TW200729380A - Substrate processing equipment - Google Patents

Substrate processing equipment

Info

Publication number
TW200729380A
TW200729380A TW095144032A TW95144032A TW200729380A TW 200729380 A TW200729380 A TW 200729380A TW 095144032 A TW095144032 A TW 095144032A TW 95144032 A TW95144032 A TW 95144032A TW 200729380 A TW200729380 A TW 200729380A
Authority
TW
Taiwan
Prior art keywords
cluster
wafer
pass area
arm
substrate processing
Prior art date
Application number
TW095144032A
Other languages
English (en)
Other versions
TWI389236B (zh
Inventor
Gaku Ikeda
Keiji Osada
Kunio Takano
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200729380A publication Critical patent/TW200729380A/zh
Application granted granted Critical
Publication of TWI389236B publication Critical patent/TWI389236B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67184—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the presence of more than one transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Automation & Control Theory (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW095144032A 2005-11-28 2006-11-28 Substrate processing device TWI389236B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005342433A JP4925650B2 (ja) 2005-11-28 2005-11-28 基板処理装置

Publications (2)

Publication Number Publication Date
TW200729380A true TW200729380A (en) 2007-08-01
TWI389236B TWI389236B (zh) 2013-03-11

Family

ID=38067336

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095144032A TWI389236B (zh) 2005-11-28 2006-11-28 Substrate processing device

Country Status (6)

Country Link
US (1) US20090259335A1 (zh)
JP (1) JP4925650B2 (zh)
KR (1) KR100970516B1 (zh)
CN (1) CN100511628C (zh)
TW (1) TWI389236B (zh)
WO (1) WO2007061116A1 (zh)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI427729B (zh) * 2009-04-01 2014-02-21 Tokyo Electron Ltd The method of exchanging the substrate and a substrate processing apparatus
TWI601230B (zh) * 2015-08-11 2017-10-01 Advanced Micro-Fabrication Equipment Inc Substrate processing system
TWI637456B (zh) * 2013-11-21 2018-10-01 斯克林集團公司 基板搬送方法及基板處理裝置
TWI792520B (zh) * 2020-09-25 2023-02-11 日商日立全球先端科技股份有限公司 真空處理裝置之運轉方法

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2701402A1 (en) * 2007-10-24 2009-04-30 Oc Oerlikon Balzers Ag Method for manufacturing workpieces and apparatus
DE202009018998U1 (de) 2008-09-04 2015-04-29 Swat Medical Ab Faltbare temporäre Embolieschutzvorrichtung mit länglicher blutdurchlässiger Einheit
JP5384925B2 (ja) * 2008-12-18 2014-01-08 株式会社日立国際電気 基板処理装置及び半導体装置の製造方法
US8666551B2 (en) * 2008-12-22 2014-03-04 Asm Japan K.K. Semiconductor-processing apparatus equipped with robot diagnostic module
TWI532114B (zh) * 2009-11-12 2016-05-01 Hitachi High Tech Corp Vacuum processing device and operation method of vacuum processing device
JP5557516B2 (ja) * 2009-12-09 2014-07-23 株式会社日立ハイテクノロジーズ 真空処理装置
CN102403249B (zh) * 2010-09-07 2014-03-05 上海凯世通半导体有限公司 真空传输制程设备及方法
JP5665454B2 (ja) * 2010-09-22 2015-02-04 株式会社日立国際電気 基板処理装置及び半導体装置の製造方法
JP5562189B2 (ja) * 2010-09-22 2014-07-30 東京エレクトロン株式会社 基板処理装置
JP5473857B2 (ja) * 2010-10-14 2014-04-16 東京エレクトロン株式会社 搬送装置および処理システム
CN102456595B (zh) * 2010-10-26 2014-04-30 上海凯世通半导体有限公司 真空传输制程设备及方法
JP5883232B2 (ja) 2011-03-26 2016-03-09 東京エレクトロン株式会社 基板処理装置
CN103227233B (zh) * 2012-01-31 2015-07-22 上海凯世通半导体有限公司 真空传输制程设备及方法
JP6002532B2 (ja) * 2012-10-10 2016-10-05 株式会社日立ハイテクノロジーズ 真空処理装置及び真空処理方法
CN105706227B (zh) 2013-11-04 2019-11-26 应用材料公司 具有增加的侧面数量的传送腔室、半导体装置制造处理工具和处理方法
CN104812686B (zh) * 2013-11-26 2017-08-25 科磊股份有限公司 用于拾取工件的取放头及方法
US10269606B2 (en) * 2014-05-05 2019-04-23 Persimmon Technologies Corporation Two-link arm trajectory
JP6430156B2 (ja) * 2014-06-19 2018-11-28 東京エレクトロン株式会社 基板処理システム、仕切弁及び基板搬送方法
CN105448788B (zh) * 2014-07-01 2018-12-11 北京北方华创微电子装备有限公司 一种反应腔室、晶片传输方法及等离子体加工设备
KR101642919B1 (ko) * 2015-02-24 2016-07-26 코스텍시스템(주) 웨이퍼 이송 장치 및 이송 방법
KR101837545B1 (ko) * 2015-10-02 2018-04-20 에이피시스템 주식회사 Tsv 공정용 진공 라미네이팅 방법
JP6842828B2 (ja) 2015-12-24 2021-03-17 東京エレクトロン株式会社 処理システム及び処理プログラム
KR101912772B1 (ko) * 2016-12-26 2019-01-14 주식회사 한화 광기전력 소자 제조 장치 및 제조 방법
JP7316121B2 (ja) 2019-07-05 2023-07-27 東京エレクトロン株式会社 基板搬送装置及び基板搬送方法
CN114902392A (zh) * 2020-01-06 2022-08-12 朗姆研究公司 衬底处理工具的多种模块的硬件部件的自动配置

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6275744B1 (en) * 1997-08-01 2001-08-14 Kokusai Electric Co., Ltd. Substrate feed control
JP3193904B2 (ja) * 1997-08-01 2001-07-30 株式会社日立国際電気 基板搬送制御方法及び基板製品の製造方法
JPH11163087A (ja) * 1997-12-01 1999-06-18 Toshiba Microelectronics Corp 基板処理装置及び搬送スケジューリング方法
US7105434B2 (en) * 1999-10-02 2006-09-12 Uri Cohen Advanced seed layery for metallic interconnects
US6684122B1 (en) * 2000-01-03 2004-01-27 Advanced Micro Devices, Inc. Control mechanism for matching process parameters in a multi-chamber process tool
JP2002261148A (ja) * 2001-03-05 2002-09-13 Tokyo Electron Ltd 処理システム及び被処理体の予熱方法
US20020159864A1 (en) * 2001-04-30 2002-10-31 Applied Materials, Inc. Triple chamber load lock
JP2003036107A (ja) * 2001-07-26 2003-02-07 Nec Corp 設備処理時間算出方法、設備処理時間算出装置および設備処理時間算出プログラムを記録した記録媒体
JP4821074B2 (ja) * 2001-08-31 2011-11-24 東京エレクトロン株式会社 処理システム
JP4348921B2 (ja) * 2002-09-25 2009-10-21 東京エレクトロン株式会社 被処理体の搬送方法
JP4239572B2 (ja) * 2002-11-27 2009-03-18 東京エレクトロン株式会社 搬送システムの搬送位置合わせ方法及び処理システム
US8078311B2 (en) * 2004-12-06 2011-12-13 Tokyo Electron Limited Substrate processing apparatus and substrate transfer method adopted in substrate processing apparatus
US8244391B2 (en) * 2008-05-28 2012-08-14 International Business Machines Corporation Method for minimizing productivity loss while using a manufacturing scheduler
TW201135613A (en) * 2010-04-07 2011-10-16 Inotera Memories Inc Method for planning production schedule of equipment and associated computer readable medium
JP5654807B2 (ja) * 2010-09-07 2015-01-14 東京エレクトロン株式会社 基板搬送方法及び記憶媒体
JP2012061585A (ja) * 2010-09-17 2012-03-29 Tokyo Electron Ltd 真空処理装置、真空処理方法及び微細加工装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI427729B (zh) * 2009-04-01 2014-02-21 Tokyo Electron Ltd The method of exchanging the substrate and a substrate processing apparatus
TWI637456B (zh) * 2013-11-21 2018-10-01 斯克林集團公司 基板搬送方法及基板處理裝置
TWI601230B (zh) * 2015-08-11 2017-10-01 Advanced Micro-Fabrication Equipment Inc Substrate processing system
TWI792520B (zh) * 2020-09-25 2023-02-11 日商日立全球先端科技股份有限公司 真空處理裝置之運轉方法

Also Published As

Publication number Publication date
US20090259335A1 (en) 2009-10-15
KR100970516B1 (ko) 2010-07-16
JP4925650B2 (ja) 2012-05-09
JP2007149973A (ja) 2007-06-14
CN100511628C (zh) 2009-07-08
KR20080008411A (ko) 2008-01-23
CN101103452A (zh) 2008-01-09
WO2007061116A1 (ja) 2007-05-31
TWI389236B (zh) 2013-03-11

Similar Documents

Publication Publication Date Title
TW200729380A (en) Substrate processing equipment
PT1925577E (pt) Processo para a formação de um conjunto de wafers costas com costas, a posicionar numa nacela, e sistema de manuseamento para a formação do conjunto de wafers costas com costas
TW200633825A (en) Substrate processing system and substrate processing program
WO2008085681A3 (en) Wet clean system design
TW200707621A (en) Cartesian robot cluster tool architecture
WO2007139981A3 (en) Linearly distributed semiconductor workpiece processing tool
EP1793021A3 (en) Method for semiconductor processing using silicon carbide article
MY161955A (en) Systems and methods for handling wafers
WO2007107983A3 (en) Storage and purge system for semiconductor wafers
MY175007A (en) Substrate processing system and method
TW200717689A (en) Methods and apparatus for a band to band transfer module
SG143963A1 (en) Recipe cascading in a wafer processing system
AU2002365591A1 (en) Wafer handling apparatus and method
WO2007101228A3 (en) Semiconductor wafer handling and transport
TW200616074A (en) Cleaning process for semiconductor substrates
WO2009033126A3 (en) Transport system with buffering
JP2011124564A5 (ja) 真空処理装置及び真空処理装置の運転方法
TW200711027A (en) Substrate processing system and substrate processing method
TW200612502A (en) Method and apparatus for mounting semiconductor chips
EP1422742A3 (en) System for processing semiconductor wafers
TW200707620A (en) Distributed control sheet transfer system
TW200508140A (en) Method and apparatus for vertical transfer of semiconductor substrates between cleaning modules
WO2006069341A3 (en) Cluster tool architecture for processing a substrate
KR20130105671A (ko) 발광다이오드 공정의 통합 시스템 및 그 공정 방법
TW200603215A (en) Apparatus for manufacturing substrate

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees