TW200617613A - Substrate processing device and method, and pattern forming method - Google Patents

Substrate processing device and method, and pattern forming method

Info

Publication number
TW200617613A
TW200617613A TW094120566A TW94120566A TW200617613A TW 200617613 A TW200617613 A TW 200617613A TW 094120566 A TW094120566 A TW 094120566A TW 94120566 A TW94120566 A TW 94120566A TW 200617613 A TW200617613 A TW 200617613A
Authority
TW
Taiwan
Prior art keywords
substrate
processing
side direction
liquid supply
supply means
Prior art date
Application number
TW094120566A
Other languages
English (en)
Other versions
TWI272659B (en
Inventor
Kazuhisa Imura
Original Assignee
Hoya Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hoya Corp filed Critical Hoya Corp
Publication of TW200617613A publication Critical patent/TW200617613A/zh
Application granted granted Critical
Publication of TWI272659B publication Critical patent/TWI272659B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Weting (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Liquid Crystal (AREA)
  • ing And Chemical Polishing (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
TW094120566A 2004-06-25 2005-06-21 Substrate processing apparatus, substrate processing method, and pattern forming method TWI272659B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004188556A JP2006013156A (ja) 2004-06-25 2004-06-25 基板処理装置及び基板処理方法並びにパターン形成方法

Publications (2)

Publication Number Publication Date
TW200617613A true TW200617613A (en) 2006-06-01
TWI272659B TWI272659B (en) 2007-02-01

Family

ID=35780025

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094120566A TWI272659B (en) 2004-06-25 2005-06-21 Substrate processing apparatus, substrate processing method, and pattern forming method

Country Status (4)

Country Link
JP (1) JP2006013156A (zh)
KR (1) KR100778326B1 (zh)
CN (1) CN100390931C (zh)
TW (1) TWI272659B (zh)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8277569B2 (en) 2004-07-01 2012-10-02 Dainippon Screen Mfg. Co., Ltd. Substrate treating apparatus and substrate treating method
JP2007220796A (ja) * 2006-02-15 2007-08-30 Shibaura Mechatronics Corp 基板の処理装置
JP2008091364A (ja) * 2006-09-29 2008-04-17 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
KR100865179B1 (ko) * 2007-04-13 2008-10-23 송종호 기판 식각 장치
CN102373473A (zh) * 2010-08-06 2012-03-14 东友Fine-Chem股份有限公司 一种用于坡面型刻蚀装置的刻蚀组合物及其使用方法
JP5315320B2 (ja) * 2010-11-09 2013-10-16 東京エレクトロン株式会社 基板処理方法、プログラム、コンピュータ記憶媒体及び基板処理装置
CN103207543A (zh) * 2013-04-19 2013-07-17 京东方科技集团股份有限公司 一种显影方法
JP6148900B2 (ja) * 2013-05-23 2017-06-14 東京応化工業株式会社 塗布装置
CN103324038A (zh) * 2013-06-25 2013-09-25 京东方科技集团股份有限公司 一种显影装置及显影方法
CN104062857A (zh) * 2014-06-11 2014-09-24 京东方科技集团股份有限公司 一种显影方法及显影装置
CN104282598A (zh) * 2014-09-23 2015-01-14 安徽省大富光电科技有限公司 蚀刻、显影、清洗以及褪膜设备、喷淋处理设备及方法
CN105158829B (zh) * 2015-07-30 2019-06-04 京东方科技集团股份有限公司 基板、彩色滤光片模组、形成基板模组的方法和显示装置
KR20180024587A (ko) * 2016-08-30 2018-03-08 정병현 포토레지스트 박리 방법
CN107552254A (zh) * 2017-08-08 2018-01-09 武汉华星光电半导体显示技术有限公司 一种显影设备及显影方法
KR102277991B1 (ko) * 2019-06-27 2021-07-15 세메스 주식회사 노즐 세정 유닛 및 기판 처리 장치

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62199942U (zh) * 1986-06-10 1987-12-19
JPH09155307A (ja) * 1995-12-04 1997-06-17 Dainippon Screen Mfg Co Ltd 基板処理装置
JP3535706B2 (ja) * 1997-08-28 2004-06-07 大日本スクリーン製造株式会社 基板処理装置
JP3535707B2 (ja) * 1997-08-28 2004-06-07 大日本スクリーン製造株式会社 基板処理装置
JPH11145109A (ja) * 1997-11-07 1999-05-28 Dainippon Screen Mfg Co Ltd 基板処理装置
JP4488322B2 (ja) * 2000-01-26 2010-06-23 大日本印刷株式会社 フォトマスク製造用スピン処理装置
JP3704064B2 (ja) * 2001-07-05 2005-10-05 東京エレクトロン株式会社 液処理装置および液処理方法
JP3837720B2 (ja) * 2002-09-12 2006-10-25 東京エレクトロン株式会社 基板処理方法及び基板処理装置
JP2004041883A (ja) * 2002-07-10 2004-02-12 Konica Minolta Holdings Inc 基板洗浄方法、有機ｅｌ素子からなるフルカラーディスプレイパネルの製造方法および有機ｅｌ素子からなるフルカラーディスプレイパネル
KR100525927B1 (ko) * 2003-03-18 2005-11-02 주식회사 디엠에스 액정 디스플레이 장치용 기판 처리 장치

Also Published As

Publication number Publication date
JP2006013156A (ja) 2006-01-12
KR100778326B1 (ko) 2007-11-22
KR20060048451A (ko) 2006-05-18
CN1722361A (zh) 2006-01-18
TWI272659B (en) 2007-02-01
CN100390931C (zh) 2008-05-28

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees