JP2009529065A5 - - Google Patents
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- JP2009529065A5 JP2009529065A5 JP2008553452A JP2008553452A JP2009529065A5 JP 2009529065 A5 JP2009529065 A5 JP 2009529065A5 JP 2008553452 A JP2008553452 A JP 2008553452A JP 2008553452 A JP2008553452 A JP 2008553452A JP 2009529065 A5 JP2009529065 A5 JP 2009529065A5
- Authority
- JP
- Japan
- Prior art keywords
- composition
- weight
- layer
- substrate
- solvent system
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002904 solvent Substances 0.000 claims 22
- 239000000758 substrate Substances 0.000 claims 21
- 238000000034 method Methods 0.000 claims 15
- 239000013032 Hydrocarbon resin Substances 0.000 claims 13
- 229920006270 hydrocarbon resin Polymers 0.000 claims 13
- 239000000853 adhesive Substances 0.000 claims 4
- 230000001070 adhesive effect Effects 0.000 claims 4
- 239000011253 protective coating Substances 0.000 claims 4
- 239000004094 surface-active agent Substances 0.000 claims 4
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 claims 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 2
- 229910000577 Silicon-germanium Inorganic materials 0.000 claims 2
- MVETVBHSYIYRCX-UHFFFAOYSA-I [Ta+5].[O-]N=O.[O-]N=O.[O-]N=O.[O-]N=O.[O-]N=O Chemical compound [Ta+5].[O-]N=O.[O-]N=O.[O-]N=O.[O-]N=O.[O-]N=O MVETVBHSYIYRCX-UHFFFAOYSA-I 0.000 claims 2
- 239000002253 acid Substances 0.000 claims 2
- 229910052782 aluminium Inorganic materials 0.000 claims 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 2
- 229910052732 germanium Inorganic materials 0.000 claims 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims 2
- 238000005468 ion implantation Methods 0.000 claims 2
- 238000004377 microelectronic Methods 0.000 claims 2
- 239000012454 non-polar solvent Substances 0.000 claims 2
- 229910052710 silicon Inorganic materials 0.000 claims 2
- 239000010703 silicon Substances 0.000 claims 2
- 229910052715 tantalum Inorganic materials 0.000 claims 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims 2
- 229910052721 tungsten Inorganic materials 0.000 claims 2
- 239000010937 tungsten Substances 0.000 claims 2
- WQJQOUPTWCFRMM-UHFFFAOYSA-N tungsten disilicide Chemical compound [Si]#[W]#[Si] WQJQOUPTWCFRMM-UHFFFAOYSA-N 0.000 claims 2
- 229910021342 tungsten silicide Inorganic materials 0.000 claims 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims 1
- 239000005977 Ethylene Substances 0.000 claims 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims 1
- 239000000178 monomer Substances 0.000 claims 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 claims 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 claims 1
- 150000003505 terpenes Chemical class 0.000 claims 1
- 235000007586 terpenes Nutrition 0.000 claims 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/348,143 US8268449B2 (en) | 2006-02-06 | 2006-02-06 | Thermal- and chemical-resistant acid protection coating material and spin-on thermoplastic adhesive |
| PCT/US2007/061110 WO2007092689A2 (en) | 2006-02-06 | 2007-01-26 | Thermal-and chemical-resistant acid protection coating material and spin-on thermoplastic adhesive |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2009529065A JP2009529065A (ja) | 2009-08-13 |
| JP2009529065A5 true JP2009529065A5 (enExample) | 2010-03-11 |
Family
ID=38334906
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008553452A Pending JP2009529065A (ja) | 2006-02-06 | 2007-01-26 | 耐熱耐薬品性酸保護コーティング材および回転塗布用熱可塑性樹脂系接着剤 |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US8268449B2 (enExample) |
| EP (1) | EP2007836A4 (enExample) |
| JP (1) | JP2009529065A (enExample) |
| KR (1) | KR20080096646A (enExample) |
| CN (1) | CN101790570A (enExample) |
| SG (1) | SG169384A1 (enExample) |
| TW (1) | TW200734419A (enExample) |
| WO (1) | WO2007092689A2 (enExample) |
Families Citing this family (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080200011A1 (en) * | 2006-10-06 | 2008-08-21 | Pillalamarri Sunil K | High-temperature, spin-on, bonding compositions for temporary wafer bonding using sliding approach |
| JP5788173B2 (ja) | 2007-06-25 | 2015-09-30 | ブルーワー サイエンス アイ エヌシー． | 高温スピンオン仮接合用組成物 |
| DE102007059848A1 (de) * | 2007-12-12 | 2009-06-25 | Robert Bosch Gmbh | Elektrische Anordnung und Verfahren zur Herstellung einer elektrischen Anordnung |
| DE112009000140B4 (de) * | 2008-01-24 | 2022-06-15 | Brewer Science, Inc. | Verfahren zum reversiblen Anbringen eines Vorrichtungswafers an einem Trägersubstrat und ein daraus erhaltener Gegenstand |
| US8092628B2 (en) * | 2008-10-31 | 2012-01-10 | Brewer Science Inc. | Cyclic olefin compositions for temporary wafer bonding |
| US8771927B2 (en) * | 2009-04-15 | 2014-07-08 | Brewer Science Inc. | Acid-etch resistant, protective coatings |
| KR101345086B1 (ko) * | 2009-06-11 | 2013-12-26 | 하리마 카세이 가부시키가이샤 | 접착제 조성물 |
| US9018308B2 (en) * | 2009-12-01 | 2015-04-28 | Pbi Performance Products, Inc. | Polybenzimidazole/polyacrylate mixtures |
| US8852391B2 (en) | 2010-06-21 | 2014-10-07 | Brewer Science Inc. | Method and apparatus for removing a reversibly mounted device wafer from a carrier substrate |
| US9263314B2 (en) | 2010-08-06 | 2016-02-16 | Brewer Science Inc. | Multiple bonding layers for thin-wafer handling |
| JP5681502B2 (ja) | 2010-09-30 | 2015-03-11 | 東京応化工業株式会社 | 接着剤組成物 |
| US8962723B2 (en) * | 2011-06-15 | 2015-02-24 | Lion Copolymer Geismar, Llc | Durable substrate coating and process for making |
| JP5661669B2 (ja) | 2011-09-30 | 2015-01-28 | 東京応化工業株式会社 | 接着剤組成物、接着フィルムおよび基板の処理方法 |
| KR101746270B1 (ko) | 2011-10-31 | 2017-06-12 | 도오꾜오까고오교 가부시끼가이샤 | 웨이퍼와 당해 웨이퍼의 지지체를 접착하기 위한 접착제 조성물, 및 그 이용 |
| EP2794743B1 (en) * | 2011-12-23 | 2016-07-27 | Frans Nooren Afdichtingssystemen B.V. | Composition for coating a substrate and method for coating a substrate |
| JP6128837B2 (ja) * | 2012-02-21 | 2017-05-17 | 東京応化工業株式会社 | 接着剤組成物の製造方法、接着剤組成物及び接着フィルム |
| JP6063737B2 (ja) * | 2012-03-12 | 2017-01-18 | 東京応化工業株式会社 | 接着剤組成物、接着フィルムおよび基板の処理方法 |
| US9127126B2 (en) | 2012-04-30 | 2015-09-08 | Brewer Science Inc. | Development of high-viscosity bonding layer through in-situ polymer chain extension |
| JP6216575B2 (ja) | 2012-10-25 | 2017-10-18 | 東京応化工業株式会社 | 接着剤組成物及び接着フィルム |
| US9349643B2 (en) | 2013-04-01 | 2016-05-24 | Brewer Science Inc. | Apparatus and method for thin wafer transfer |
| US10103048B2 (en) | 2013-08-28 | 2018-10-16 | Brewer Science, Inc. | Dual-layer bonding material process for temporary bonding of microelectronic substrates to carrier substrates |
| US9865490B2 (en) | 2014-01-07 | 2018-01-09 | Brewer Science Inc. | Cyclic olefin polymer compositions and polysiloxane release layers for use in temporary wafer bonding processes |
| US9496164B2 (en) | 2014-01-07 | 2016-11-15 | Brewer Science Inc. | Cyclic olefin polymer compositions and polysiloxane release layers for use in temporary wafer bonding processes |
| WO2016014648A2 (en) | 2014-07-22 | 2016-01-28 | Brewer Science Inc. | Polyimides as laser release materials for 3-d ic applications |
| SG11202107879PA (en) | 2019-01-22 | 2021-08-30 | Brewer Science Inc | Laser-releasable bonding materials for 3-d ic applications |
| TW202303826A (zh) | 2021-02-15 | 2023-01-16 | 美商布魯爾科技公司 | 防止熱壓結合中金屬連接變形的臨時結合和脫結製程 |
Family Cites Families (46)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE388487A (enExample) * | 1900-01-01 | |||
| GB488557A (en) * | 1937-01-06 | 1938-07-06 | Dunlop Rubber Co | Improvements in or relating to adhesive compositions |
| DE710987C (de) * | 1937-04-14 | 1941-09-24 | Herbig Haarhaus Akt Ges Lackfa | Anstrichmittel |
| US2279256A (en) | 1938-10-27 | 1942-04-07 | Dewey And Almy Chem Comp | Adhesive composition |
| US3297617A (en) | 1963-12-23 | 1967-01-10 | Velsicol Chemical Corp | Coating slurry containing aggregate and aqueous emulsion of petroleumderived hydrocarbon resin |
| US3987122A (en) | 1972-04-03 | 1976-10-19 | Exxon Research And Engineering Company | Thermoplastic adhesive compositions |
| US3868433A (en) | 1972-04-03 | 1975-02-25 | Exxon Research Engineering Co | Thermoplastic adhesive compositions |
| US3959062A (en) | 1972-08-10 | 1976-05-25 | E. I. Du Pont De Nemours And Company | Method of joining surfaces using segmented copolyester adhesive |
| US3970494A (en) | 1975-04-18 | 1976-07-20 | Western Electric Co., Inc. | Method for adhering one surface to another |
| JPS5996112A (ja) | 1982-11-26 | 1984-06-02 | Toyo Soda Mfg Co Ltd | 高純度イソプレン重合体環化物の製造方法 |
| US4793337A (en) | 1986-11-17 | 1988-12-27 | E. R. Squibb & Sons, Inc. | Adhesive structure and products including same |
| JPH07119328B2 (ja) | 1987-12-18 | 1995-12-20 | 三井石油化学工業株式会社 | 環状オレフィン系ランダム共重合体組成物 |
| ATE133984T1 (de) | 1987-10-08 | 1996-02-15 | Mitsui Petrochemical Ind | Random-cycloolefin-kopolymerzusammensetzung |
| JP3221720B2 (ja) | 1992-03-25 | 2001-10-22 | 出光興産株式会社 | 環状オレフィン系共重合体組成物 |
| JP3359080B2 (ja) | 1993-03-23 | 2002-12-24 | 東京応化工業株式会社 | 耐酸性保護膜形成用塗布液及びそれを用いた半導体素子の製造方法 |
| TW383332B (en) * | 1995-02-14 | 2000-03-01 | Toyo Chemicals Co Ltd | Pressure-sensitive adhesive for attaching semiconductor wafer onto sheet |
| US5844309A (en) * | 1995-03-20 | 1998-12-01 | Fujitsu Limited | Adhesive composition, semiconductor device using the composition and method for producing a semiconductor device using the composition |
| US5645603A (en) * | 1995-07-25 | 1997-07-08 | Peters; William E. | Method of enhancing physical properties of non-elastomeric thermoplastic materials and resulting compositions |
| JPH09176398A (ja) | 1995-12-22 | 1997-07-08 | Mitsui Petrochem Ind Ltd | 環状オレフィン系樹脂組成物およびその用途 |
| US5888650A (en) | 1996-06-03 | 1999-03-30 | Minnesota Mining And Manufacturing Company | Temperature-responsive adhesive article |
| US6054363A (en) | 1996-11-15 | 2000-04-25 | Canon Kabushiki Kaisha | Method of manufacturing semiconductor article |
| WO1998033861A1 (en) | 1997-01-30 | 1998-08-06 | Mitsui Chemicals, Inc. | Hot melt adhesive compositions |
| JP4164136B2 (ja) * | 1997-08-04 | 2008-10-08 | コニシ株式会社 | スチレンブロック共重合体ゴム系接着剤組成物 |
| US6110999A (en) | 1998-03-06 | 2000-08-29 | Denovus Llc | Reusable adhesive composition and method of making the same |
| US6440259B1 (en) | 1999-08-04 | 2002-08-27 | 3M Innovative Properties Company | One-part storage-stable water-based contact adhesive composition with an internal coagulant |
| JP2001139755A (ja) | 1999-11-15 | 2001-05-22 | Kanegafuchi Chem Ind Co Ltd | 光学フィルム用樹脂組成物 |
| DE19956422A1 (de) | 1999-11-24 | 2001-06-13 | Hella Kg Hueck & Co | Lösbare Klebstoffe zum Verbinden von Substraten |
| BR0109653B1 (pt) | 2000-03-30 | 2011-08-09 | composição adesiva que compreende um componente termoplástico particulado. | |
| KR100314881B1 (ko) * | 2000-06-24 | 2001-12-22 | 정하승 | 폴리올레핀 타입의 편향 요크용 핫멜트 조성물 |
| KR20030042454A (ko) | 2000-08-22 | 2003-05-28 | 제온 코포레이션 | 필름 적층 방법 |
| TW574753B (en) | 2001-04-13 | 2004-02-01 | Sony Corp | Manufacturing method of thin film apparatus and semiconductor device |
| EP1295926A1 (en) | 2001-09-19 | 2003-03-26 | ExxonMobil Chemical Patents Inc. | Components for adhesive compositions and process for manufacture |
| DE10213227A1 (de) | 2002-03-25 | 2003-10-16 | Bayer Ag | Zusammensetzung |
| AU2003234794A1 (en) | 2002-05-13 | 2003-11-11 | Jsr Corporation | Composition and method for temporarily fixing solid |
| US20050228157A1 (en) * | 2002-06-14 | 2005-10-13 | Peterson Curt E | Thermoplastic elastomer bonded directly to metal substrate |
| US6828020B2 (en) | 2002-08-14 | 2004-12-07 | Adco Products, Inc. | Self-adhesive vibration damping tape and composition |
| US6869894B2 (en) | 2002-12-20 | 2005-03-22 | General Chemical Corporation | Spin-on adhesive for temporary wafer coating and mounting to support wafer thinning and backside processing |
| DE10334576B4 (de) | 2003-07-28 | 2007-04-05 | Infineon Technologies Ag | Verfahren zum Herstellen eines Halbleiterbauelements mit einem Kunststoffgehäuse |
| US7084201B2 (en) | 2003-11-14 | 2006-08-01 | Wall-Guard Corporation Of Ohio | Non-flammable waterproofing composition |
| KR20060126674A (ko) | 2003-11-27 | 2006-12-08 | 제이에스알 가부시끼가이샤 | 핫멜트형 접착제 조성물 |
| JP2006135272A (ja) | 2003-12-01 | 2006-05-25 | Tokyo Ohka Kogyo Co Ltd | 基板のサポートプレート及びサポートプレートの剥離方法 |
| KR100696287B1 (ko) | 2004-01-28 | 2007-03-19 | 미쓰이 가가쿠 가부시키가이샤 | 반도체 웨이퍼의 보호방법 |
| JP2004156048A (ja) | 2004-02-09 | 2004-06-03 | Polyplastics Co | 環状オレフィン系樹脂組成物フィルム |
| DE102004007060B3 (de) | 2004-02-13 | 2005-07-07 | Thallner, Erich, Dipl.-Ing. | Vorrichtung und Verfahren zum Verbinden von Wafern |
| US7541264B2 (en) | 2005-03-01 | 2009-06-02 | Dow Corning Corporation | Temporary wafer bonding method for semiconductor processing |
| JP5220616B2 (ja) | 2006-12-05 | 2013-06-26 | 三井化学株式会社 | 環状オレフィン系重合体組成物、およびその用途 |
-
2006
- 2006-02-06 US US11/348,143 patent/US8268449B2/en active Active
-
2007
- 2007-01-26 CN CN200780004575A patent/CN101790570A/zh active Pending
- 2007-01-26 EP EP07710318A patent/EP2007836A4/en not_active Withdrawn
- 2007-01-26 SG SG201100807-5A patent/SG169384A1/en unknown
- 2007-01-26 WO PCT/US2007/061110 patent/WO2007092689A2/en not_active Ceased
- 2007-01-26 KR KR1020087017286A patent/KR20080096646A/ko not_active Ceased
- 2007-01-26 JP JP2008553452A patent/JP2009529065A/ja active Pending
- 2007-01-30 TW TW096103324A patent/TW200734419A/zh unknown
-
2008
- 2008-08-20 US US12/195,224 patent/US7678861B2/en active Active
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