TW200613903A - Photosensitive resin composition, and cured product and use thereof - Google Patents

Photosensitive resin composition, and cured product and use thereof

Info

Publication number
TW200613903A
TW200613903A TW094116779A TW94116779A TW200613903A TW 200613903 A TW200613903 A TW 200613903A TW 094116779 A TW094116779 A TW 094116779A TW 94116779 A TW94116779 A TW 94116779A TW 200613903 A TW200613903 A TW 200613903A
Authority
TW
Taiwan
Prior art keywords
resin composition
photosensitive resin
meth
compound
epoxy
Prior art date
Application number
TW094116779A
Other languages
English (en)
Inventor
Hirofumi Inoue
Original Assignee
Showa Denko Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko Kk filed Critical Showa Denko Kk
Publication of TW200613903A publication Critical patent/TW200613903A/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
TW094116779A 2004-05-26 2005-05-23 Photosensitive resin composition, and cured product and use thereof TW200613903A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004156492 2004-05-26

Publications (1)

Publication Number Publication Date
TW200613903A true TW200613903A (en) 2006-05-01

Family

ID=37684662

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094116779A TW200613903A (en) 2004-05-26 2005-05-23 Photosensitive resin composition, and cured product and use thereof

Country Status (5)

Country Link
US (1) US20070166642A1 (zh)
EP (1) EP1759244A2 (zh)
CN (1) CN1965267A (zh)
TW (1) TW200613903A (zh)
WO (1) WO2005116760A2 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
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TWI554830B (zh) * 2011-08-10 2016-10-21 日立化成股份有限公司 感光性樹脂組成物、感光性膜、永久抗蝕劑及永久抗蝕劑的製造方法

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TW200630447A (en) 2004-11-19 2006-09-01 Showa Denko Kk Resin cured film for flexible printed wiring board and production process thereof
JP5399603B2 (ja) * 2005-10-07 2014-01-29 昭和電工株式会社 シリコーンパウダーを含む熱硬化性樹脂組成物
JP4839092B2 (ja) * 2006-01-30 2011-12-14 矢崎総業株式会社 電線マーキング用インクジェットインク
JP4994922B2 (ja) * 2007-04-06 2012-08-08 太陽ホールディングス株式会社 ソルダーレジスト組成物およびその硬化物
KR100940174B1 (ko) * 2007-04-27 2010-02-03 다이요 잉키 세이조 가부시키가이샤 인쇄 배선판의 제조 방법 및 인쇄 배선판
CN101520602B (zh) * 2008-02-28 2011-09-07 新力美科技股份有限公司 可辐射固化显影的聚胺酯以及含其的可辐射固化显影的光阻组成物
KR101048329B1 (ko) * 2008-10-06 2011-07-14 주식회사 엘지화학 우레탄계 다관능성 모노머, 그의 제조방법 및 이를 포함하는 감광성 수지 조성물
JP4318743B1 (ja) * 2008-10-07 2009-08-26 昭和高分子株式会社 紫外線硬化型再剥離性粘着剤組成物及びこれを用いた粘着シート
JP5404028B2 (ja) * 2008-12-25 2014-01-29 東京応化工業株式会社 被エッチング基体の製造方法
JP5515394B2 (ja) * 2009-04-30 2014-06-11 株式会社ピーアイ技術研究所 感光性変性ポリイミド樹脂組成物及びその用途
TWI395027B (zh) * 2009-05-01 2013-05-01 Ind Tech Res Inst 框膠組成物
EP2444435A4 (en) * 2009-06-15 2013-07-03 Toyo Ink Sc Holdings Co Ltd URETHANE RESIN, LIQUID THAT IS HARDENABLE WITH ACTIN POWER RAYS AND PROTECTIVE BACKFILM FOR A SOLAR CELL
KR101481071B1 (ko) * 2010-03-08 2015-01-13 주식회사 엘지화학 내열성 및 기계적 성질이 우수한 감광성 수지 조성물 및 인쇄회로기판용 보호필름
CA2755151C (en) * 2010-10-18 2014-06-17 Valspar Sourcing, Inc. Anti-graffiti coatings
KR101332436B1 (ko) * 2010-12-06 2013-11-22 제일모직주식회사 이방 전도성 필름
CN102181019B (zh) * 2011-03-18 2014-08-13 湖北工业大学 紫外光固化耐银离子迁移型等离子显示器电路保护剂及其制备方法
WO2013084282A1 (ja) 2011-12-05 2013-06-13 日立化成株式会社 樹脂硬化膜パターンの形成方法、感光性樹脂組成物及び感光性エレメント
KR102025036B1 (ko) * 2011-12-05 2019-09-24 히타치가세이가부시끼가이샤 터치패널용 전극의 보호막의 형성 방법, 감광성 수지 조성물 및 감광성 엘리먼트, 및, 터치패널의 제조 방법
WO2013084283A1 (ja) 2011-12-05 2013-06-13 日立化成株式会社 タッチパネル用電極の保護膜の形成方法、感光性樹脂組成物及び感光性エレメント
CN103305133B (zh) * 2013-06-18 2015-02-18 北京京东方光电科技有限公司 一种封框胶及其制备方法、液晶显示面板和液晶显示器
KR101562964B1 (ko) * 2013-09-02 2015-10-26 주식회사 케이씨씨 신뢰성이 우수한 감광성 수지 조성물 및 그 제조방법
US9540529B2 (en) * 2015-01-13 2017-01-10 Xerox Corporation Solder mask compositions for aerosol jet printing
JP6930894B2 (ja) * 2017-10-26 2021-09-01 オリンパス株式会社 ガス低温滅菌を受ける医療機器用の樹脂組成物、可撓管、音響レンズ、および外皮、ならびにガス低温滅菌を受ける医療機器
JP7255241B2 (ja) * 2018-03-09 2023-04-11 三菱ケミカル株式会社 活性エネルギー線硬化性剥離型粘着剤組成物および剥離型粘着シート
CN109467651B (zh) * 2018-11-07 2021-01-15 华东理工大学华昌聚合物有限公司 光固化环氧乙烯基酯树脂及其合成方法
CN109776756A (zh) * 2019-01-21 2019-05-21 深圳市道尔顿电子材料有限公司 一种双重改性环氧丙烯酸酯及其光刻胶
CN110563925B (zh) * 2019-09-16 2022-02-01 上海昭和高分子有限公司 一种酸酐改性环氧丙烯酸树脂、碱显像高耐热聚氨酯树脂及其阻焊油墨
CN114716777B (zh) * 2020-12-22 2023-07-11 广东生益科技股份有限公司 一种透明树脂组合物、包含其的挠性覆铜板及其应用

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US5089376A (en) * 1986-12-08 1992-02-18 Armstrong World Industries, Inc. Photoimagable solder mask coating
US5420171A (en) * 1991-12-31 1995-05-30 Tech Spray, Inc. UV curable temporary solder mask
JP3223678B2 (ja) * 1993-12-24 2001-10-29 三菱電機株式会社 はんだ付け用フラックスおよびクリームはんだ
US6197149B1 (en) * 1997-04-15 2001-03-06 Hitachi Chemical Company, Ltd. Production of insulating varnishes and multilayer printed circuit boards using these varnishes
US6432614B1 (en) * 1998-07-31 2002-08-13 Dai Nippon Printing Co., Ltd. Photosensitive resin composition and color filter
CA2365144A1 (en) * 1999-03-19 2000-09-28 Nippon Kayaku Kabushiki Kaisha Urethane oligomer, resin compositions thereof, and cured article thereof
US6268111B1 (en) * 1999-10-20 2001-07-31 Rohm And Haas Company Photoimageable composition having photopolymerizeable binder oligomer
AU2001284499A1 (en) * 2000-09-11 2002-03-26 Showa Denko K K Photosensitive composition, cured article thereof, and printed circuit board using the same
CN1282036C (zh) * 2001-07-04 2006-10-25 昭和电工株式会社 抗蚀性可固化树脂组合物及其固化产品
TW200630447A (en) * 2004-11-19 2006-09-01 Showa Denko Kk Resin cured film for flexible printed wiring board and production process thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI554830B (zh) * 2011-08-10 2016-10-21 日立化成股份有限公司 感光性樹脂組成物、感光性膜、永久抗蝕劑及永久抗蝕劑的製造方法

Also Published As

Publication number Publication date
WO2005116760A2 (en) 2005-12-08
CN1965267A (zh) 2007-05-16
WO2005116760A3 (en) 2007-01-25
US20070166642A1 (en) 2007-07-19
EP1759244A2 (en) 2007-03-07

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