TW200731344A - Rotatable aperture mask assembly and deposition system - Google Patents

Rotatable aperture mask assembly and deposition system

Info

Publication number
TW200731344A
TW200731344A TW095148990A TW95148990A TW200731344A TW 200731344 A TW200731344 A TW 200731344A TW 095148990 A TW095148990 A TW 095148990A TW 95148990 A TW95148990 A TW 95148990A TW 200731344 A TW200731344 A TW 200731344A
Authority
TW
Taiwan
Prior art keywords
mask
frame
mask assembly
deposition system
aperture mask
Prior art date
Application number
TW095148990A
Other languages
English (en)
Chinese (zh)
Inventor
Jeffrey Howard Tokie
Donald James Mcclure
Original Assignee
3M Innovativeproperties Company
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovativeproperties Company filed Critical 3M Innovativeproperties Company
Publication of TW200731344A publication Critical patent/TW200731344A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/04—Coating on selected surface areas, e.g. using masks
    • C23C16/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/54—Apparatus specially adapted for continuous coating
    • C23C16/545—Apparatus specially adapted for continuous coating for coating elongated substrates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physical Vapour Deposition (AREA)
TW095148990A 2005-12-28 2006-12-26 Rotatable aperture mask assembly and deposition system TW200731344A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/275,354 US7763114B2 (en) 2005-12-28 2005-12-28 Rotatable aperture mask assembly and deposition system

Publications (1)

Publication Number Publication Date
TW200731344A true TW200731344A (en) 2007-08-16

Family

ID=38228540

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095148990A TW200731344A (en) 2005-12-28 2006-12-26 Rotatable aperture mask assembly and deposition system

Country Status (6)

Country Link
US (1) US7763114B2 (enExample)
EP (1) EP1977024A4 (enExample)
JP (1) JP2009522448A (enExample)
CN (1) CN101351572A (enExample)
TW (1) TW200731344A (enExample)
WO (1) WO2007078556A1 (enExample)

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US8702999B2 (en) 2008-02-01 2014-04-22 Fujifilm Manufacturing Europe B.V. Method and apparatus for plasma surface treatment of a moving substrate
EP2241165B1 (en) 2008-02-08 2011-08-31 Fujifilm Manufacturing Europe B.V. Method for manufacturing a multi_layer stack structure with improved wvtr barrier property
CN102016103B (zh) * 2008-02-15 2012-10-24 松下电器产业株式会社 薄膜形成方法及成膜装置
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JP2010168654A (ja) * 2008-12-26 2010-08-05 Ulvac Japan Ltd マスク装置
US8349143B2 (en) * 2008-12-30 2013-01-08 Intermolecular, Inc. Shadow masks for patterned deposition on substrates
US20100252606A1 (en) * 2009-04-03 2010-10-07 United Solar Ovonic Llc Roll-to-roll deposition apparatus with improved web transport system
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US20120090544A1 (en) * 2010-10-18 2012-04-19 Kim Mu-Gyeom Thin film deposition apparatus for continuous deposition, and mask unit and crucible unit included in thin film deposition apparatus
CN102169927A (zh) * 2010-12-31 2011-08-31 东莞市万丰纳米材料有限公司 一种led芯片图形衬底制备装置
KR101784467B1 (ko) * 2011-01-10 2017-10-12 삼성디스플레이 주식회사 분할 마스크 및 그것을 이용한 마스크 프레임 조립체의 조립방법
WO2013096951A1 (en) * 2011-12-23 2013-06-27 Solexel, Inc. High productivity spray processing for semiconductor metallization and interconnects
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US20140166989A1 (en) * 2012-12-17 2014-06-19 Universal Display Corporation Manufacturing flexible organic electronic devices
EP2762607B1 (en) * 2013-01-31 2018-07-25 Applied Materials, Inc. Deposition source with adjustable electrode
EP2765218A1 (en) * 2013-02-07 2014-08-13 Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO Method and apparatus for depositing atomic layers on a substrate
KR102106331B1 (ko) * 2013-07-08 2020-05-06 삼성디스플레이 주식회사 마스크 조립체 및 이의 제조 방법
KR102201107B1 (ko) * 2013-09-11 2021-01-11 삼성디스플레이 주식회사 증착 장치 및 이를 이용한 마스크 조립체의 정렬 방법
EP3030880A4 (en) * 2013-09-11 2017-04-26 Halliburton Energy Services, Inc. Method and apparatus for aligning components of integrated optical sensors
US11015244B2 (en) * 2013-12-30 2021-05-25 Advanced Material Solutions, Llc Radiation shielding for a CVD reactor
KR101677157B1 (ko) * 2015-07-31 2016-11-17 (주)아이작리서치 기판 처리 장치
KR102618351B1 (ko) * 2016-07-19 2023-12-28 삼성디스플레이 주식회사 패턴위치조정기구가 구비된 마스크 프레임 조립체 및 그것을 이용한 패턴 위치 조정 방법
CN106148892B (zh) * 2016-07-25 2019-04-02 京东方科技集团股份有限公司 一种子掩膜版的张网方法及掩膜版、基板、显示装置
KR102696806B1 (ko) * 2016-09-22 2024-08-21 삼성디스플레이 주식회사 증착용 마스크, 표시 장치의 제조 장치 및 표시 장치의 제조 방법
CN106987798B (zh) * 2017-04-17 2020-02-11 京东方科技集团股份有限公司 一种镀膜装置
US20190044068A1 (en) * 2017-08-01 2019-02-07 Wuhan China Star Optoelectronics Semiconductor Dis play Technology Co., Ltd. Mask plate
CN109402592B (zh) * 2017-08-18 2020-06-26 Tcl科技集团股份有限公司 器件侧面蒸镀装置及器件侧面蒸镀方法
DE102018215101A1 (de) * 2018-05-28 2019-11-28 Sms Group Gmbh Vakuumbeschichtungsanlage, und Verfahren zum Beschichten eines bandförmigen Materials
DE102018215100A1 (de) * 2018-05-28 2019-11-28 Sms Group Gmbh Vakuumbeschichtungsanlage, und Verfahren zum Beschichten eines bandförmigen Materials
NL2021997B1 (nl) * 2018-11-14 2020-05-20 Johannes Hendrikus Lagarde Kevin Systeem en werkwijze voor het deponeren van een eerste en tweede laag op een substraat.
CN116479422B (zh) * 2022-01-13 2025-08-08 宁德时代新能源科技股份有限公司 蚀刻设备

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Also Published As

Publication number Publication date
US7763114B2 (en) 2010-07-27
CN101351572A (zh) 2009-01-21
EP1977024A4 (en) 2010-04-21
EP1977024A1 (en) 2008-10-08
US20070163494A1 (en) 2007-07-19
JP2009522448A (ja) 2009-06-11
WO2007078556A1 (en) 2007-07-12

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