TW200713482A - Method and apparatus for in-situ substrate surface arc detection - Google Patents

Method and apparatus for in-situ substrate surface arc detection

Info

Publication number
TW200713482A
TW200713482A TW095126833A TW95126833A TW200713482A TW 200713482 A TW200713482 A TW 200713482A TW 095126833 A TW095126833 A TW 095126833A TW 95126833 A TW95126833 A TW 95126833A TW 200713482 A TW200713482 A TW 200713482A
Authority
TW
Taiwan
Prior art keywords
substrate
arc detection
substrate surface
surface arc
situ substrate
Prior art date
Application number
TW095126833A
Other languages
Chinese (zh)
Inventor
David H Loo
xian-min Tang
Steven V Sansoni
Cheng-Hsiung Tsai
Suraj Rengarajin
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of TW200713482A publication Critical patent/TW200713482A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/12—Testing dielectric strength or breakdown voltage ; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing
    • G01R31/1227—Testing dielectric strength or breakdown voltage ; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing of components, parts or materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/02—Details
    • H01J2237/0203—Protection arrangements
    • H01J2237/0206—Extinguishing, preventing or controlling unwanted discharges
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
    • H01J2237/2007—Holding mechanisms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

Embodiments of a method and apparatus for in-situ substrate surface arc detection are provided herein. In one embodiment, an apparatus for detecting arcing on the surface of a substrate on an electrostatic chuck, having an electrostatic chucking assembly, disposed within a semiconductor processing chamber includes a voltage divider having an input configured to receive an input signal from the electrostatic chucking assembly representative of a voltage on a surface of a substrate; and a monitoring circuit coupled to the voltage divider for generating an output signal indicative of whether arcing has occurred on the surface of a substrate.
TW095126833A 2005-07-21 2006-07-21 Method and apparatus for in-situ substrate surface arc detection TW200713482A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US70131605P 2005-07-21 2005-07-21

Publications (1)

Publication Number Publication Date
TW200713482A true TW200713482A (en) 2007-04-01

Family

ID=37683885

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095126833A TW200713482A (en) 2005-07-21 2006-07-21 Method and apparatus for in-situ substrate surface arc detection

Country Status (2)

Country Link
TW (1) TW200713482A (en)
WO (1) WO2007014160A2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI508631B (en) * 2009-07-20 2015-11-11 Lam Res Corp System and method for plasma arc detection, isolation and prevention
CN108732493A (en) * 2018-06-21 2018-11-02 沈阳工业大学 A kind of experimental rig and method being suitable for measuring arc voltage
TWI807466B (en) * 2020-12-29 2023-07-01 大陸商中微半導體設備（上海）股份有限公司 Susceptor element and plasma processing apparatus

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102595525B (en) 2008-04-28 2016-03-30 华为技术有限公司 The successional method, system and device of a kind of maintenance customer service
US8901935B2 (en) * 2009-11-19 2014-12-02 Lam Research Corporation Methods and apparatus for detecting the confinement state of plasma in a plasma processing system
US8502689B2 (en) * 2010-09-23 2013-08-06 Applied Materials, Inc. System and method for voltage-based plasma excursion detection
DE102011112434A1 (en) * 2011-01-05 2012-07-05 Oerlikon Trading Ag, Trübbach Treating workpieces in vacuum treatment system comprises applying negative bias to workpiece, avoiding damage such that if current flowing via workpieces from measured average current deviates more than specific value interrupts treatment
JP6139449B2 (en) * 2014-03-26 2017-05-31 株式会社アドバンテスト Stage device and electron beam device
JP6225055B2 (en) * 2014-03-26 2017-11-01 株式会社アドバンテスト Stage device and electron beam device

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5706356A (en) * 1996-05-01 1998-01-06 Walden; Gaylord K. Audio processor
US6361645B1 (en) * 1998-10-08 2002-03-26 Lam Research Corporation Method and device for compensating wafer bias in a plasma processing chamber
US6563076B1 (en) * 1999-09-30 2003-05-13 Lam Research Corporation Voltage control sensor and control interface for radio frequency power regulation in a plasma reactor
JP3094731U (en) * 2002-12-17 2003-07-04 船井電機株式会社 RCC switching power supply and video cassette recorder having RCC switching power supply

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI508631B (en) * 2009-07-20 2015-11-11 Lam Res Corp System and method for plasma arc detection, isolation and prevention
CN108732493A (en) * 2018-06-21 2018-11-02 沈阳工业大学 A kind of experimental rig and method being suitable for measuring arc voltage
TWI807466B (en) * 2020-12-29 2023-07-01 大陸商中微半導體設備（上海）股份有限公司 Susceptor element and plasma processing apparatus

Also Published As

Publication number Publication date
WO2007014160A2 (en) 2007-02-01
WO2007014160A3 (en) 2007-05-18

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