TW200706629A - Surface protective sheet for laser processing - Google Patents

Surface protective sheet for laser processing

Info

Publication number
TW200706629A
TW200706629A TW095123107A TW95123107A TW200706629A TW 200706629 A TW200706629 A TW 200706629A TW 095123107 A TW095123107 A TW 095123107A TW 95123107 A TW95123107 A TW 95123107A TW 200706629 A TW200706629 A TW 200706629A
Authority
TW
Taiwan
Prior art keywords
protective sheet
surface protective
base material
material layer
laser processing
Prior art date
Application number
TW095123107A
Other languages
English (en)
Other versions
TWI408203B (zh
Inventor
Ikkou Hanaki
Keiji Hayashi
Kazuhito Okumura
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of TW200706629A publication Critical patent/TW200706629A/zh
Application granted granted Critical
Publication of TWI408203B publication Critical patent/TWI408203B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B23K26/706—Protective screens
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/06—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for positioning the molten material, e.g. confining it to a desired area
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/241—Polyolefin, e.g.rubber
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/255—Polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/02—Iron or ferrous alloys
    • B23K2103/04—Steel or steel alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/02—Iron or ferrous alloys
    • B23K2103/04—Steel or steel alloys
    • B23K2103/05—Stainless steel
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/10—Aluminium or alloys thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/266—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension of base or substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Laser Beam Processing (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
TW95123107A 2005-06-27 2006-06-27 雷射加工用表面保護片材 TWI408203B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005187216 2005-06-27

Publications (2)

Publication Number Publication Date
TW200706629A true TW200706629A (en) 2007-02-16
TWI408203B TWI408203B (zh) 2013-09-11

Family

ID=37595311

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95123107A TWI408203B (zh) 2005-06-27 2006-06-27 雷射加工用表面保護片材

Country Status (6)

Country Link
US (2) US20090123740A1 (zh)
EP (1) EP1900470B1 (zh)
KR (1) KR20080023263A (zh)
CN (2) CN101208172A (zh)
TW (1) TWI408203B (zh)
WO (1) WO2007001078A1 (zh)

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EP2489497B1 (en) * 2009-10-15 2014-12-24 ASICS Corporation Layered product for laser bonding, shoe, and process for producing shoe
WO2011158617A1 (ja) * 2010-06-14 2011-12-22 三菱電機株式会社 レーザ加工装置、及びレーザ加工方法
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JP5153917B2 (ja) * 2011-05-30 2013-02-27 アルプス電気株式会社 レンズ駆動装置及びレンズ駆動装置の製造方法
EP2712699A1 (de) * 2012-10-01 2014-04-02 Siemens Aktiengesellschaft Verfahren zum Schutz eines Bauteils, Verfahren zum Laserbohren und Bauteil
US20180370205A1 (en) * 2015-12-30 2018-12-27 3M Innovative Properties Company Infrared absorbing adhesive films and related methods
JP7089347B2 (ja) * 2016-07-20 2022-06-22 日東電工株式会社 粘着シート
WO2019077394A1 (en) * 2017-10-20 2019-04-25 Arcelormittal METHOD FOR MANUFACTURING PRE-COATED STEEL SHEET AND ASSOCIATED SHEET
WO2020039970A1 (ja) * 2018-08-20 2020-02-27 日本ゼオン株式会社 カットフィルムの製造方法、カットフィルム、及びカットフィルム用フィルム
CN112122797A (zh) * 2020-09-24 2020-12-25 松山湖材料实验室 激光加工熔渣去除方法、系统、计算机设备及可读存储介质
CN113547210A (zh) * 2021-07-15 2021-10-26 Tcl华星光电技术有限公司 颗粒物粘附装置与激光处理工艺
DE102021123617A1 (de) 2021-09-13 2023-03-16 Precitec Gmbh & Co. Kg Laserbearbeitungskopf mit Klebefalle

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Also Published As

Publication number Publication date
TWI408203B (zh) 2013-09-11
US20090123740A1 (en) 2009-05-14
US9089930B2 (en) 2015-07-28
EP1900470A4 (en) 2009-05-13
WO2007001078A1 (ja) 2007-01-04
CN102009270B (zh) 2013-03-06
CN102009270A (zh) 2011-04-13
EP1900470B1 (en) 2012-06-13
US20110011841A1 (en) 2011-01-20
EP1900470A1 (en) 2008-03-19
KR20080023263A (ko) 2008-03-12
CN101208172A (zh) 2008-06-25

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MM4A Annulment or lapse of patent due to non-payment of fees