TW200705482A - Capacitor layer forming material and method for manufacturing the same - Google Patents

Capacitor layer forming material and method for manufacturing the same

Info

Publication number
TW200705482A
TW200705482A TW095115246A TW95115246A TW200705482A TW 200705482 A TW200705482 A TW 200705482A TW 095115246 A TW095115246 A TW 095115246A TW 95115246 A TW95115246 A TW 95115246A TW 200705482 A TW200705482 A TW 200705482A
Authority
TW
Taiwan
Prior art keywords
layer
forming material
capacitor
dielectric film
dielectric layer
Prior art date
Application number
TW095115246A
Other languages
English (en)
Other versions
TWI298506B (zh
Inventor
Naohiko Abe
Akiko Sugioka
Akihiro Kanno
Hirotake Nakashima
Original Assignee
Mitsui Mining & Smelting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co filed Critical Mitsui Mining & Smelting Co
Publication of TW200705482A publication Critical patent/TW200705482A/zh
Application granted granted Critical
Publication of TWI298506B publication Critical patent/TWI298506B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/20—Dielectrics using combinations of dielectrics from more than one of groups H01G4/02 - H01G4/06
    • H01G4/206—Dielectrics using combinations of dielectrics from more than one of groups H01G4/02 - H01G4/06 inorganic and synthetic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/33—Thin- or thick-film capacitors 
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0175—Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1147—Sealing or impregnating, e.g. of pores
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
    • Y10T428/264—Up to 3 mils
    • Y10T428/265—1 mil or less
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/266—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension of base or substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
TW095115246A 2005-04-28 2006-04-28 Capacitor layer forming material and method for manufacturing the same TW200705482A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005133693A JP3841814B1 (ja) 2005-04-28 2005-04-28 キャパシタ層形成材及びそのキャパシタ層形成材の製造方法

Publications (2)

Publication Number Publication Date
TW200705482A true TW200705482A (en) 2007-02-01
TWI298506B TWI298506B (zh) 2008-07-01

Family

ID=37308032

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095115246A TW200705482A (en) 2005-04-28 2006-04-28 Capacitor layer forming material and method for manufacturing the same

Country Status (8)

Country Link
US (1) US7719818B2 (zh)
EP (1) EP1884968A1 (zh)
JP (1) JP3841814B1 (zh)
KR (1) KR20070108256A (zh)
CN (1) CN101164127B (zh)
CA (1) CA2604616A1 (zh)
TW (1) TW200705482A (zh)
WO (1) WO2006118237A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI387421B (zh) * 2006-12-26 2013-02-21 Mitsui Mining & Smelting Co A multilayer printed circuit board capacitor layer forming material, and a capacitor layer forming material

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006118236A1 (ja) * 2005-04-28 2006-11-09 Mitsui Mining & Smelting Co., Ltd 酸化物誘電層の形成方法及びその形成方法で得られた酸化物誘電層を備えたキャパシタ層形成材
JP2007194592A (ja) 2005-12-20 2007-08-02 Tdk Corp 誘電体素子とその製造方法
JP4973023B2 (ja) * 2006-06-19 2012-07-11 日本電気株式会社 薄膜キャパシタ及びその製造方法
WO2010137448A1 (ja) * 2009-05-29 2010-12-02 三洋電機株式会社 積層構造体及びその製造方法
US20170301477A1 (en) 2016-04-04 2017-10-19 Capacitor Sciences Incorporated Electro-polarizable compound and capacitor
US10340082B2 (en) 2015-05-12 2019-07-02 Capacitor Sciences Incorporated Capacitor and method of production thereof
EP3143630A4 (en) 2014-05-12 2018-01-10 Capacitor Sciences Incorporated Energy storage device and method of production thereof
US10347423B2 (en) 2014-05-12 2019-07-09 Capacitor Sciences Incorporated Solid multilayer structure as semiproduct for meta-capacitor
US10319523B2 (en) 2014-05-12 2019-06-11 Capacitor Sciences Incorporated Yanli dielectric materials and capacitor thereof
CA2948008A1 (en) * 2014-05-12 2015-11-19 Capacitor Sciences Incorporated Capacitor and method of production thereof
SG11201703441YA (en) 2014-11-04 2017-05-30 Capacitor Sciences Inc Energy storage devices and methods of production thereof
US9852846B2 (en) 2015-02-26 2017-12-26 Capacitor Sciences Incorporated Self-healing capacitor and methods of production thereof
US9932358B2 (en) 2015-05-21 2018-04-03 Capacitor Science Incorporated Energy storage molecular material, crystal dielectric layer and capacitor
US9941051B2 (en) 2015-06-26 2018-04-10 Capactor Sciences Incorporated Coiled capacitor
US10026553B2 (en) 2015-10-21 2018-07-17 Capacitor Sciences Incorporated Organic compound, crystal dielectric layer and capacitor
US10636575B2 (en) 2016-02-12 2020-04-28 Capacitor Sciences Incorporated Furuta and para-Furuta polymer formulations and capacitors
US10305295B2 (en) 2016-02-12 2019-05-28 Capacitor Sciences Incorporated Energy storage cell, capacitive energy storage module, and capacitive energy storage system
US9978517B2 (en) 2016-04-04 2018-05-22 Capacitor Sciences Incorporated Electro-polarizable compound and capacitor
US10153087B2 (en) 2016-04-04 2018-12-11 Capacitor Sciences Incorporated Electro-polarizable compound and capacitor
US10566138B2 (en) 2016-04-04 2020-02-18 Capacitor Sciences Incorporated Hein electro-polarizable compound and capacitor thereof
US10395841B2 (en) 2016-12-02 2019-08-27 Capacitor Sciences Incorporated Multilayered electrode and film energy storage device
KR20190121210A (ko) * 2018-10-17 2019-10-25 삼성전기주식회사 적층 세라믹 전자부품 및 그 제조방법
KR102281132B1 (ko) * 2019-10-24 2021-07-26 일진머티리얼즈 주식회사 박막형 커패시터 제조용 전해니켈박 및 그의 제조방법
JP7476667B2 (ja) 2020-05-26 2024-05-01 株式会社豊田中央研究所 複合誘電体薄膜

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03177376A (ja) * 1989-12-04 1991-08-01 Japan Gore Tex Inc セラミック基板
JP3108797B2 (ja) 1992-10-26 2000-11-13 富士通株式会社 高誘電率誘電体薄膜の製造方法
JPH07294862A (ja) 1994-04-22 1995-11-10 Sumitomo Electric Ind Ltd 酸化物誘電体薄膜およびその製造方法
US20040109298A1 (en) * 1998-05-04 2004-06-10 Hartman William F. Dielectric material including particulate filler
JP3401220B2 (ja) * 1998-12-22 2003-04-28 松下電器産業株式会社 フレキシブル薄膜コンデンサおよびその製造方法
EP1014399B1 (en) * 1998-12-22 2006-05-17 Matsushita Electric Industrial Co., Ltd. Flexible thin film capacitor and method for producing the same
US6194990B1 (en) 1999-03-16 2001-02-27 Motorola, Inc. Printed circuit board with a multilayer integral thin-film metal resistor and method therefor
JP2001185445A (ja) * 1999-12-24 2001-07-06 Kyocera Corp 薄膜電子部品
US6573584B1 (en) * 1999-10-29 2003-06-03 Kyocera Corporation Thin film electronic device and circuit board mounting the same
JP3572228B2 (ja) * 1999-10-29 2004-09-29 京セラ株式会社 薄膜電子部品
JP2001358303A (ja) 2000-06-14 2001-12-26 Nec Corp 薄膜キャパシタおよびその製造方法
US6699748B2 (en) * 2002-05-30 2004-03-02 Mitsubishi Denki Kabushiki Kaisha Method of fabricating capacitor having a photosensitive resin layer as a dielectric

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI387421B (zh) * 2006-12-26 2013-02-21 Mitsui Mining & Smelting Co A multilayer printed circuit board capacitor layer forming material, and a capacitor layer forming material

Also Published As

Publication number Publication date
EP1884968A1 (en) 2008-02-06
KR20070108256A (ko) 2007-11-08
WO2006118237A1 (ja) 2006-11-09
US7719818B2 (en) 2010-05-18
CN101164127B (zh) 2010-11-17
TWI298506B (zh) 2008-07-01
US20080283283A1 (en) 2008-11-20
JP2006310666A (ja) 2006-11-09
CN101164127A (zh) 2008-04-16
JP3841814B1 (ja) 2006-11-08
CA2604616A1 (en) 2006-11-09

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees