TW200618919A - Laser processing method - Google Patents

Laser processing method

Info

Publication number
TW200618919A
TW200618919A TW094126980A TW94126980A TW200618919A TW 200618919 A TW200618919 A TW 200618919A TW 094126980 A TW094126980 A TW 094126980A TW 94126980 A TW94126980 A TW 94126980A TW 200618919 A TW200618919 A TW 200618919A
Authority
TW
Taiwan
Prior art keywords
along
processing method
laser processing
dividing lines
focusing spot
Prior art date
Application number
TW094126980A
Other languages
English (en)
Inventor
Ryugo Oba
Kenji Furuta
Hitoshi Hoshino
Nobuyasu Kitahara
Noboru Takeda
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of TW200618919A publication Critical patent/TW200618919A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0736—Shaping the laser spot into an oval shape, e.g. elliptic shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Laser Beam Processing (AREA)
TW094126980A 2004-08-11 2005-08-09 Laser processing method TW200618919A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004234178A JP4440036B2 (ja) 2004-08-11 2004-08-11 レーザー加工方法

Publications (1)

Publication Number Publication Date
TW200618919A true TW200618919A (en) 2006-06-16

Family

ID=35721743

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094126980A TW200618919A (en) 2004-08-11 2005-08-09 Laser processing method

Country Status (5)

Country Link
US (1) US20060035411A1 (zh)
JP (1) JP4440036B2 (zh)
CN (1) CN1733415A (zh)
DE (1) DE102005037412A1 (zh)
TW (1) TW200618919A (zh)

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* Cited by examiner, † Cited by third party
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TWI511887B (zh) * 2007-10-31 2015-12-11 Jds Uniphase Corp 於顏料薄片四周提供邊框或邊界以供隱蔽安全應用之用

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JP4694795B2 (ja) * 2004-05-18 2011-06-08 株式会社ディスコ ウエーハの分割方法
JP4938339B2 (ja) * 2006-04-04 2012-05-23 株式会社ディスコ レーザー加工装置
JP2007275962A (ja) 2006-04-10 2007-10-25 Disco Abrasive Syst Ltd レーザー加工装置
US8624157B2 (en) * 2006-05-25 2014-01-07 Electro Scientific Industries, Inc. Ultrashort laser pulse wafer scribing
US20070282312A1 (en) * 2006-05-31 2007-12-06 Sie Ag Surgical Instrument Engineering Ophthalmologic apparatus
JP4777830B2 (ja) * 2006-06-06 2011-09-21 株式会社ディスコ ウエーハの分割方法
JP5007090B2 (ja) 2006-09-11 2012-08-22 株式会社ディスコ レーザー加工方法
JP2008068270A (ja) * 2006-09-12 2008-03-27 Disco Abrasive Syst Ltd レーザー加工装置
CN101522362B (zh) 2006-10-04 2012-11-14 浜松光子学株式会社 激光加工方法
JP5117806B2 (ja) * 2006-10-04 2013-01-16 浜松ホトニクス株式会社 レーザ加工方法及びレーザ加工装置
JP4977432B2 (ja) * 2006-10-17 2012-07-18 株式会社ディスコ ヒ化ガリウムウエーハのレーザー加工方法
JP2008105064A (ja) * 2006-10-26 2008-05-08 Disco Abrasive Syst Ltd レーザー加工装置
JP2008254035A (ja) 2007-04-05 2008-10-23 Disco Abrasive Syst Ltd レーザー加工装置
JP5328209B2 (ja) * 2007-06-15 2013-10-30 三菱電機株式会社 基板加工方法
JP2009212458A (ja) * 2008-03-06 2009-09-17 Sumitomo Electric Ind Ltd 半導体装置、電子機器およびそれらの製造方法
JP2010087433A (ja) * 2008-10-02 2010-04-15 Disco Abrasive Syst Ltd レーザ加工方法、レーザ加工装置およびチップの製造方法
JP5234648B2 (ja) * 2009-04-01 2013-07-10 株式会社日立ハイテクノロジーズ レーザ加工方法、レーザ加工装置及びソーラパネル製造方法
CN102049611B (zh) * 2009-10-30 2013-11-06 技鼎股份有限公司 应用于脆性材料的镭射加工装置及镭射加工和位移补偿的方法
JP2012059775A (ja) * 2010-09-06 2012-03-22 Mitsubishi Electric Corp 光起電力装置の製造方法
US8742288B2 (en) * 2011-06-15 2014-06-03 Asm Technology Singapore Pte Ltd Laser apparatus for singulation, and a method of singulation
JP5908705B2 (ja) 2011-11-30 2016-04-26 株式会社ディスコ レーザー加工装置
JP5861494B2 (ja) * 2012-02-23 2016-02-16 三菱マテリアル株式会社 レーザ加工装置およびレーザ加工方法
WO2014113508A2 (en) 2013-01-15 2014-07-24 Microfabrica Inc. Methods of forming parts using laser machining
CN103495803B (zh) * 2013-10-16 2015-09-09 大族激光科技产业集团股份有限公司 一种实现椭圆形焊点的激光焊接方法
DE102014109791A1 (de) * 2014-07-11 2016-01-14 Schott Ag Verfahren zur Laserablation
DE102014213775B4 (de) * 2014-07-15 2018-02-15 Innolas Solutions Gmbh Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen, kristallinen Substraten, insbesondere von Halbleitersubstraten
KR101817388B1 (ko) 2014-09-30 2018-01-10 주식회사 엘지화학 편광판의 절단 방법 및 이를 이용하여 절단된 편광판
JP6494991B2 (ja) * 2014-12-10 2019-04-03 株式会社ディスコ ウエーハの加工方法
JP6407056B2 (ja) * 2015-02-20 2018-10-17 株式会社ディスコ 分割装置と分割方法
US10675715B2 (en) 2015-06-23 2020-06-09 Mitsubishi Electric Corporation Semiconductor element manufacturing method and manufacturing device
JP6632467B2 (ja) 2016-05-18 2020-01-22 株式会社ディスコ レーザー加工装置及びレーザー加工方法
CN106271105B (zh) * 2016-08-31 2018-05-25 武汉凌云光电科技有限责任公司 一种可实现光纤端面角度控制的激光切割方法及系统
JP2018036567A (ja) * 2016-09-01 2018-03-08 株式会社ディスコ ウエーハ加工用フォトマスクの製造方法
JP6524558B2 (ja) * 2016-12-15 2019-06-05 パナソニックＩｐマネジメント株式会社 素子チップの製造方法
JP7043129B2 (ja) * 2018-02-14 2022-03-29 株式会社ディスコ ウェーハの加工方法
JP7142236B2 (ja) 2018-03-28 2022-09-27 パナソニックＩｐマネジメント株式会社 素子チップの製造方法
JP2022167452A (ja) 2021-04-23 2022-11-04 株式会社ディスコ レーザー加工装置の調整方法、及びレーザー加工装置
JP2022181658A (ja) 2021-05-26 2022-12-08 株式会社ディスコ レーザー加工装置

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US6586702B2 (en) * 1997-09-25 2003-07-01 Laser Electro Optic Application Technology Company High density pixel array and laser micro-milling method for fabricating array
US6676878B2 (en) * 2001-01-31 2004-01-13 Electro Scientific Industries, Inc. Laser segmented cutting
KR100673073B1 (ko) * 2000-10-21 2007-01-22 삼성전자주식회사 레이저 빔을 이용한 비금속 기판의 절단 방법 및 장치
ATE427181T1 (de) * 2000-10-25 2009-04-15 Iruvis Ltd Verfahren zum laserschneiden von optischen fasern oder wellenleitern
US6706998B2 (en) * 2002-01-11 2004-03-16 Electro Scientific Industries, Inc. Simulated laser spot enlargement
KR100786179B1 (ko) * 2002-02-02 2007-12-18 삼성전자주식회사 비금속 기판 절단 방법 및 장치
AU2003220835A1 (en) * 2002-03-12 2003-09-22 Mitsuboshi Diamond Industrial Co., Ltd. Method and system for machining fragile material
SG129265A1 (en) * 2002-11-29 2007-02-26 Semiconductor Energy Lab Laser irradiation apparatus, laser irradiation method, and method for manufacturing a semiconductor device
US7056810B2 (en) * 2002-12-18 2006-06-06 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor apparatus, and semiconductor apparatus and electric appliance
KR100497820B1 (ko) * 2003-01-06 2005-07-01 로체 시스템즈(주) 유리판절단장치
JP2005101413A (ja) * 2003-09-26 2005-04-14 Disco Abrasive Syst Ltd 薄板状被加工物の分割方法及び装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI511887B (zh) * 2007-10-31 2015-12-11 Jds Uniphase Corp 於顏料薄片四周提供邊框或邊界以供隱蔽安全應用之用

Also Published As

Publication number Publication date
JP2006051517A (ja) 2006-02-23
DE102005037412A1 (de) 2006-02-23
CN1733415A (zh) 2006-02-15
JP4440036B2 (ja) 2010-03-24
US20060035411A1 (en) 2006-02-16

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