JP2009529065A - 耐熱耐薬品性酸保護コーティング材および回転塗布用熱可塑性樹脂系接着剤 - Google Patents
耐熱耐薬品性酸保護コーティング材および回転塗布用熱可塑性樹脂系接着剤 Download PDFInfo
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- JP2009529065A JP2009529065A JP2008553452A JP2008553452A JP2009529065A JP 2009529065 A JP2009529065 A JP 2009529065A JP 2008553452 A JP2008553452 A JP 2008553452A JP 2008553452 A JP2008553452 A JP 2008553452A JP 2009529065 A JP2009529065 A JP 2009529065A
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- 239000000853 adhesive Substances 0.000 title claims abstract description 10
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 10
- 239000011253 protective coating Substances 0.000 title claims abstract description 10
- 239000002253 acid Substances 0.000 title claims description 13
- 239000000463 material Substances 0.000 title description 7
- 239000000126 substance Substances 0.000 title description 4
- 238000004528 spin coating Methods 0.000 title description 2
- 229920005992 thermoplastic resin Polymers 0.000 title 1
- 239000000203 mixture Substances 0.000 claims abstract description 101
- 239000002904 solvent Substances 0.000 claims abstract description 47
- 238000000034 method Methods 0.000 claims abstract description 39
- 229920001971 elastomer Polymers 0.000 claims abstract description 34
- 239000005060 rubber Substances 0.000 claims abstract description 34
- 239000013032 Hydrocarbon resin Substances 0.000 claims abstract description 27
- 229920006270 hydrocarbon resin Polymers 0.000 claims abstract description 27
- 239000004094 surface-active agent Substances 0.000 claims abstract description 8
- 150000003505 terpenes Chemical class 0.000 claims abstract description 5
- 235000007586 terpenes Nutrition 0.000 claims abstract description 5
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims abstract 4
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims abstract 4
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims abstract 4
- 239000000758 substrate Substances 0.000 claims description 66
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 12
- 239000010703 silicon Substances 0.000 claims description 12
- 229910052710 silicon Inorganic materials 0.000 claims description 12
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 claims description 8
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims description 7
- 229910000577 Silicon-germanium Inorganic materials 0.000 claims description 7
- MVETVBHSYIYRCX-UHFFFAOYSA-I [Ta+5].[O-]N=O.[O-]N=O.[O-]N=O.[O-]N=O.[O-]N=O Chemical compound [Ta+5].[O-]N=O.[O-]N=O.[O-]N=O.[O-]N=O.[O-]N=O MVETVBHSYIYRCX-UHFFFAOYSA-I 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052732 germanium Inorganic materials 0.000 claims description 7
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 7
- 238000004377 microelectronic Methods 0.000 claims description 7
- 239000000178 monomer Substances 0.000 claims description 7
- 239000012454 non-polar solvent Substances 0.000 claims description 7
- 229910052715 tantalum Inorganic materials 0.000 claims description 7
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 7
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 7
- 229910052721 tungsten Inorganic materials 0.000 claims description 7
- 239000010937 tungsten Substances 0.000 claims description 7
- WQJQOUPTWCFRMM-UHFFFAOYSA-N tungsten disilicide Chemical compound [Si]#[W]#[Si] WQJQOUPTWCFRMM-UHFFFAOYSA-N 0.000 claims description 7
- 229910021342 tungsten silicide Inorganic materials 0.000 claims description 7
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical group C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 5
- 239000005977 Ethylene Substances 0.000 claims description 5
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Chemical group CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 claims description 5
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 claims description 5
- 238000005468 ion implantation Methods 0.000 claims 6
- 239000000975 dye Substances 0.000 abstract description 4
- 229920002943 EPDM rubber Polymers 0.000 abstract description 3
- 238000001035 drying Methods 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 25
- 239000010410 layer Substances 0.000 description 11
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 239000011521 glass Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- XMGQYMWWDOXHJM-JTQLQIEISA-N (+)-α-limonene Chemical compound CC(=C)[C@@H]1CCC(C)=CC1 XMGQYMWWDOXHJM-JTQLQIEISA-N 0.000 description 4
- CRSBERNSMYQZNG-UHFFFAOYSA-N 1-dodecene Chemical group CCCCCCCCCCC=C CRSBERNSMYQZNG-UHFFFAOYSA-N 0.000 description 4
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 4
- 150000001491 aromatic compounds Chemical class 0.000 description 4
- 229910052594 sapphire Inorganic materials 0.000 description 4
- 239000010980 sapphire Substances 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 230000001133 acceleration Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- FYGHSUNMUKGBRK-UHFFFAOYSA-N 1,2,3-trimethylbenzene Chemical compound CC1=CC=CC(C)=C1C FYGHSUNMUKGBRK-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- YNQLUTRBYVCPMQ-UHFFFAOYSA-N Ethylbenzene Chemical compound CCC1=CC=CC=C1 YNQLUTRBYVCPMQ-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 150000007824 aliphatic compounds Chemical class 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000003153 chemical reaction reagent Substances 0.000 description 2
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 2
- RWGFKTVRMDUZSP-UHFFFAOYSA-N cumene Chemical compound CC(C)C1=CC=CC=C1 RWGFKTVRMDUZSP-UHFFFAOYSA-N 0.000 description 2
- 150000001993 dienes Chemical class 0.000 description 2
- 238000010790 dilution Methods 0.000 description 2
- 239000012895 dilution Substances 0.000 description 2
- 229940069096 dodecene Drugs 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- XMGQYMWWDOXHJM-UHFFFAOYSA-N limonene Chemical compound CC(=C)C1CCC(C)=CC1 XMGQYMWWDOXHJM-UHFFFAOYSA-N 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 229920003051 synthetic elastomer Polymers 0.000 description 2
- 229920001897 terpolymer Polymers 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- OJOWICOBYCXEKR-KRXBUXKQSA-N (5e)-5-ethylidenebicyclo[2.2.1]hept-2-ene Chemical compound C1C2C(=C/C)/CC1C=C2 OJOWICOBYCXEKR-KRXBUXKQSA-N 0.000 description 1
- OCJBOOLMMGQPQU-UHFFFAOYSA-N 1,4-dichlorobenzene Chemical compound ClC1=CC=C(Cl)C=C1 OCJBOOLMMGQPQU-UHFFFAOYSA-N 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- 244000043261 Hevea brasiliensis Species 0.000 description 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 239000000908 ammonium hydroxide Substances 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 229940117389 dichlorobenzene Drugs 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000009969 flowable effect Effects 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 235000001510 limonene Nutrition 0.000 description 1
- 229940087305 limonene Drugs 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- AUHZEENZYGFFBQ-UHFFFAOYSA-N mesitylene Substances CC1=CC(C)=CC(C)=C1 AUHZEENZYGFFBQ-UHFFFAOYSA-N 0.000 description 1
- 125000001827 mesitylenyl group Chemical group [H]C1=C(C(*)=C(C([H])=C1C([H])([H])[H])C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- 238000010943 off-gassing Methods 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 239000004711 α-olefin Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J193/00—Adhesives based on natural resins; Adhesives based on derivatives thereof
- C09J193/04—Rosin
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D121/00—Coating compositions based on unspecified rubbers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D193/00—Coating compositions based on natural resins; Coating compositions based on derivatives thereof
- C09D193/04—Rosin
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J121/00—Adhesives based on unspecified rubbers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L21/00—Compositions of unspecified rubbers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
- C08L2666/08—Homopolymers or copolymers according to C08L7/00 - C08L21/00; Derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L9/00—Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31652—Of asbestos
- Y10T428/31667—Next to addition polymer from unsaturated monomers, or aldehyde or ketone condensation product
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Paints Or Removers (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/348,143 US8268449B2 (en) | 2006-02-06 | 2006-02-06 | Thermal- and chemical-resistant acid protection coating material and spin-on thermoplastic adhesive |
| PCT/US2007/061110 WO2007092689A2 (en) | 2006-02-06 | 2007-01-26 | Thermal-and chemical-resistant acid protection coating material and spin-on thermoplastic adhesive |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2009529065A true JP2009529065A (ja) | 2009-08-13 |
| JP2009529065A5 JP2009529065A5 (enExample) | 2010-03-11 |
Family
ID=38334906
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008553452A Pending JP2009529065A (ja) | 2006-02-06 | 2007-01-26 | 耐熱耐薬品性酸保護コーティング材および回転塗布用熱可塑性樹脂系接着剤 |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US8268449B2 (enExample) |
| EP (1) | EP2007836A4 (enExample) |
| JP (1) | JP2009529065A (enExample) |
| KR (1) | KR20080096646A (enExample) |
| CN (1) | CN101790570A (enExample) |
| SG (1) | SG169384A1 (enExample) |
| TW (1) | TW200734419A (enExample) |
| WO (1) | WO2007092689A2 (enExample) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013065417A1 (ja) | 2011-10-31 | 2013-05-10 | 東京応化工業株式会社 | ウエハと当該ウエハの支持体とを接着するための接着剤組成物、接着フィルム及び積層体 |
| JP2013216857A (ja) * | 2012-03-12 | 2013-10-24 | Tokyo Ohka Kogyo Co Ltd | 接着剤組成物、接着フィルムおよび基板の処理方法 |
| KR20140052860A (ko) | 2012-10-25 | 2014-05-07 | 도오꾜오까고오교 가부시끼가이샤 | 접착제 조성물 및 접착 필름 |
| US8809457B2 (en) | 2011-09-30 | 2014-08-19 | Tokyo Ohka Kogyo Co., Ltd. | Adhesive composition, adhesive film, and method for treating substrate |
| US9115297B2 (en) | 2010-09-30 | 2015-08-25 | Tokyo Ohka Kogyo Co., Ltd. | Adhesive composition |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080200011A1 (en) * | 2006-10-06 | 2008-08-21 | Pillalamarri Sunil K | High-temperature, spin-on, bonding compositions for temporary wafer bonding using sliding approach |
| JP5788173B2 (ja) | 2007-06-25 | 2015-09-30 | ブルーワー サイエンス アイ エヌシー． | 高温スピンオン仮接合用組成物 |
| DE102007059848A1 (de) * | 2007-12-12 | 2009-06-25 | Robert Bosch Gmbh | Elektrische Anordnung und Verfahren zur Herstellung einer elektrischen Anordnung |
| DE112009000140B4 (de) * | 2008-01-24 | 2022-06-15 | Brewer Science, Inc. | Verfahren zum reversiblen Anbringen eines Vorrichtungswafers an einem Trägersubstrat und ein daraus erhaltener Gegenstand |
| US8092628B2 (en) * | 2008-10-31 | 2012-01-10 | Brewer Science Inc. | Cyclic olefin compositions for temporary wafer bonding |
| US8771927B2 (en) * | 2009-04-15 | 2014-07-08 | Brewer Science Inc. | Acid-etch resistant, protective coatings |
| KR101345086B1 (ko) * | 2009-06-11 | 2013-12-26 | 하리마 카세이 가부시키가이샤 | 접착제 조성물 |
| US9018308B2 (en) * | 2009-12-01 | 2015-04-28 | Pbi Performance Products, Inc. | Polybenzimidazole/polyacrylate mixtures |
| US8852391B2 (en) | 2010-06-21 | 2014-10-07 | Brewer Science Inc. | Method and apparatus for removing a reversibly mounted device wafer from a carrier substrate |
| US9263314B2 (en) | 2010-08-06 | 2016-02-16 | Brewer Science Inc. | Multiple bonding layers for thin-wafer handling |
| US8962723B2 (en) * | 2011-06-15 | 2015-02-24 | Lion Copolymer Geismar, Llc | Durable substrate coating and process for making |
| EP2794743B1 (en) * | 2011-12-23 | 2016-07-27 | Frans Nooren Afdichtingssystemen B.V. | Composition for coating a substrate and method for coating a substrate |
| JP6128837B2 (ja) * | 2012-02-21 | 2017-05-17 | 東京応化工業株式会社 | 接着剤組成物の製造方法、接着剤組成物及び接着フィルム |
| US9127126B2 (en) | 2012-04-30 | 2015-09-08 | Brewer Science Inc. | Development of high-viscosity bonding layer through in-situ polymer chain extension |
| US9349643B2 (en) | 2013-04-01 | 2016-05-24 | Brewer Science Inc. | Apparatus and method for thin wafer transfer |
| US10103048B2 (en) | 2013-08-28 | 2018-10-16 | Brewer Science, Inc. | Dual-layer bonding material process for temporary bonding of microelectronic substrates to carrier substrates |
| US9865490B2 (en) | 2014-01-07 | 2018-01-09 | Brewer Science Inc. | Cyclic olefin polymer compositions and polysiloxane release layers for use in temporary wafer bonding processes |
| US9496164B2 (en) | 2014-01-07 | 2016-11-15 | Brewer Science Inc. | Cyclic olefin polymer compositions and polysiloxane release layers for use in temporary wafer bonding processes |
| WO2016014648A2 (en) | 2014-07-22 | 2016-01-28 | Brewer Science Inc. | Polyimides as laser release materials for 3-d ic applications |
| SG11202107879PA (en) | 2019-01-22 | 2021-08-30 | Brewer Science Inc | Laser-releasable bonding materials for 3-d ic applications |
| TW202303826A (zh) | 2021-02-15 | 2023-01-16 | 美商布魯爾科技公司 | 防止熱壓結合中金屬連接變形的臨時結合和脫結製程 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06271806A (ja) * | 1993-03-23 | 1994-09-27 | Tokyo Ohka Kogyo Co Ltd | 耐酸性保護膜形成用組成物及びそれを用いた半導体素子の製造方法 |
| JPH0912991A (ja) * | 1995-02-14 | 1997-01-14 | Toyo Chem Co Ltd | 半導体ウエハ固定用シートの粘着剤 |
| JPH1150031A (ja) * | 1997-08-04 | 1999-02-23 | Konishi Kk | スチレンブロック共重合体ゴム系接着剤組成物 |
Family Cites Families (43)
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9115297B2 (en) | 2010-09-30 | 2015-08-25 | Tokyo Ohka Kogyo Co., Ltd. | Adhesive composition |
| US8809457B2 (en) | 2011-09-30 | 2014-08-19 | Tokyo Ohka Kogyo Co., Ltd. | Adhesive composition, adhesive film, and method for treating substrate |
| WO2013065417A1 (ja) | 2011-10-31 | 2013-05-10 | 東京応化工業株式会社 | ウエハと当該ウエハの支持体とを接着するための接着剤組成物、接着フィルム及び積層体 |
| JP2013216857A (ja) * | 2012-03-12 | 2013-10-24 | Tokyo Ohka Kogyo Co Ltd | 接着剤組成物、接着フィルムおよび基板の処理方法 |
| KR20140052860A (ko) | 2012-10-25 | 2014-05-07 | 도오꾜오까고오교 가부시끼가이샤 | 접착제 조성물 및 접착 필름 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20080096646A (ko) | 2008-10-31 |
| WO2007092689A2 (en) | 2007-08-16 |
| SG169384A1 (en) | 2011-03-30 |
| TW200734419A (en) | 2007-09-16 |
| US20080306207A1 (en) | 2008-12-11 |
| EP2007836A2 (en) | 2008-12-31 |
| US20070185310A1 (en) | 2007-08-09 |
| EP2007836A4 (en) | 2013-01-23 |
| US7678861B2 (en) | 2010-03-16 |
| CN101790570A (zh) | 2010-07-28 |
| WO2007092689A3 (en) | 2010-03-04 |
| US8268449B2 (en) | 2012-09-18 |
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