CN101351572A - 旋转孔眼掩模组件和沉积系统 - Google Patents

旋转孔眼掩模组件和沉积系统 Download PDF

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Publication number
CN101351572A
CN101351572A CNA2006800497003A CN200680049700A CN101351572A CN 101351572 A CN101351572 A CN 101351572A CN A2006800497003 A CNA2006800497003 A CN A2006800497003A CN 200680049700 A CN200680049700 A CN 200680049700A CN 101351572 A CN101351572 A CN 101351572A
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CN
China
Prior art keywords
mask
frame
deposition
clamp
web
Prior art date
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Pending
Application number
CNA2006800497003A
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English (en)
Chinese (zh)
Inventor
杰弗里·H·托其
唐纳德·J·穆克卢尔
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3M Innovative Properties Co
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3M Innovative Properties Co
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Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of CN101351572A publication Critical patent/CN101351572A/zh
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/04—Coating on selected surface areas, e.g. using masks
    • C23C16/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/54—Apparatus specially adapted for continuous coating
    • C23C16/545—Apparatus specially adapted for continuous coating for coating elongated substrates

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physical Vapour Deposition (AREA)
CNA2006800497003A 2005-12-28 2006-12-07 旋转孔眼掩模组件和沉积系统 Pending CN101351572A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/275,354 2005-12-28
US11/275,354 US7763114B2 (en) 2005-12-28 2005-12-28 Rotatable aperture mask assembly and deposition system

Publications (1)

Publication Number Publication Date
CN101351572A true CN101351572A (zh) 2009-01-21

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2006800497003A Pending CN101351572A (zh) 2005-12-28 2006-12-07 旋转孔眼掩模组件和沉积系统

Country Status (6)

Country Link
US (1) US7763114B2 (enExample)
EP (1) EP1977024A4 (enExample)
JP (1) JP2009522448A (enExample)
CN (1) CN101351572A (enExample)
TW (1) TW200731344A (enExample)
WO (1) WO2007078556A1 (enExample)

Cited By (11)

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CN102169927A (zh) * 2010-12-31 2011-08-31 东莞市万丰纳米材料有限公司 一种led芯片图形衬底制备装置
CN102453871A (zh) * 2010-10-18 2012-05-16 三星移动显示器株式会社 薄膜沉积设备以及掩模单元和坩埚单元
CN102804406A (zh) * 2009-04-03 2012-11-28 联合太阳能奥佛有限公司 带有改进幅材传输系统的卷对卷沉积设备
CN103872265A (zh) * 2012-12-17 2014-06-18 环球展览公司 制造柔性有机电子装置
CN104419891A (zh) * 2013-09-11 2015-03-18 三星显示有限公司 对准掩模组件方法
CN104507587A (zh) * 2012-08-30 2015-04-08 威兰德-沃克公开股份有限公司 用于热和/或动态涂覆系统的可移动掩模
CN105900213A (zh) * 2013-12-30 2016-08-24 Gtat公司 用于cad反应器的改善的辐射屏障
CN106987798A (zh) * 2017-04-17 2017-07-28 京东方科技集团股份有限公司 一种镀膜装置
CN109402592A (zh) * 2017-08-18 2019-03-01 Tcl集团股份有限公司 器件侧面蒸镀装置及器件侧面蒸镀方法
CN112996949A (zh) * 2018-11-14 2021-06-18 因诺弗莱克斯科技有限公司 用于将第一层和第二层沉积在基板上的系统和方法
CN116479422A (zh) * 2022-01-13 2023-07-25 宁德时代新能源科技股份有限公司 蚀刻设备

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JP5506401B2 (ja) 2007-02-13 2014-05-28 フジフィルム マニュファクチャリング ユーロプ ビー．ブイ． 磁気マスクデバイスを使用する基板プラズマ処理
US8702999B2 (en) 2008-02-01 2014-04-22 Fujifilm Manufacturing Europe B.V. Method and apparatus for plasma surface treatment of a moving substrate
EP2241165B1 (en) 2008-02-08 2011-08-31 Fujifilm Manufacturing Europe B.V. Method for manufacturing a multi_layer stack structure with improved wvtr barrier property
CN102016103B (zh) * 2008-02-15 2012-10-24 松下电器产业株式会社 薄膜形成方法及成膜装置
KR100953495B1 (ko) * 2008-05-21 2010-04-16 건국대학교 산학협력단 롤투롤 방식 인쇄 방법 및 장치
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US8349143B2 (en) * 2008-12-30 2013-01-08 Intermolecular, Inc. Shadow masks for patterned deposition on substrates
EP2360293A1 (en) * 2010-02-11 2011-08-24 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Method and apparatus for depositing atomic layers on a substrate
KR101784467B1 (ko) * 2011-01-10 2017-10-12 삼성디스플레이 주식회사 분할 마스크 및 그것을 이용한 마스크 프레임 조립체의 조립방법
WO2013096951A1 (en) * 2011-12-23 2013-06-27 Solexel, Inc. High productivity spray processing for semiconductor metallization and interconnects
EP2762607B1 (en) * 2013-01-31 2018-07-25 Applied Materials, Inc. Deposition source with adjustable electrode
EP2765218A1 (en) * 2013-02-07 2014-08-13 Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO Method and apparatus for depositing atomic layers on a substrate
KR102106331B1 (ko) * 2013-07-08 2020-05-06 삼성디스플레이 주식회사 마스크 조립체 및 이의 제조 방법
EP3030880A4 (en) * 2013-09-11 2017-04-26 Halliburton Energy Services, Inc. Method and apparatus for aligning components of integrated optical sensors
KR101677157B1 (ko) * 2015-07-31 2016-11-17 (주)아이작리서치 기판 처리 장치
KR102618351B1 (ko) * 2016-07-19 2023-12-28 삼성디스플레이 주식회사 패턴위치조정기구가 구비된 마스크 프레임 조립체 및 그것을 이용한 패턴 위치 조정 방법
CN106148892B (zh) * 2016-07-25 2019-04-02 京东方科技集团股份有限公司 一种子掩膜版的张网方法及掩膜版、基板、显示装置
KR102696806B1 (ko) * 2016-09-22 2024-08-21 삼성디스플레이 주식회사 증착용 마스크, 표시 장치의 제조 장치 및 표시 장치의 제조 방법
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Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102804406A (zh) * 2009-04-03 2012-11-28 联合太阳能奥佛有限公司 带有改进幅材传输系统的卷对卷沉积设备
CN102453871A (zh) * 2010-10-18 2012-05-16 三星移动显示器株式会社 薄膜沉积设备以及掩模单元和坩埚单元
CN102453871B (zh) * 2010-10-18 2015-08-05 三星显示有限公司 薄膜沉积设备以及掩模单元和坩埚单元
CN102169927A (zh) * 2010-12-31 2011-08-31 东莞市万丰纳米材料有限公司 一种led芯片图形衬底制备装置
CN104507587A (zh) * 2012-08-30 2015-04-08 威兰德-沃克公开股份有限公司 用于热和/或动态涂覆系统的可移动掩模
CN103872265A (zh) * 2012-12-17 2014-06-18 环球展览公司 制造柔性有机电子装置
CN104419891B (zh) * 2013-09-11 2018-11-16 三星显示有限公司 对准掩模组件方法
CN104419891A (zh) * 2013-09-11 2015-03-18 三星显示有限公司 对准掩模组件方法
CN105900213B (zh) * 2013-12-30 2020-08-21 Gtat公司 用于cad反应器的改善的辐射屏障
CN105900213A (zh) * 2013-12-30 2016-08-24 Gtat公司 用于cad反应器的改善的辐射屏障
US11015244B2 (en) 2013-12-30 2021-05-25 Advanced Material Solutions, Llc Radiation shielding for a CVD reactor
CN106987798A (zh) * 2017-04-17 2017-07-28 京东方科技集团股份有限公司 一种镀膜装置
CN109402592A (zh) * 2017-08-18 2019-03-01 Tcl集团股份有限公司 器件侧面蒸镀装置及器件侧面蒸镀方法
CN109402592B (zh) * 2017-08-18 2020-06-26 Tcl科技集团股份有限公司 器件侧面蒸镀装置及器件侧面蒸镀方法
CN112996949A (zh) * 2018-11-14 2021-06-18 因诺弗莱克斯科技有限公司 用于将第一层和第二层沉积在基板上的系统和方法
CN116479422A (zh) * 2022-01-13 2023-07-25 宁德时代新能源科技股份有限公司 蚀刻设备
US12492479B2 (en) 2022-01-13 2025-12-09 Contemporary Amperex Technology (Hong Kong) Limited Etching device

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Publication number Publication date
US7763114B2 (en) 2010-07-27
EP1977024A4 (en) 2010-04-21
EP1977024A1 (en) 2008-10-08
US20070163494A1 (en) 2007-07-19
JP2009522448A (ja) 2009-06-11
WO2007078556A1 (en) 2007-07-12
TW200731344A (en) 2007-08-16

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Open date: 20090121