TW200636769A - Laminated ceramic electronic component and method for manufacturing same - Google Patents

Laminated ceramic electronic component and method for manufacturing same

Info

Publication number
TW200636769A
TW200636769A TW094141890A TW94141890A TW200636769A TW 200636769 A TW200636769 A TW 200636769A TW 094141890 A TW094141890 A TW 094141890A TW 94141890 A TW94141890 A TW 94141890A TW 200636769 A TW200636769 A TW 200636769A
Authority
TW
Taiwan
Prior art keywords
lands
via hole
electronic component
ceramic electronic
laminated ceramic
Prior art date
Application number
TW094141890A
Other languages
English (en)
Other versions
TWI339848B (zh
Inventor
Mitsuru Ueda
Masaharu Ikeda
Original Assignee
Murata Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co filed Critical Murata Manufacturing Co
Publication of TW200636769A publication Critical patent/TW200636769A/zh
Application granted granted Critical
Publication of TWI339848B publication Critical patent/TWI339848B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H01F2017/002—Details of via holes for interconnecting the layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09454—Inner lands, i.e. lands around via or plated through-hole in internal layer of multilayer PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4061—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in inorganic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
TW094141890A 2004-12-20 2005-11-29 Laminated ceramic electronic component and method for manufacturing same TW200636769A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004367863 2004-12-20
PCT/JP2005/021544 WO2006067929A1 (ja) 2004-12-20 2005-11-24 積層セラミック電子部品およびその製造方法

Publications (2)

Publication Number Publication Date
TW200636769A true TW200636769A (en) 2006-10-16
TWI339848B TWI339848B (zh) 2011-04-01

Family

ID=36601534

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094141890A TW200636769A (en) 2004-12-20 2005-11-29 Laminated ceramic electronic component and method for manufacturing same

Country Status (6)

Country Link
US (1) US20090139759A1 (zh)
JP (1) JP4432973B2 (zh)
KR (1) KR100810524B1 (zh)
CN (1) CN1906715B (zh)
TW (1) TW200636769A (zh)
WO (1) WO2006067929A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI394030B (zh) * 2006-12-22 2013-04-21 Foxconn Tech Co Ltd 散熱模組及採用該散熱模組之電子裝置

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101207972B (zh) * 2006-12-22 2010-05-19 鸿富锦精密工业（深圳）有限公司 一种电路板及使用其的感光装置
JP2009212255A (ja) * 2008-03-04 2009-09-17 Tdk Corp コイル部品及びその製造方法
DE102012005831A1 (de) * 2012-03-22 2013-09-26 Giesecke & Devrient Gmbh Substrat für einen portablen Datenträger
CN103387388B (zh) * 2012-05-07 2015-08-26 深圳振华富电子有限公司 铁氧体材料、小型大电流叠层片式宽频磁珠和其制备方法
JP6030512B2 (ja) * 2013-07-09 2016-11-24 東光株式会社 積層型電子部品
DE102014112365A1 (de) * 2014-08-28 2016-03-03 Epcos Ag Verfahren zur Herstellung eines Mehrschichtsubstrats und Mehrschichtsubstrat
US10432152B2 (en) * 2015-05-22 2019-10-01 Nxp Usa, Inc. RF amplifier output circuit device with integrated current path, and methods of manufacture thereof
CN107452463B (zh) 2016-05-31 2021-04-02 太阳诱电株式会社 线圈部件
CN109103001A (zh) * 2018-10-10 2018-12-28 深圳市麦捷微电子科技股份有限公司 一种新型结构叠层片式电感器

Family Cites Families (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3812442A (en) * 1972-02-29 1974-05-21 W Muckelroy Ceramic inductor
US3781596A (en) * 1972-07-07 1973-12-25 R Galli Semiconductor chip carriers and strips thereof
US4036550A (en) * 1973-08-16 1977-07-19 Intel Corporation Liquid crystal display
JPS5328266A (en) * 1976-08-13 1978-03-16 Fujitsu Ltd Method of producing multilayer ceramic substrate
JPS57184296A (en) * 1981-05-09 1982-11-12 Hitachi Ltd Ceramic circuit board
US4591411A (en) * 1982-05-05 1986-05-27 Hughes Aircraft Company Method for forming a high density printed wiring board
GB2128406B (en) * 1982-09-08 1986-02-12 Standard Telephones Cables Ltd Electrical contact units
JPS60217621A (ja) * 1984-04-13 1985-10-31 株式会社トーキン セラミツクグリ−ンシ−トの製造方法
US4521449A (en) * 1984-05-21 1985-06-04 International Business Machines Corporation Process for forming a high density metallurgy system on a substrate and structure thereof
JPS62138860A (ja) 1985-12-11 1987-06-22 Canon Inc 現像剤薄層形成方法及びそれを用いる現像装置
JPH0514490Y2 (zh) * 1987-09-10 1993-04-19
US4991283A (en) * 1989-11-27 1991-02-12 Johnson Gary W Sensor elements in multilayer ceramic tape structures
US5060116A (en) * 1990-04-20 1991-10-22 Grobman Warren D Electronics system with direct write engineering change capability
JPH05109924A (ja) * 1991-10-17 1993-04-30 Ngk Spark Plug Co Ltd 集積回路用パツケージ
US5315485A (en) * 1992-09-29 1994-05-24 Mcnc Variable size capture pads for multilayer ceramic substrates and connectors therefor
US5342999A (en) * 1992-12-21 1994-08-30 Motorola, Inc. Apparatus for adapting semiconductor die pads and method therefor
KR0179404B1 (ko) * 1993-02-02 1999-05-15 모리시타 요이찌 세라믹기판과 그 제조방법
US5910755A (en) * 1993-03-19 1999-06-08 Fujitsu Limited Laminate circuit board with selectable connections between wiring layers
KR100231356B1 (ko) * 1994-09-12 1999-11-15 모리시타요이찌 적층형 세라믹칩 인덕터 및 그 제조방법
JP3239231B2 (ja) * 1996-04-11 2001-12-17 日本特殊陶業株式会社 パッドを備えるセラミック基板、端子部材を備えるセラミック基板およびそれらの製造方法
WO1997048658A1 (en) * 1996-06-17 1997-12-24 Toray Industries, Inc. Photosensitive ceramic green sheet, ceramic package, and process for producing the same
US6329715B1 (en) * 1996-09-20 2001-12-11 Tdk Corporation Passive electronic parts, IC parts, and wafer
US5834994A (en) * 1997-01-17 1998-11-10 Motorola Inc. Multilayer lowpass filter with improved ground plane configuration
JP3173410B2 (ja) * 1997-03-14 2001-06-04 松下電器産業株式会社 パッケージ基板およびその製造方法
US6136458A (en) * 1997-09-13 2000-10-24 Kabushiki Kaisha Toshiba Ferrite magnetic film structure having magnetic anisotropy
JP3344956B2 (ja) * 1998-01-08 2002-11-18 日本特殊陶業株式会社 積層セラミック基板の製造方法
US6175727B1 (en) * 1998-01-09 2001-01-16 Texas Instruments Israel Ltd. Suspended printed inductor and LC-type filter constructed therefrom
US6362716B1 (en) * 1998-07-06 2002-03-26 Tdk Corporation Inductor device and process of production thereof
JP2000082615A (ja) * 1998-07-06 2000-03-21 Tdk Corp インダクタ素子およびその製造方法
DE69930453T2 (de) * 1998-10-27 2006-09-28 Murata Manufacturing Co., Ltd., Nagaokakyo Zusammengestellte Hochfrequenzkomponente und damit ausgerüstetes mobiles Kommunikationsgerät
US6198374B1 (en) * 1999-04-01 2001-03-06 Midcom, Inc. Multi-layer transformer apparatus and method
TW503632B (en) * 1999-04-22 2002-09-21 Hitachi Metals Ltd Differential transmission cable and joint
JP2001064077A (ja) * 1999-08-30 2001-03-13 Murata Mfg Co Ltd セラミック電子部品の製造方法
JP2001160636A (ja) * 1999-09-20 2001-06-12 Denso Corp 圧電素子
JP2001102957A (ja) * 1999-09-28 2001-04-13 Murata Mfg Co Ltd 複合高周波部品及びそれを用いた移動体通信装置
US6586682B2 (en) * 2000-02-23 2003-07-01 Kulicke & Soffa Holdings, Inc. Printed wiring board with controlled line impedance
JP2001320168A (ja) * 2000-03-02 2001-11-16 Murata Mfg Co Ltd 配線基板およびその製造方法、ならびにそれを用いた電子装置
JP2001284811A (ja) * 2000-03-29 2001-10-12 Murata Mfg Co Ltd 積層型セラミック電子部品およびその製造方法ならびに電子装置
US6767140B2 (en) * 2000-05-09 2004-07-27 National Semiconductor Corporation Ceramic optical sub-assembly for opto-electronic module utilizing LTCC (low-temperature co-fired ceramic) technology
KR100368025B1 (ko) * 2000-09-26 2003-01-15 삼성전자 주식회사 중심 지향성 솔더 볼 랜드 타입을 갖는 회로 기판 및 이를이용한 ｂｇａ 패키지
JP2002134545A (ja) * 2000-10-26 2002-05-10 Oki Electric Ind Co Ltd 半導体集積回路チップ及び基板、並びにその製造方法
JP2002208656A (ja) * 2001-01-11 2002-07-26 Mitsubishi Electric Corp 半導体装置
JP3680758B2 (ja) * 2001-04-20 2005-08-10 株式会社村田製作所 積層セラミック電子部品の製造方法
JP2003282327A (ja) * 2002-03-27 2003-10-03 Koa Corp 積層セラミックチップ部品およびその製造方法
US7155812B1 (en) * 2002-09-05 2007-01-02 Sandia Corporation Method for producing a tube
JP2004194240A (ja) * 2002-12-13 2004-07-08 Murata Mfg Co Ltd ３分波・合波器
US6975271B2 (en) * 2003-02-26 2005-12-13 Matsushita Electric Industrial Co., Ltd. Antenna switch module, all-in-one communication module, communication apparatus and method for manufacturing antenna switch module
US7088008B2 (en) * 2003-03-20 2006-08-08 International Business Machines Corporation Electronic package with optimized circuitization pattern
DE102004016399B4 (de) * 2003-03-27 2013-06-06 Kyocera Corp. Hochfrequenzmodul und Funkvorrichtung
US20050040905A1 (en) * 2003-05-29 2005-02-24 Kyocera Corporation Temperature-compensated crystal oscillator
TW200520201A (en) * 2003-10-08 2005-06-16 Kyocera Corp High-frequency module and communication apparatus
JP4211591B2 (ja) * 2003-12-05 2009-01-21 株式会社村田製作所 積層型電子部品の製造方法および積層型電子部品
JP2005191191A (ja) * 2003-12-25 2005-07-14 Tdk Corp 積層型チップインダクタ
US20060001149A1 (en) * 2004-06-30 2006-01-05 Victor Prokofiev Packaged substrate having variable width conductors and a variably spaced reference plane

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI394030B (zh) * 2006-12-22 2013-04-21 Foxconn Tech Co Ltd 散熱模組及採用該散熱模組之電子裝置

Also Published As

Publication number Publication date
US20090139759A1 (en) 2009-06-04
KR100810524B1 (ko) 2008-03-10
TWI339848B (zh) 2011-04-01
CN1906715A (zh) 2007-01-31
JP4432973B2 (ja) 2010-03-17
WO2006067929A1 (ja) 2006-06-29
JPWO2006067929A1 (ja) 2008-06-12
CN1906715B (zh) 2010-06-16
KR20060104996A (ko) 2006-10-09

Similar Documents

Publication Publication Date Title
TW200636769A (en) Laminated ceramic electronic component and method for manufacturing same
EP2696357B1 (en) Laminated-type inductor element and method of manufacturing thereof
WO2008129704A1 (ja) 多層プリント配線板及びその製造方法
WO2006091463A3 (en) Method of making multilayered construction for use in resistors and capacitors
TW200944072A (en) Method for manufacturing a substrate having embedded component therein
TW200520644A (en) Multilayer ceramic electronic component and its manufacturing method
TW200710877A (en) Conductive paste for multilayer electronic components and multilayer electronic component using same
TW200644004A (en) Multilayer ceramic electronic device and method of production of the same
US20110193671A1 (en) Electronic component and manufacturing method of the same
WO2006114267A3 (en) Electronic component and electronic configuration
US20150206643A1 (en) Laminated-type inductance device
TW200715930A (en) Method for manufacturing a substrate embedded with an electronic component and device from the same
TW200634871A (en) Thick-film capacitors, embedding thick-film capacitors inside printed circuit boards, and methods of forming such capacitors and printed circuit boards
TW200606968A (en) Method for manufacturing multilayer electronic component
TW200504899A (en) Wiring board and the manufacturing method thereof
JP2008066672A (ja) 薄型磁気部品内蔵基板及びそれを用いたスイッチング電源モジュール
TW200420203A (en) Multilayer board and its manufacturing method
KR20090050664A (ko) 다층 세라믹 콘덴서의 제조 방법
JP2005026312A (ja) 高周波電子部品およびその実装方法
JP2011100649A (ja) 電子部品内蔵基板および電子モジュール。
KR102037268B1 (ko) 적층 세라믹 커패시터 및 그 실장 기판
JP2004031833A (ja) 電子部品
JP2005005298A (ja) 積層型チップインダクタとその製造方法
TW200707507A (en) Substrate process for embedded component
TW200723989A (en) Printed circuit board and manufacturing method thereof

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees