TW200738387A - Laser machining method - Google Patents

Laser machining method

Info

Publication number
TW200738387A
TW200738387A TW096103987A TW96103987A TW200738387A TW 200738387 A TW200738387 A TW 200738387A TW 096103987 A TW096103987 A TW 096103987A TW 96103987 A TW96103987 A TW 96103987A TW 200738387 A TW200738387 A TW 200738387A
Authority
TW
Taiwan
Prior art keywords
hole
track
center portion
laser machining
machining method
Prior art date
Application number
TW096103987A
Other languages
Chinese (zh)
Inventor
Daisuke Kitamura
Souichi Toyama
Yaichi Okubo
Hiroyuki Sugawara
Haruaki Otsuki
Original Assignee
Hitachi Via Mechanics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Via Mechanics Ltd filed Critical Hitachi Via Mechanics Ltd
Publication of TW200738387A publication Critical patent/TW200738387A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10—Scanning systems
    • G02B26/105—Scanning systems with one or more pivoting mirrors or galvano-mirrors
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Manufacturing & Machinery (AREA)
  • Automation & Control Theory (AREA)
  • Laser Beam Processing (AREA)

Abstract

The invention provides a method of processing a hole using laser by moving a laser beam whose diameter is smaller than the diameter of the processed hole, on a spiral track (K1, K2, K3) connecting a center portion (0) of the hole with an outer edge thereof, the track is set at a mutually-rotated position separately about the center portion in order to perforate the hole with desirable depth, when moving the laser beam repeatedly. Damage to the bottom surface of the hole is minimized by deciding the track at the mutually-rotated position about the center portion of the hole, when adopting a concentric track.
TW096103987A 2006-03-31 2007-02-05 Laser machining method TW200738387A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006098649A JP2007268576A (en) 2006-03-31 2006-03-31 Laser beam machining method

Publications (1)

Publication Number Publication Date
TW200738387A true TW200738387A (en) 2007-10-16

Family

ID=38671913

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096103987A TW200738387A (en) 2006-03-31 2007-02-05 Laser machining method

Country Status (4)

Country Link
JP (1) JP2007268576A (en)
KR (1) KR20070098466A (en)
CN (1) CN101045271A (en)
TW (1) TW200738387A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102489884A (en) * 2011-12-02 2012-06-13 深圳光韵达光电科技股份有限公司 Method for cutting round hole or elliptical hole by utilizing laser

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009252892A (en) * 2008-04-03 2009-10-29 Mitsubishi Electric Corp Laser machining method, method for manufacturing printed board, and laser machining apparatus
KR101179983B1 (en) * 2009-02-23 2012-09-07 한미반도체 주식회사 Method for Generating Laser Beam Radiation Trajectories for Processing Semiconductor Packages
KR20120086688A (en) * 2009-10-13 2012-08-03 미쓰비시 마테리알 가부시키가이샤 Method for forming ventilation holes in an electrode plate
CN101829850A (en) * 2010-04-01 2010-09-15 深圳市大族激光科技股份有限公司 Method for processing blind hole
US9289858B2 (en) * 2011-12-20 2016-03-22 Electro Scientific Industries, Inc. Drilling holes with minimal taper in cured silicone
CN103212857B (en) * 2012-01-19 2015-09-30 昆山思拓机器有限公司 A kind of FPC method for processing blind hole
CN104411447B (en) * 2012-06-27 2016-03-30 三菱电机株式会社 Laser processing
DE102012111771B4 (en) * 2012-12-04 2020-12-03 Ewag Ag Method for machining a workpiece using a laser machining device for manufacturing a cutting tool
CN104703398B (en) * 2015-03-27 2018-01-09 大族激光科技产业集团股份有限公司 A kind of optimization method of the screw processing track of FPC blind holes
JP6203297B2 (en) * 2016-01-12 2017-09-27 株式会社エイチワン Laser lap welding method
JP6769146B2 (en) 2016-07-13 2020-10-14 オムロン株式会社 Laser processing method and laser processing equipment
CN108971775B (en) * 2017-06-02 2021-05-18 大族激光科技产业集团股份有限公司 Laser drilling method and device for metal
CN108188585B (en) * 2017-12-25 2020-04-17 大族激光科技产业集团股份有限公司 Method for processing CD (compact disc) grains on ceramic
CN108406141B (en) * 2018-04-18 2024-05-03 西安中科微精光子科技股份有限公司 Ultrafast laser micropore processing method and device based on optical coherence tomography
CN111151898A (en) * 2020-01-07 2020-05-15 深圳市吉祥云科技有限公司 Spiral-direction-rising amplitude-coiling punching method and punching system
CN113441852B (en) * 2021-06-24 2022-07-19 中国科学院西安光学精密机械研究所 Laser spiral scanning blind hole manufacturing method

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10207288B4 (en) * 2002-02-21 2005-05-04 Newson Engineering Nv Method for drilling holes by means of a laser beam in a substrate, in particular in an electrical circuit substrate
US7259354B2 (en) * 2004-08-04 2007-08-21 Electro Scientific Industries, Inc. Methods for processing holes by moving precisely timed laser pulses in circular and spiral trajectories
JP4614844B2 (en) * 2005-08-05 2011-01-19 住友重機械工業株式会社 Laser processing method and laser processing apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102489884A (en) * 2011-12-02 2012-06-13 深圳光韵达光电科技股份有限公司 Method for cutting round hole or elliptical hole by utilizing laser

Also Published As

Publication number Publication date
CN101045271A (en) 2007-10-03
KR20070098466A (en) 2007-10-05
JP2007268576A (en) 2007-10-18

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