TW200712521A - Semiconductor test apparatus - Google Patents

Semiconductor test apparatus

Info

Publication number
TW200712521A
TW200712521A TW095127295A TW95127295A TW200712521A TW 200712521 A TW200712521 A TW 200712521A TW 095127295 A TW095127295 A TW 095127295A TW 95127295 A TW95127295 A TW 95127295A TW 200712521 A TW200712521 A TW 200712521A
Authority
TW
Taiwan
Prior art keywords
test apparatus
signal lines
semiconductor test
duts
drivers
Prior art date
Application number
TW095127295A
Other languages
Chinese (zh)
Other versions
TWI317814B (en
Inventor
Nobusuke Seki
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Publication of TW200712521A publication Critical patent/TW200712521A/en
Application granted granted Critical
Publication of TWI317814B publication Critical patent/TWI317814B/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/3183—Generation of test inputs, e.g. test vectors, patterns or sequences
    • G01R31/318314—Tools, e.g. program interfaces, test suite, test bench, simulation hardware, test compiler, test program languages
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/01—Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2884—Testing of integrated circuits [IC] using dedicated test connectors, test elements or test circuits on the IC under test
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/319—Tester hardware, i.e. output processing circuits
    • G01R31/31917—Stimuli generation or application of test patterns to the device under test [DUT]
    • G01R31/31924—Voltage or current aspects, e.g. driver, receiver

Abstract

It is object of this invention to provide a Semiconductor Test Apparatus enables to prevent the deterioration of measurements accuracy as well as to increase the numbers of DUT that can be measured at once. The semiconductor test apparatus is comprising drivers DR for inputting signals to pins of DUTs 200, signal lines of which one end is connected to output terminal of the drivers DR and having a plurality of junction points that are provided on the signal lines, and terminating resistors 28 that connected to another end of the signal lines. Each of a plurality of the DUTs 200 are connected to a plurality of the junction points provided on the signal lines, respectively.
TW095127295A 2005-08-09 2006-07-26 Semiconductor test apparatus TWI317814B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005230198 2005-08-09

Publications (2)

Publication Number Publication Date
TW200712521A true TW200712521A (en) 2007-04-01
TWI317814B TWI317814B (en) 2009-12-01

Family

ID=37727209

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095127295A TWI317814B (en) 2005-08-09 2006-07-26 Semiconductor test apparatus

Country Status (4)

Country Link
JP (1) JP5038137B2 (en)
KR (2) KR20080014995A (en)
TW (1) TWI317814B (en)
WO (1) WO2007018020A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI384240B (en) * 2008-07-15 2013-02-01 Advantest Corp Test apparatus

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7797121B2 (en) * 2007-06-07 2010-09-14 Advantest Corporation Test apparatus, and device for calibration
US8326565B2 (en) * 2007-08-22 2012-12-04 Advantest (Singapore) Pte Ltd Chip tester, method for providing timing information, test fixture set, apparatus for post-processing propagation delay information, method for post-processing delay information, chip test set up and method for testing devices under test
KR20110033846A (en) * 2008-07-03 2011-03-31 가부시키가이샤 어드밴티스트 Test device and socket board
KR101151686B1 (en) * 2012-02-29 2012-06-14 주식회사 유니테스트 Burn-In Tester
TWI569278B (en) * 2015-04-28 2017-02-01 晨星半導體股份有限公司 Circuit for generating memory test data and method thereof
CN109591658B (en) * 2018-10-23 2022-05-27 大唐恩智浦半导体有限公司 Battery management device, method and chip
KR102440440B1 (en) * 2020-12-16 2022-09-06 와이아이케이 주식회사 Semiconductor device inspection equipment

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0352686U (en) * 1989-09-29 1991-05-22
JP4263810B2 (en) * 1998-06-24 2009-05-13 株式会社アドバンテスト Semiconductor memory test apparatus and test method
KR100294021B1 (en) * 1998-09-08 2001-07-12 윤종용 Memory module test device
JP2000091893A (en) * 1998-09-14 2000-03-31 Hitachi Ltd Pulse generating circuit and tester using the same
JP2000292502A (en) * 1999-02-03 2000-10-20 Hitachi Electronics Eng Co Ltd Semiconductor device-testing apparatus and method for testing semiconductor device
JP2002005999A (en) * 2000-06-20 2002-01-09 Advantest Corp Semiconductor testing device
JP2002040108A (en) * 2000-07-27 2002-02-06 Advantest Corp Semiconductor device testing apparatus and method for timing calibration of the same
JP2002107406A (en) * 2000-09-29 2002-04-10 Advantest Corp Semiconductor testing device
JP2002323539A (en) * 2001-04-26 2002-11-08 Advantest Corp Semiconductor testing device and its correcting method
JP2003043066A (en) * 2001-07-26 2003-02-13 Hoya Corp Contact probe member and its production method
JP4214361B2 (en) * 2002-04-24 2009-01-28 横河電機株式会社 IC test apparatus and output signal timing adjustment method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI384240B (en) * 2008-07-15 2013-02-01 Advantest Corp Test apparatus

Also Published As

Publication number Publication date
KR20080014995A (en) 2008-02-15
KR101088203B1 (en) 2011-11-30
JP5038137B2 (en) 2012-10-03
KR20090061083A (en) 2009-06-15
WO2007018020A1 (en) 2007-02-15
JPWO2007018020A1 (en) 2009-02-19
TWI317814B (en) 2009-12-01

Similar Documents

Publication Publication Date Title
TW200712521A (en) Semiconductor test apparatus
ATE408149T1 (en) CALIBRATION AND DE-EMBEDDING METHOD, DE-EMBEDDING DEVICES AND NETWORK VECTOR ANALYZER
US9625495B2 (en) Isolated probe with digital multimeter or digital voltmeter
CN104729539B (en) Measurement system comprising an accessory with an internal calibration signal
WO2006028984A3 (en) Noninvasive testing of a material intermediate spaced walls
TW200515357A (en) Inspection method and inspection device for display device and active matrix substrate used for display device
KR101306283B1 (en) A power supply device for testing a semiconductor element
US10481204B2 (en) Methods and systems to measure a signal on an integrated circuit die
WO2005043176A3 (en) Probe testing structure
ES2723430A1 (en) Method for the evaluation and qualification of the functional characteristics of measurement and diagnosis instruments of partial discharges and installation to generate series of reference pulses of partial discharges (Machine-translation by Google Translate, not legally binding)
TW200602649A (en) Parallel calibration system for a test device
DE602004024123D1 (en) MAGNETIC FIELD-SENSOR ASSEMBLY
JP6482784B2 (en) Identify defective electrical cables
TW200617411A (en) IC tester
US20180136268A1 (en) Measurement device and method for measuring the impedance of a device under test
US20090079462A1 (en) Semiconductor device testing apparatus
CN101918851A (en) Voltage source measurement unit with minimized common mode errors
TW200718958A (en) IC tester
TW200636251A (en) Apparatus and method for terminating probe appartus of semiconductor wafer
TW200745575A (en) IC tester
US7906977B1 (en) Dual output stage source measure circuit
TW200506378A (en) Probe for testing a device under test
Moreira Design of a high bandwidth interposer for performance evaluation of ate test fixtures at the dut socket
TW200634324A (en) Test system
TWI839902B (en) Probe test connector

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees