TW200707620A - Distributed control sheet transfer system - Google Patents

Distributed control sheet transfer system

Info

Publication number
TW200707620A
TW200707620A TW094127288A TW94127288A TW200707620A TW 200707620 A TW200707620 A TW 200707620A TW 094127288 A TW094127288 A TW 094127288A TW 94127288 A TW94127288 A TW 94127288A TW 200707620 A TW200707620 A TW 200707620A
Authority
TW
Taiwan
Prior art keywords
semiconductor wafer
conveyor
manufacturing apparatus
wafer
conveyed
Prior art date
Application number
TW094127288A
Other languages
Chinese (zh)
Inventor
Takeo Koinuma
Original Assignee
Japan Minicomp Systems Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Minicomp Systems Co Ltd filed Critical Japan Minicomp Systems Co Ltd
Publication of TW200707620A publication Critical patent/TW200707620A/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box

Abstract

To construct a sheet transfer system with a distributed control, which does not require centralized control of all manufacturing line. In the invention, each of semiconductor wafers 1 is carried on a wafer carrier 2. An ID tag 4 having a readable and writable memory is attached to each wafer carrier 2 and the semiconductor wafer is conveyed on a conveyor 3 together with the wafer carrier 2. Each manufacturing apparatus 5 has an equipment front end module 6(EFEM) for controlling the incoming and outgoing of the semiconductor wafers 1. The equipment front end module 6 reads information on the processes performed on each semiconductor wafer 1 being conveyed on the conveyor 3 from the memory-equipped ID tag 4 for the semiconductor wafer 1 and determines whether the semiconductor wafer 1 needs to be processed in the manufacturing apparatus 5. If the semiconductor wafer 1 needs so, it is taken into the manufacturing apparatus 5 and processed therein. After the process, the equipment front end module 6 adds the information on the process performed in the manufacturing apparatus 5 to the previous information in the memory-equipped tag 4 on the wafer carrier 2 carries the semiconductor wafer processed by the equipment. Then, the semiconductor wafer 1 is returned onto the conveyor 3 and conveyed on the conveyor 3.
TW094127288A 2004-04-27 2005-08-11 Distributed control sheet transfer system TW200707620A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004131666A JP2005317653A (en) 2004-04-27 2004-04-27 Distributed control single wafer carrying system

Publications (1)

Publication Number Publication Date
TW200707620A true TW200707620A (en) 2007-02-16

Family

ID=35444776

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094127288A TW200707620A (en) 2004-04-27 2005-08-11 Distributed control sheet transfer system

Country Status (2)

Country Link
JP (1) JP2005317653A (en)
TW (1) TW200707620A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI420271B (en) * 2011-01-21 2013-12-21 Neo Solar Power Corp Processing equipment, processing system and operating method of processing system
CN110875218A (en) * 2018-08-30 2020-03-10 台湾积体电路制造股份有限公司 Semiconductor manufacturing apparatus and method

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9478501B2 (en) 2006-03-08 2016-10-25 Erich Thallner Substrate processing and alignment
ATE409893T1 (en) * 2006-03-08 2008-10-15 Erich Thallner METHOD FOR PRODUCING A COMPONENT AND APPARATUS FOR PROCESSING A SUBSTRATE, AND SUBSTRATE SUPPORT
JP4826305B2 (en) * 2006-03-20 2011-11-30 凸版印刷株式会社 Temperature measurement method for color filter manufacturing process
US20110241845A1 (en) * 2010-04-06 2011-10-06 Sullivan Robert P Automated Material Handling System with Identification Features
WO2018182504A1 (en) * 2017-03-31 2018-10-04 Neitas Pte. Ltd. Microdevice manufacturing system
CN108734240A (en) * 2018-07-09 2018-11-02 苏州德尔富自动化科技有限公司 The barcode scanning binding device of collector based on RFID

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2539447B2 (en) * 1987-08-12 1996-10-02 株式会社日立製作所 Production method by single-wafer carrier
JPH08148538A (en) * 1994-11-21 1996-06-07 Hitachi Ltd Method and system for producing semiconductor device and carrier case
JP2000068350A (en) * 1998-08-24 2000-03-03 Mitsubishi Electric Corp Transfer apparatus for single-wafer storage cassette and transfer method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI420271B (en) * 2011-01-21 2013-12-21 Neo Solar Power Corp Processing equipment, processing system and operating method of processing system
CN110875218A (en) * 2018-08-30 2020-03-10 台湾积体电路制造股份有限公司 Semiconductor manufacturing apparatus and method
CN110875218B (en) * 2018-08-30 2022-04-05 台湾积体电路制造股份有限公司 Semiconductor manufacturing apparatus and method
US11380570B2 (en) 2018-08-30 2022-07-05 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus and methods for determining wafer characters

Also Published As

Publication number Publication date
JP2005317653A (en) 2005-11-10

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