TW200705594A - Semiconductor device and its manufacturing method - Google Patents
Semiconductor device and its manufacturing methodInfo
- Publication number
- TW200705594A TW200705594A TW095121404A TW95121404A TW200705594A TW 200705594 A TW200705594 A TW 200705594A TW 095121404 A TW095121404 A TW 095121404A TW 95121404 A TW95121404 A TW 95121404A TW 200705594 A TW200705594 A TW 200705594A
- Authority
- TW
- Taiwan
- Prior art keywords
- metal wiring
- electrode
- inspection
- manufacturing
- semiconductor device
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2853—Electrical testing of internal connections or -isolation, e.g. latch-up or chip-to-lead connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/5228—Resistive arrangements or effects of, or between, wiring layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005177067 | 2005-06-17 | ||
JP2006102611A JP4592634B2 (ja) | 2005-06-17 | 2006-04-04 | 半導体装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200705594A true TW200705594A (en) | 2007-02-01 |
Family
ID=37573889
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095121404A TW200705594A (en) | 2005-06-17 | 2006-06-15 | Semiconductor device and its manufacturing method |
Country Status (3)
Country | Link |
---|---|
US (1) | US7595557B2 (zh) |
JP (1) | JP4592634B2 (zh) |
TW (1) | TW200705594A (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011014434A2 (en) * | 2009-07-31 | 2011-02-03 | Altera Corporation | Bond and probe pad distribution and package architecture |
US9267985B2 (en) * | 2009-07-31 | 2016-02-23 | Altera Corporation | Bond and probe pad distribution |
JP2011249366A (ja) | 2010-05-21 | 2011-12-08 | Panasonic Corp | 半導体装置及びその製造方法 |
JP2014139985A (ja) * | 2013-01-21 | 2014-07-31 | Renesas Electronics Corp | 半導体装置 |
US9704809B2 (en) * | 2013-03-05 | 2017-07-11 | Maxim Integrated Products, Inc. | Fan-out and heterogeneous packaging of electronic components |
US9082765B2 (en) * | 2013-03-08 | 2015-07-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | Bump-on-trace (BOT) structures and methods for forming the same |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6148927A (ja) | 1984-08-16 | 1986-03-10 | Matsushita Electronics Corp | 半導体装置 |
JPH03278552A (ja) * | 1990-03-28 | 1991-12-10 | Nec Corp | 半導体集積回路装置 |
JPH05144901A (ja) | 1991-11-21 | 1993-06-11 | Oki Electric Ind Co Ltd | 微細パターンを有するデバイスの不良箇所検出方法 |
US5334857A (en) * | 1992-04-06 | 1994-08-02 | Motorola, Inc. | Semiconductor device with test-only contacts and method for making the same |
JPH06120307A (ja) | 1992-10-08 | 1994-04-28 | Matsushita Electron Corp | 半導体装置 |
JPH09330934A (ja) * | 1996-06-12 | 1997-12-22 | Toshiba Corp | 半導体装置及びその製造方法 |
JPH11274252A (ja) * | 1998-03-19 | 1999-10-08 | Mitsubishi Electric Corp | 半導体装置の検査装置及びその検査方法 |
US6233184B1 (en) * | 1998-11-13 | 2001-05-15 | International Business Machines Corporation | Structures for wafer level test and burn-in |
JP2000294730A (ja) * | 1999-04-09 | 2000-10-20 | Mitsubishi Electric Corp | システムlsiチップ及びその製造方法 |
JP2002039801A (ja) | 2000-06-08 | 2002-02-06 | Internatl Business Mach Corp <Ibm> | 特性値表示方法および特性値表示装置 |
US6590225B2 (en) * | 2001-01-19 | 2003-07-08 | Texas Instruments Incorporated | Die testing using top surface test pads |
JP2002296314A (ja) * | 2001-03-29 | 2002-10-09 | Hitachi Ltd | 半導体デバイスのコンタクト不良検査方法及びその装置 |
TW558772B (en) * | 2001-08-08 | 2003-10-21 | Matsushita Electric Ind Co Ltd | Semiconductor wafer, semiconductor device and fabrication method thereof |
JP3940591B2 (ja) | 2001-11-28 | 2007-07-04 | 沖電気工業株式会社 | 半導体装置の電気特性のシミュレーション方法 |
JP2004253445A (ja) * | 2003-02-18 | 2004-09-09 | Renesas Technology Corp | 半導体装置およびその製造方法 |
JP2004296464A (ja) * | 2003-03-25 | 2004-10-21 | Denso Corp | 半導体装置 |
JP4409348B2 (ja) * | 2004-04-26 | 2010-02-03 | 三菱電機株式会社 | 半導体装置およびその製造方法 |
-
2006
- 2006-04-04 JP JP2006102611A patent/JP4592634B2/ja not_active Expired - Fee Related
- 2006-06-15 TW TW095121404A patent/TW200705594A/zh unknown
- 2006-06-16 US US11/453,827 patent/US7595557B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
JP2007027685A (ja) | 2007-02-01 |
US20060286689A1 (en) | 2006-12-21 |
US7595557B2 (en) | 2009-09-29 |
JP4592634B2 (ja) | 2010-12-01 |
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