TW200704304A - Printed wiring board manufacturing method - Google Patents

Printed wiring board manufacturing method

Info

Publication number
TW200704304A
TW200704304A TW094146664A TW94146664A TW200704304A TW 200704304 A TW200704304 A TW 200704304A TW 094146664 A TW094146664 A TW 094146664A TW 94146664 A TW94146664 A TW 94146664A TW 200704304 A TW200704304 A TW 200704304A
Authority
TW
Taiwan
Prior art keywords
holes
dry film
wiring board
printed wiring
photosensitive dry
Prior art date
Application number
TW094146664A
Other languages
English (en)
Other versions
TWI295147B (en
Inventor
Nobukazu Koizumi
Original Assignee
Maruwa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Maruwa Corp filed Critical Maruwa Corp
Publication of TW200704304A publication Critical patent/TW200704304A/zh
Application granted granted Critical
Publication of TWI295147B publication Critical patent/TWI295147B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01K—ELECTRIC INCANDESCENT LAMPS
    • H01K3/00—Apparatus or processes adapted to the manufacture, installing, removal, or maintenance of incandescent lamps or parts thereof
    • H01K3/08—Manufacture of mounts or stems
    • H01K3/10—Machines therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09736—Varying thickness of a single conductor; Conductors in the same plane having different thicknesses
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
TW094146664A 2005-05-12 2005-12-27 Printed wiring board manufacturing method TWI295147B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005139350 2005-05-12
JP2005291056A JP4520392B2 (ja) 2005-05-12 2005-10-04 プリント基板の製造方法

Publications (2)

Publication Number Publication Date
TW200704304A true TW200704304A (en) 2007-01-16
TWI295147B TWI295147B (en) 2008-03-21

Family

ID=37419528

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094146664A TWI295147B (en) 2005-05-12 2005-12-27 Printed wiring board manufacturing method

Country Status (5)

Country Link
US (1) US7434311B2 (zh)
JP (1) JP4520392B2 (zh)
KR (1) KR100661713B1 (zh)
CN (1) CN1863435A (zh)
TW (1) TWI295147B (zh)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112006003899T5 (de) 2006-05-17 2009-04-30 Shinko Electric Industries Co., Ltd. Verfahren zur Bildung eines Resistmusters, Verfahren zur Herstellung einer Leiterplatte sowie Leiterplatte
JP4224086B2 (ja) * 2006-07-06 2009-02-12 三井金属鉱業株式会社 耐折性に優れた配線基板および半導体装置
JP5023738B2 (ja) * 2007-02-28 2012-09-12 富士通株式会社 プリント配線板の製造方法
CN102209438B (zh) * 2010-10-29 2012-12-26 博罗县精汇电子科技有限公司 高密度柔性线路板及其制作方法
CN102316186B (zh) * 2011-08-19 2015-04-22 惠州Tcl移动通信有限公司 移动设备、听筒网及其制造方法
JP5850152B2 (ja) * 2012-07-02 2016-02-03 日産自動車株式会社 界磁極用磁石体を構成する磁石片の製造装置及びその製造方法
CN104349609A (zh) * 2013-08-08 2015-02-11 北大方正集团有限公司 印刷线路板及其制作方法
JP5997127B2 (ja) * 2013-11-18 2016-09-28 Ckd株式会社 半田印刷検査装置及び基板製造システム
US10051746B2 (en) * 2014-12-16 2018-08-14 Amphenol Corporation High-speed interconnects for printed circuit boards
CN105682341B (zh) * 2016-02-25 2018-09-04 广东欧珀移动通信有限公司 软硬结合板及移动终端
CN108770244B (zh) * 2018-08-06 2019-08-06 重庆科技学院 一种复合pcb板的制作方法
CN113365412B (zh) * 2020-03-05 2022-06-24 宏启胜精密电子(秦皇岛)有限公司 复合电路板及其制作方法
CN114079206B (zh) * 2020-08-13 2023-10-20 深南电路股份有限公司 一种刚挠结合板及电路连接器
CN113710011A (zh) * 2021-08-30 2021-11-26 德中（天津）技术发展股份有限公司 一种只电镀加厚并可焊性处理孔后激光制蚀刻图案的制造电路板方法
CN114710887B (zh) * 2022-04-07 2024-02-23 江门荣信电路板有限公司 一种用于改善线路顶部狗牙缺陷的方法
CN114745861A (zh) * 2022-06-09 2022-07-12 惠州市金百泽电路科技有限公司 一种印刷集成电路的制作方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56111292A (en) * 1979-01-12 1981-09-02 Kollmorgen Tech Corp Resist capable of screen printing with high resolution
US4486466A (en) * 1979-01-12 1984-12-04 Kollmorgen Technologies Corporation High resolution screen printable resists
JPH02174194A (ja) * 1988-12-26 1990-07-05 Seiko Instr Inc 回路基板の製造方法
US6210537B1 (en) * 1995-06-19 2001-04-03 Lynntech, Inc. Method of forming electronically conducting polymers on conducting and nonconducting substrates
JPH10215072A (ja) * 1997-01-30 1998-08-11 Nec Toyama Ltd 多層印刷配線板の製造方法
JPH11195849A (ja) 1997-12-26 1999-07-21 Fujikura Ltd フレキシブルプリント配線板とその製造方法
JPH11346039A (ja) * 1998-06-01 1999-12-14 Sumitomo Bakelite Co Ltd フレキシブルプリント配線板及びその製造方法
US6242078B1 (en) * 1998-07-28 2001-06-05 Isola Laminate Systems Corp. High density printed circuit substrate and method of fabrication
JP2000114412A (ja) 1998-10-06 2000-04-21 Shinko Electric Ind Co Ltd 回路基板の製造方法
JP2002009436A (ja) 2000-06-22 2002-01-11 Hitachi Ltd プリント配線板の製造方法
JP2003183876A (ja) 2001-12-19 2003-07-03 Mitsui High Tec Inc 基板の製造方法
KR100498977B1 (ko) * 2002-12-31 2005-07-01 삼성전기주식회사 Ｅ-ｂｇａ 인쇄회로기판의 공동 내벽을 도금하는 방법
JP2004291202A (ja) 2003-03-28 2004-10-21 Sony Corp データ提供装置及びデータ提供方法、ロボット装置及びロボットのモーション再生方法、並びにデータ処理装置
JP4099501B2 (ja) * 2004-10-04 2008-06-11 株式会社丸和製作所 プリント基板の製造方法

Also Published As

Publication number Publication date
JP4520392B2 (ja) 2010-08-04
KR100661713B1 (ko) 2006-12-26
US20060257793A1 (en) 2006-11-16
CN1863435A (zh) 2006-11-15
JP2006344921A (ja) 2006-12-21
KR20060117173A (ko) 2006-11-16
US7434311B2 (en) 2008-10-14
TWI295147B (en) 2008-03-21

Similar Documents

Publication Publication Date Title
TW200704304A (en) Printed wiring board manufacturing method
US9295150B2 (en) Method for manufacturing a printed circuit board
TW200636942A (en) Method of production of circuit board utilizing electroplating
JP2005183952A (ja) 導電孔を有したプリント回路ボードの製造方法及びボード
US11570904B2 (en) Method for contacting and rewiring an electronic component embedded into a printed circuit board
TW200714142A (en) Method of continuous producing flexible printed circuit board
TW200631481A (en) Printed wiring board manufacturing method
CN104837301A (zh) 具有屏蔽结构的柔性电路板及其制作方法
TW200746968A (en) Method for fabricating electrical connecting structure of circuit board
TW200721929A (en) Method for manufacturing circuit substrate
CN107197591A (zh) 一种覆盖感光性涂覆层的fpc板及其制作方法
TW200637447A (en) Printed board and manufacturing method thereof
JP2013526774A (ja) 両面フレキシブルプリント回路基板及びその製造方法
KR20120116297A (ko) 폴리이미드 잉크를 이용한 연성회로기판의 제조방법
KR20180053677A (ko) 차폐 프린트 배선판의 제조 방법
KR100704920B1 (ko) 범프기판을 이용한 인쇄회로기판 및 제조방법
JP2006502590A (ja) プリント回路基板の製造方法
KR101596098B1 (ko) 인쇄회로기판의 제조방법
TW200610461A (en) Method of manufacturing double-sided printed circuit board
TW200723971A (en) Via hole having fine hole land and method for forming the same
CN102045952B (zh) 电路板绝缘保护层的制作方法
TW200802763A (en) Method for fabricating alloy conductive bump of electrical connecting pad of circuit board
KR20070101459A (ko) 연성인쇄회로기판의 동도금방법
JP2013008945A (ja) コアレス基板の製造方法
KR20170064706A (ko) 인쇄회로기판의 제조방법 및 그에 따라서 제조된 인쇄회로기판

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees