CN101045271A - Laser processing method - Google Patents
Laser processing method Download PDFInfo
- Publication number
- CN101045271A CN101045271A CNA2007100043384A CN200710004338A CN101045271A CN 101045271 A CN101045271 A CN 101045271A CN A2007100043384 A CNA2007100043384 A CN A2007100043384A CN 200710004338 A CN200710004338 A CN 200710004338A CN 101045271 A CN101045271 A CN 101045271A
- Authority
- CN
- China
- Prior art keywords
- hole
- center
- track
- laser
- laser beam
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/10—Scanning systems
- G02B26/105—Scanning systems with one or more pivoting mirrors or galvano-mirrors
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- Manufacturing & Machinery (AREA)
- Automation & Control Theory (AREA)
- Laser Beam Processing (AREA)
Abstract
The present invention provides a method of manufacturing laser with good quality and high efficiency. When process the hole with laser whose diameter is smaller than the hole under processed, for instance, irradiate a certain place with laser for three times to get the depth of the hole, move the light axis of the laser along the spiral orbit (K1, K2, K3) which connects the center of the hole (O) and the one which staggered 120 degree from the center (O). At this case, it can prevent the occurrence of the rut-shaped machining spoor which appears with high frequency at the base of the hole and the machining spur at the starting point, and we can obtain a machining part with a smoother bottom face.
Description
Technical field
The present invention relates to laser processing, be used for hole with the laser beam processing diameter also bigger than the diameter of laser beam.
Background technology
In recent years, more and more higher to the requirement of the miniaturisation high-performanceization of electronic equipment, and also the packing density that is installed on the printed circuit distributing board of device interior is also increasing rapidly.Require the perforate thin spaceization of printed circuit distributing board, the pathization of machining hole therewith together.
Though its energy that penetrates each time of UV laser instrument is lower than CO
2Laser instrument, the aperture that can process are to the maximum about 50 μ m, but use CO based on processing
2But the hole of the path that laser instrument is difficult to realize, the processing that can carry out copper, machined surface fine finishining, can realize the reason of the starting of oscillation etc. of high frequency, its ratio shared in Laser Processing is at rapid growth.
When using the hole of the UV laser instrument processing diameter also bigger, adopt the processing method of the processing that is referred to as to bore a hole than the diameter of laser beam.
Fig. 5 is to schematically illustrate the figure of existing perforation processing, (a) to be the vertical view that adds the Ministry of worker, (b) is the cross-sectional perspective view that adds the Ministry of worker.For example, by diameter is the laser beam processing diameter of d when being the hole of D (D ≈ 4d), and shown in figure (a), the center that makes laser beam is the center O in hole, and be positioned at after circuit orbit k1 that diameter is 1.6d, circuit orbit k2 that diameter is roughly 3.6d go up illuminating laser beam successively.In addition, residual in order to prevent to produce processing, with the overlapped mode locating laser axle of irradiated site.In addition, the processing starting point of circuit orbit k1, k2 (below be referred to as " starting point ") is S1, S2.
Also have, known have on the printed circuit board that constitutes by the material that has positive linear expansion coefficient under the normal temperature, carry out perforate and add man-hour, in outer Monday of side along the circumferential direction in the position of slewed laser beam, towards the technology of interior side order perforate Monday of machining area (referring to patent documentation 1: the spy opens the 2004-216385 communique) from machining area.
For example, carry out from the copper foil layer on surface connect lower floor copper foil layer the hole add man-hour, only illuminating laser beam once just simultaneously the copper foil layer of finished surface and be clipped in the copper foil layer on surface and the copper foil layer of lower floor between insulating barrier difficulty relatively.So, till the degree of depth in hole reaches desired value, make laser beam the number of times of rotation appointment on the same track (below be referred to as " number of repetition ").
Also have, because processing capacity increases on starting point, therefore, working depth is more shallow usually.So it is residual to prevent to produce processing during for mobile laser beam on circuit orbit, make processing terminating point (below be referred to as " the terminal point ") situation consistent in the majority with starting point.But if make terminal point consistent with starting point, then such shown in Fig. 5 (b), the working depth of starting point (terminal point) becomes also darker than other parts, brings damage 321 sometimes.Also have,, therefore, appear at the trajectory of the laser beam trace 322 that concentric circles appears in rut shape ground on the bottom surface in hole sometimes, the uneven situation in bottom surface because the energy intensity on the direction vertical with the optical axis of laser beam is bigger near the center.
In addition, in patent documentation 1, do not record any content for the smooth this point of the shape of the bottom surface that makes the hole.
Summary of the invention
Therefore, the present invention's problem that should solve is to provide a kind of crudy and the good laser processing of working (machining) efficiency.
In order to solve described problem, first scheme is, move on the spiral helicine track of center that connects described hole and outer rim by the laser beam that makes the diameter also littler than the diameter in hole to be processed, process described hole, it is characterized in that, for the degree of depth that makes described hole be desired value and when repeatedly repeating described laser beam mobile, being set in each described track with described central point is on the position of having rotated mutually, center.
Also have, alternative plan is, be to move on the track of concentric circles at center by the laser beam that makes the diameter also littler at center with described hole than the diameter in hole to be processed, process described hole, it is characterized in that, be on center the mutual position of having rotated with the starting point of described each track the center with described hole of being set in.
Because when adopting the track of spiral helicine track and employing concentric circles, be center and on the position of having rotated mutually, therefore, can reduce the damage of the bottom surface on the starting point with the starting point on the track separately the center with the hole that processed of being set in.Also have, when adopting spiral helicine track, when the bottom surface that can make the hole is more smooth than prior art, can also improve working (machining) efficiency.
Description of drawings
Fig. 1 relates to the block diagram of the laser machine of embodiments of the present invention.
Fig. 2 relates to the allocation plan of the track of embodiments of the present invention.
Fig. 3 relates to the allocation plan of the track of embodiments of the present invention.
Fig. 4 relates to the allocation plan of the track of embodiments of the present invention.
Fig. 5 is to schematically illustrate the figure of existing perforation processing.
Among the figure:
The center in O-hole, K1-spiral helicine track, K2-spiral helicine track, K3-spiral helicine track
The specific embodiment
With reference to the accompanying drawings embodiments of the invention are described.
Fig. 1 relates to the block diagram of the laser machine of embodiments of the present invention, and (a) expression is whole, (b) expression Electronic Speculum (ガ Le バ ノ ミ ラ one) control device.In the figure, upper level numerical control device 142 is controlled Electronic Speculum control device 110, laser oscillator 120, XY worktable 131 etc. according to the process data from input unit 141 inputs.Electronic Speculum control device 110 control electromagnetic scanning instrument 161,162, that promptly locate speculum 161m, 162m realizes with the digital control firmware that uses microprocessor 111, and carries out and handle computing in discrete moment of each certain sampling period (below be referred to as " constantly discrete ").The inner sensor that the rotational angle of detection of reflected mirror 161m, 162m is housed in electromagnetic scanning instrument (ガ Le バ ノ ス キ ヤ Na) 161,162.
Electronic Speculum control device 110 is according to instruction 143 of exporting from upper level numerical control device 142 and the rotational angle detection signal 126,128 of speculum 161m, 162m, carry out the servo compensation computing by microprocessor 111, operational ton is outputed on the DA converter 112,113.The output of DA converter 112,113 is amplified by amplifier 115,116, and supplies on the electromagnetic scanning instrument 161,162, then speculum 161m, 162m is positioned on the desired angle.
Below, the control that perforation is added man-hour describes.
Add man-hour boring a hole, from upper level numerical control device 142 to the Electronic Speculum control device 110 transmission information relevant (condition that the spacing along the circumferential direction of the laser beam of irradiation, radial spacing, the time interval and other and formation track are correlated with) with perforation processing.Electronic Speculum control device 110 is according to the information of being imported, the concentric circles of each sampling period Ts of following making or spiral helicine trackwork platform, and be created on the RAM114.
That is, make the track of a concentric circles (or helical form) according to the processing conditions of appointment.Secondly, (θ=360/N), and the track of making is rotated by the θ angle coordinate at every turn, the center with the hole of processing of generating is stagger mutually N the track of angle θ of center to ask displacement angle θ according to number of repetition N.
Below, specifically describe the configuration of track.
Fig. 2 is to be track example under the occasion in track L1, L2, the L3 irradiation of the concentric circles at the center hole that processes the desired degree of depth for 3 times by the center O with the hole, track L1, L2, L3, its direction that moves laterally from the track of inboard is center 120 degree that stagger each other with the center O in hole.Therefore, for example compare, can reduce the starting point S1 of Fig. 5 (a), the damage at the bottom of the hole on the S2 with the situation that makes track L1 move 3 times.
Also have, for example respectively when 3 (totally 12 times) reirradiation copper foil layers, insulating barrier and fine finishining layer, as shown in Figure 3, be made as 30 degree with displacement angle θ and the starting point of copper foil layer (C1, C2, C3), insulating barrier (interior 1, interior 2, interior 3), fine finishining layer (smart 1, smart 2, smart 3) is staggered respectively and 120 be advisable.
Fig. 4 is to be track example under the occasion in the spiral helicine track irradiation of the starting point hole that processes the desired degree of depth for 3 times by the center O with the hole, and track K1, K2, K3 are center 120 degree that stagger each other with the center O in hole.
In addition, when the spiral helicine track that laser beam is staggered along angle moves, compare, the cutter trade of light beam front end is reduced with the occasion of the track of concentric circles.
Also have, for example in Fig. 5 (a), owing to make laser beam when circuit orbit k1 moves on the circuit orbit k2, though till the optical axis of laser beam is positioned on the starting point S2, be necessary to stop illuminating laser beam, but can the Continuous irradiation laser beam when adopting spiral helicine track, therefore, compare, more can improve working (machining) efficiency with the occasion of the track that adopts concentric circles.
Claims (2)
1. a laser processing moves on the spiral helicine track of center that connects described hole and outer rim by the laser beam that makes the diameter also littler than the diameter in hole to be processed, processes described hole, it is characterized in that,
For the degree of depth that makes described hole be desired value and when repeatedly repeating described laser beam mobile, being set in each described track with described central point is on the position of having rotated mutually, center.
2. laser processing is to move on the track of concentric circles at center at the center with described hole by the laser beam that makes the diameter also littler than the diameter in hole to be processed, processes described hole, it is characterized in that,
With the starting point of described each track the center with described hole of being set in is on center the mutual position of having rotated.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006098649 | 2006-03-31 | ||
| JP2006098649A JP2007268576A (en) | 2006-03-31 | 2006-03-31 | Laser beam machining method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101045271A true CN101045271A (en) | 2007-10-03 |
Family
ID=38671913
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007100043384A Pending CN101045271A (en) | 2006-03-31 | 2007-01-23 | Laser processing method |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2007268576A (en) |
| KR (1) | KR20070098466A (en) |
| CN (1) | CN101045271A (en) |
| TW (1) | TW200738387A (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI477341B (en) * | 2009-02-23 | 2015-03-21 | Hanmi Semiconductor Co Ltd | Semiconductor packages and method for manufacturing the same |
| CN104703398A (en) * | 2015-03-27 | 2015-06-10 | 大族激光科技产业集团股份有限公司 | Optimizing method of spiral processing track of FPC (Flexible Printed Circuit) blind hole |
| TWI492808B (en) * | 2009-10-13 | 2015-07-21 | Mitsubishi Materials Corp | Method for forming gas venting holes in electrode plate |
| CN107427962A (en) * | 2016-01-12 | 2017-12-01 | 株式会社英知 | Laser stitch welding method |
| CN108188585A (en) * | 2017-12-25 | 2018-06-22 | 大族激光科技产业集团股份有限公司 | A kind of method that CD lines are processed on ceramics |
| CN108406141A (en) * | 2018-04-18 | 2018-08-17 | 中国科学院西安光学精密机械研究所 | Ultrafast laser micropore processing method and device based on optical coherence tomography |
| CN108971775A (en) * | 2017-06-02 | 2018-12-11 | 大族激光科技产业集团股份有限公司 | A kind of laser boring method and equipment for metal |
| CN110102911A (en) * | 2012-12-04 | 2019-08-09 | 埃瓦格股份公司 | For the method and laser process equipment using laser process equipment workpieces processing |
| CN111421253A (en) * | 2020-01-07 | 2020-07-17 | 深圳市吉祥云科技有限公司 | Spiral-direction-rising amplitude-coiling punching method and punching system |
| CN113441852A (en) * | 2021-06-24 | 2021-09-28 | 中国科学院西安光学精密机械研究所 | Laser spiral scanning blind hole manufacturing method |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009252892A (en) * | 2008-04-03 | 2009-10-29 | Mitsubishi Electric Corp | Laser machining method, method for manufacturing printed board, and laser machining apparatus |
| CN101829850A (en) * | 2010-04-01 | 2010-09-15 | 深圳市大族激光科技股份有限公司 | Method for processing blind hole |
| CN102489884A (en) * | 2011-12-02 | 2012-06-13 | 深圳光韵达光电科技股份有限公司 | Method for cutting round hole or elliptical hole by utilizing laser |
| US9289858B2 (en) * | 2011-12-20 | 2016-03-22 | Electro Scientific Industries, Inc. | Drilling holes with minimal taper in cured silicone |
| CN103212857B (en) * | 2012-01-19 | 2015-09-30 | 昆山思拓机器有限公司 | A kind of FPC method for processing blind hole |
| WO2014002620A1 (en) * | 2012-06-27 | 2014-01-03 | 三菱電機株式会社 | Laser machining method |
| JP6769146B2 (en) | 2016-07-13 | 2020-10-14 | オムロン株式会社 | Laser processing method and laser processing equipment |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10207288B4 (en) * | 2002-02-21 | 2005-05-04 | Newson Engineering Nv | Method for drilling holes by means of a laser beam in a substrate, in particular in an electrical circuit substrate |
| US7259354B2 (en) * | 2004-08-04 | 2007-08-21 | Electro Scientific Industries, Inc. | Methods for processing holes by moving precisely timed laser pulses in circular and spiral trajectories |
| JP4614844B2 (en) * | 2005-08-05 | 2011-01-19 | 住友重機械工業株式会社 | Laser processing method and laser processing apparatus |
-
2006
- 2006-03-31 JP JP2006098649A patent/JP2007268576A/en active Pending
-
2007
- 2007-01-23 CN CNA2007100043384A patent/CN101045271A/en active Pending
- 2007-01-24 KR KR1020070007542A patent/KR20070098466A/en not_active Application Discontinuation
- 2007-02-05 TW TW096103987A patent/TW200738387A/en unknown
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI477341B (en) * | 2009-02-23 | 2015-03-21 | Hanmi Semiconductor Co Ltd | Semiconductor packages and method for manufacturing the same |
| TWI492808B (en) * | 2009-10-13 | 2015-07-21 | Mitsubishi Materials Corp | Method for forming gas venting holes in electrode plate |
| CN110102911B (en) * | 2012-12-04 | 2021-03-16 | 弗立兹·斯图特公司 | Method for machining a workpiece with a laser machining device and laser machining device |
| CN110102911A (en) * | 2012-12-04 | 2019-08-09 | 埃瓦格股份公司 | For the method and laser process equipment using laser process equipment workpieces processing |
| CN104703398B (en) * | 2015-03-27 | 2018-01-09 | 大族激光科技产业集团股份有限公司 | A kind of optimization method of the screw processing track of FPC blind holes |
| CN104703398A (en) * | 2015-03-27 | 2015-06-10 | 大族激光科技产业集团股份有限公司 | Optimizing method of spiral processing track of FPC (Flexible Printed Circuit) blind hole |
| CN107427962A (en) * | 2016-01-12 | 2017-12-01 | 株式会社英知 | Laser stitch welding method |
| CN107427962B (en) * | 2016-01-12 | 2023-09-15 | 株式会社英知一 | Laser stack welding method |
| CN108971775A (en) * | 2017-06-02 | 2018-12-11 | 大族激光科技产业集团股份有限公司 | A kind of laser boring method and equipment for metal |
| CN108188585A (en) * | 2017-12-25 | 2018-06-22 | 大族激光科技产业集团股份有限公司 | A kind of method that CD lines are processed on ceramics |
| CN108188585B (en) * | 2017-12-25 | 2020-04-17 | 大族激光科技产业集团股份有限公司 | Method for processing CD (compact disc) grains on ceramic |
| CN108406141A (en) * | 2018-04-18 | 2018-08-17 | 中国科学院西安光学精密机械研究所 | Ultrafast laser micropore processing method and device based on optical coherence tomography |
| CN108406141B (en) * | 2018-04-18 | 2024-05-03 | 西安中科微精光子科技股份有限公司 | Ultrafast laser micropore processing method and device based on optical coherence tomography |
| CN111421253A (en) * | 2020-01-07 | 2020-07-17 | 深圳市吉祥云科技有限公司 | Spiral-direction-rising amplitude-coiling punching method and punching system |
| CN113441852A (en) * | 2021-06-24 | 2021-09-28 | 中国科学院西安光学精密机械研究所 | Laser spiral scanning blind hole manufacturing method |
| CN113441852B (en) * | 2021-06-24 | 2022-07-19 | 中国科学院西安光学精密机械研究所 | Laser spiral scanning blind hole manufacturing method |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200738387A (en) | 2007-10-16 |
| JP2007268576A (en) | 2007-10-18 |
| KR20070098466A (en) | 2007-10-05 |
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