TW200739791A - Apparatus for treating substrates and method of treating substrates - Google Patents

Apparatus for treating substrates and method of treating substrates

Info

Publication number
TW200739791A
TW200739791A TW095125429A TW95125429A TW200739791A TW 200739791 A TW200739791 A TW 200739791A TW 095125429 A TW095125429 A TW 095125429A TW 95125429 A TW95125429 A TW 95125429A TW 200739791 A TW200739791 A TW 200739791A
Authority
TW
Taiwan
Prior art keywords
substrate
apparatus body
conveying
conveyance
conveyed
Prior art date
Application number
TW095125429A
Other languages
Chinese (zh)
Other versions
TWI459491B (en
Inventor
Harumichi Hirose
Hideki Sueyoshi
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Publication of TW200739791A publication Critical patent/TW200739791A/en
Application granted granted Critical
Publication of TWI459491B publication Critical patent/TWI459491B/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67796—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations with angular orientation of workpieces

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Specific Conveyance Elements (AREA)
  • Weting (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning In General (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

To provide an apparatus for processing a substrate with a reduced installation space capable of supplying the substrate and conveying out the same at the same place. The apparatus comprises an apparatus body 1; a conveyance roller provided on the apparatus body for conveying a substrate while tilting the same at a predetermined angle; a processor 3 for processing a substrate conveyed by the conveyance roller; an upper conveyance unit 4 provided on the upper part of the apparatus body for conveying a substrate, in an opposite direction to a conveyance direction where the substrate is conveyed, tilted in a horizontal state of the substrate; and a tilt delivery unit 61 provided at least at one end of the apparatus body for lowering the substrate once receiving the substrate conveyed horizontally by the upper conveyance unit, and simultaneously delivering the substrate to the conveyance roller while tilting the substrate at a predetermined angle.
TW095125429A 2005-07-25 2006-07-12 Apparatus for treating substrates and method of treating substrates TWI459491B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005214583A JP4643384B2 (en) 2005-07-25 2005-07-25 Substrate processing apparatus and processing method

Publications (2)

Publication Number Publication Date
TW200739791A true TW200739791A (en) 2007-10-16
TWI459491B TWI459491B (en) 2014-11-01

Family

ID=37673075

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095125429A TWI459491B (en) 2005-07-25 2006-07-12 Apparatus for treating substrates and method of treating substrates

Country Status (4)

Country Link
JP (1) JP4643384B2 (en)
KR (1) KR101340422B1 (en)
CN (1) CN1903683B (en)
TW (1) TWI459491B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4685618B2 (en) * 2005-12-13 2011-05-18 芝浦メカトロニクス株式会社 Substrate processing equipment
KR100865767B1 (en) * 2007-03-15 2008-10-28 우진선행기술 주식회사 Device for slimming of plate and method for slimming of plate
CN101531465B (en) * 2009-04-01 2010-12-29 上海多林化工科技有限公司 Automatic frosting production line of flat glass
JP4992137B1 (en) * 2011-10-15 2012-08-08 株式会社Ａｋシステム Equipment for handling plate-like materials
TWI611465B (en) * 2013-07-03 2018-01-11 應用材料股份有限公司 Reactor gas panel common exhaust
CN110641919A (en) * 2019-10-31 2020-01-03 张家港市超声电气有限公司 Suction transmission mechanism for silicon wafer

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000049206A (en) * 1998-07-28 2000-02-18 Dainippon Screen Mfg Co Ltd Substrate treating apparatus
JP4136826B2 (en) * 2002-08-19 2008-08-20 住友精密工業株式会社 Elevating type substrate processing apparatus and substrate processing system having the same
KR100596050B1 (en) * 2002-10-31 2006-07-03 삼성코닝정밀유리 주식회사 Glass substrate transferring system
JP4452033B2 (en) * 2003-05-22 2010-04-21 芝浦メカトロニクス株式会社 Substrate transfer apparatus and transfer method
KR100500171B1 (en) 2003-06-19 2005-07-07 주식회사 디엠에스 Apparatus for tilting transfering works and the method of the same, and the method for treatment of works

Also Published As

Publication number Publication date
CN1903683B (en) 2012-04-11
JP4643384B2 (en) 2011-03-02
KR20070013225A (en) 2007-01-30
TWI459491B (en) 2014-11-01
KR101340422B1 (en) 2013-12-11
CN1903683A (en) 2007-01-31
JP2007035790A (en) 2007-02-08

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees