive compositions and process for manufacture
DE10213227A1 (de) 2002-03-25 2003-10-16 Bayer Ag Zusammensetzung
AU2003234794A1 (en) 2002-05-13 2003-11-11 Jsr Corporation Composition and method for temporarily fixing solid
US20050228157A1 (en) * 2002-06-14 2005-10-13 Peterson Curt E Thermoplastic elastomer bonded directly to metal substrate
US6828020B2 (en) 2002-08-14 2004-12-07 Adco Products, Inc. Self-adhesive vibration damping tape and composition
US6869894B2 (en) 2002-12-20 2005-03-22 General Chemical Corporation Spin-on adhesive for temporary wafer coating and mounting to support wafer thinning and backside processing
DE10334576B4 (de) 2003-07-28 2007-04-05 Infineon Technologies Ag Verfahren zum Herstellen eines Halbleiterbauelements mit einem Kunststoffgehäuse
US7084201B2 (en) 2003-11-14 2006-08-01 Wall-Guard Corporation Of Ohio Non-flammable waterproofing composition
KR20060126674A (ko) 2003-11-27 2006-12-08 제이에스알 가부시끼가이샤 핫멜트형 접착제 조성물
JP2006135272A (ja) 2003-12-01 2006-05-25 Tokyo Ohka Kogyo Co Ltd 基板のサポートプレート及びサポートプレートの剥離方法
KR100696287B1 (ko) 2004-01-28 2007-03-19 미쓰이 가가쿠 가부시키가이샤 반도체 웨이퍼의 보호방법
JP2004156048A (ja) 2004-02-09 2004-06-03 Polyplastics Co 環状オレフィン系樹脂組成物フィルム
DE102004007060B3 (de) 2004-02-13 2005-07-07 Thallner, Erich, Dipl.-Ing. Vorrichtung und Verfahren zum Verbinden von Wafern
US7541264B2 (en) 2005-03-01 2009-06-02 Dow Corning Corporation Temporary wafer bonding method for semiconductor processing
JP5220616B2 (ja) 2006-12-05 2013-06-26 三井化学株式会社 環状オレフィン系重合体組成物、およびその用途

Also Published As

Publication number Publication date
KR20080096646A (ko) 2008-10-31
WO2007092689A2 (en) 2007-08-16
TW200734419A (en) 2007-09-16
US20080306207A1 (en) 2008-12-11
JP2009529065A (ja) 2009-08-13
EP2007836A2 (en) 2008-12-31
US20070185310A1 (en) 2007-08-09
EP2007836A4 (en) 2013-01-23
US7678861B2 (en) 2010-03-16
CN101790570A (zh) 2010-07-28
WO2007092689A3 (en) 2010-03-04
US8268449B2 (en) 2012-09-18

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