WO2007033188A3 - Substrate-enhanced electroless deposition (seed) of metal nanoparticles on carbon nanotubes - Google Patents

Substrate-enhanced electroless deposition (seed) of metal nanoparticles on carbon nanotubes Download PDF

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Publication number
WO2007033188A3
WO2007033188A3 PCT/US2006/035511 US2006035511W WO2007033188A3 WO 2007033188 A3 WO2007033188 A3 WO 2007033188A3 US 2006035511 W US2006035511 W US 2006035511W WO 2007033188 A3 WO2007033188 A3 WO 2007033188A3
Authority
WO
WIPO (PCT)
Prior art keywords
carbon nanotubes
substrate
metal
metal nanoparticles
electroless deposition
Prior art date
Application number
PCT/US2006/035511
Other languages
French (fr)
Other versions
WO2007033188A2 (en
Inventor
Liming Dai
Liangti Qu
Original Assignee
Univ Dayton
Liming Dai
Liangti Qu
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/522,545 external-priority patent/US7538062B1/en
Application filed by Univ Dayton, Liming Dai, Liangti Qu filed Critical Univ Dayton
Publication of WO2007033188A2 publication Critical patent/WO2007033188A2/en
Publication of WO2007033188A3 publication Critical patent/WO2007033188A3/en

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1635—Composition of the substrate
    • C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
    • C23C18/1641—Organic substrates, e.g. resin, plastic
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/54—Contact plating, i.e. electroless electrochemical plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Carbon And Carbon Compounds (AREA)
  • Catalysts (AREA)

Abstract

An electroless deposition method of depositing metal nanoparticles onto conductive substrates such as carbon nanotubes is provided. The carbon nanotubes are provided on a support comprising a metal substrate and then immersed in an aqueous solution containing metal ions. The metal substrate metal has a redox potential which is lower than that of the metal ions in solution such that the metal ions are readily reduced into metal nanoparticles on the carbon nanotubes.
PCT/US2006/035511 2005-09-12 2006-09-12 Substrate-enhanced electroless deposition (seed) of metal nanoparticles on carbon nanotubes WO2007033188A2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US71646405P 2005-09-12 2005-09-12
US60/716,464 2005-09-12
US11/522,545 US7538062B1 (en) 2005-09-12 2006-09-11 Substrate-enhanced electroless deposition (SEED) of metal nanoparticles on carbon nanotubes
US11/522,545 2006-09-11

Publications (2)

Publication Number Publication Date
WO2007033188A2 WO2007033188A2 (en) 2007-03-22
WO2007033188A3 true WO2007033188A3 (en) 2008-08-14

Family

ID=37564162

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2006/035511 WO2007033188A2 (en) 2005-09-12 2006-09-12 Substrate-enhanced electroless deposition (seed) of metal nanoparticles on carbon nanotubes

Country Status (1)

Country Link
WO (1) WO2007033188A2 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8354855B2 (en) 2006-10-16 2013-01-15 Formfactor, Inc. Carbon nanotube columns and methods of making and using carbon nanotube columns as probes
US8130007B2 (en) 2006-10-16 2012-03-06 Formfactor, Inc. Probe card assembly with carbon nanotube probes having a spring mechanism therein
US8149007B2 (en) 2007-10-13 2012-04-03 Formfactor, Inc. Carbon nanotube spring contact structures with mechanical and electrical components
US8272124B2 (en) 2009-04-03 2012-09-25 Formfactor, Inc. Anchoring carbon nanotube columns
WO2011014929A1 (en) * 2009-08-07 2011-02-10 Commonwealth Scientific And Industrial Research Organisation Deposition of metals
US8872176B2 (en) 2010-10-06 2014-10-28 Formfactor, Inc. Elastic encapsulated carbon nanotube based electrical contacts
RU2475445C2 (en) * 2010-12-20 2013-02-20 Государственное образовательное учреждение высшего профессионального образования "Тамбовский государственный университет имени Г.Р. Державина" Method for obtaining volume nanostructured material
US20130025907A1 (en) * 2011-07-26 2013-01-31 Tyco Electronics Corporation Carbon-based substrate conductor
FR3078898B1 (en) * 2018-03-16 2023-10-13 Nexans METHOD FOR MANUFACTURING A CARBON-METAL COMPOSITE MATERIAL AND ITS USE TO MANUFACTURE AN ELECTRIC CABLE

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004007798A1 (en) * 2002-07-17 2004-01-22 Atotech Deutschland Gmbh Immersion plating of silver
US20050148174A1 (en) * 2002-05-06 2005-07-07 Infineon Technologies Ag Contact-connection of nanotubes

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050148174A1 (en) * 2002-05-06 2005-07-07 Infineon Technologies Ag Contact-connection of nanotubes
WO2004007798A1 (en) * 2002-07-17 2004-01-22 Atotech Deutschland Gmbh Immersion plating of silver

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
YI FENG, HAILONG YUAN: "Electroless plating of carbon nanotubes with silver", JOURNAL OF MATERIAL SCIENCE, vol. 39, 2004, pages 3241 - 3243, XP002482374 *

Also Published As

Publication number Publication date
WO2007033188A2 (en) 2007-03-22

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