TW200619345A - Methods of coating semiconductor light emitting elements by evaporating solvent from a suspension - Google Patents
Methods of coating semiconductor light emitting elements by evaporating solvent from a suspensionInfo
- Publication number
- TW200619345A TW200619345A TW094122646A TW94122646A TW200619345A TW 200619345 A TW200619345 A TW 200619345A TW 094122646 A TW094122646 A TW 094122646A TW 94122646 A TW94122646 A TW 94122646A TW 200619345 A TW200619345 A TW 200619345A
- Authority
- TW
- Taiwan
- Prior art keywords
- light emitting
- semiconductor light
- suspension
- methods
- emitting elements
- Prior art date
Links
- 239000002904 solvent Substances 0.000 title abstract 4
- 239000004065 semiconductor Substances 0.000 title abstract 3
- 239000011248 coating agent Substances 0.000 title abstract 2
- 238000000576 coating method Methods 0.000 title abstract 2
- 238000001704 evaporation Methods 0.000 title abstract 2
- 239000000725 suspension Substances 0.000 title abstract 2
- 238000000034 method Methods 0.000 title 1
- 239000002245 particle Substances 0.000 abstract 5
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 abstract 4
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Luminescent Compositions (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/946,587 US7217583B2 (en) | 2004-09-21 | 2004-09-21 | Methods of coating semiconductor light emitting elements by evaporating solvent from a suspension |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200619345A true TW200619345A (en) | 2006-06-16 |
TWI411659B TWI411659B (zh) | 2013-10-11 |
Family
ID=36074560
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW101130701A TWI452112B (zh) | 2004-09-21 | 2005-07-05 | 從懸浮液中蒸發溶劑而塗層半導體發光元件之方法 |
TW094122646A TWI411659B (zh) | 2004-09-21 | 2005-07-05 | 從懸浮液中蒸發溶劑而塗層半導體發光元件之方法 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW101130701A TWI452112B (zh) | 2004-09-21 | 2005-07-05 | 從懸浮液中蒸發溶劑而塗層半導體發光元件之方法 |
Country Status (7)
Country | Link |
---|---|
US (2) | US7217583B2 (zh) |
EP (2) | EP2306526A3 (zh) |
JP (1) | JP2008514026A (zh) |
KR (1) | KR20070054725A (zh) |
CN (3) | CN101023534A (zh) |
TW (2) | TWI452112B (zh) |
WO (1) | WO2006033695A2 (zh) |
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-
2004
- 2004-09-21 US US10/946,587 patent/US7217583B2/en active Active
-
2005
- 2005-06-30 CN CNA2005800313823A patent/CN101023534A/zh active Pending
- 2005-06-30 EP EP10012027A patent/EP2306526A3/en not_active Ceased
- 2005-06-30 WO PCT/US2005/023753 patent/WO2006033695A2/en active Application Filing
- 2005-06-30 EP EP05808825.3A patent/EP1797597B1/en active Active
- 2005-06-30 CN CN2010102790162A patent/CN101976721A/zh active Pending
- 2005-06-30 KR KR1020077008694A patent/KR20070054725A/ko active Search and Examination
- 2005-06-30 JP JP2007533459A patent/JP2008514026A/ja active Pending
- 2005-06-30 CN CN2011100293653A patent/CN102157635A/zh active Pending
- 2005-07-05 TW TW101130701A patent/TWI452112B/zh active
- 2005-07-05 TW TW094122646A patent/TWI411659B/zh active
-
2007
- 2007-05-01 US US11/799,702 patent/US7569407B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
CN102157635A (zh) | 2011-08-17 |
EP1797597B1 (en) | 2016-11-16 |
TW201249955A (en) | 2012-12-16 |
KR20070054725A (ko) | 2007-05-29 |
US20070224716A1 (en) | 2007-09-27 |
US7569407B2 (en) | 2009-08-04 |
TWI452112B (zh) | 2014-09-11 |
TWI411659B (zh) | 2013-10-11 |
US7217583B2 (en) | 2007-05-15 |
WO2006033695A3 (en) | 2006-06-08 |
US20060063289A1 (en) | 2006-03-23 |
CN101976721A (zh) | 2011-02-16 |
EP2306526A2 (en) | 2011-04-06 |
JP2008514026A (ja) | 2008-05-01 |
EP2306526A3 (en) | 2012-05-02 |
WO2006033695A2 (en) | 2006-03-30 |
CN101023534A (zh) | 2007-08-22 |
EP1797597A2 (en) | 2007-06-20 |
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