TW200613450A - Silicon-containing curable composition and its thermally cured material - Google Patents
Silicon-containing curable composition and its thermally cured materialInfo
- Publication number
- TW200613450A TW200613450A TW094115459A TW94115459A TW200613450A TW 200613450 A TW200613450 A TW 200613450A TW 094115459 A TW094115459 A TW 094115459A TW 94115459 A TW94115459 A TW 94115459A TW 200613450 A TW200613450 A TW 200613450A
- Authority
- TW
- Taiwan
- Prior art keywords
- silicon
- group
- component
- curable composition
- weight
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
- C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Silicon Polymers (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Silicon Compounds (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004142607A JP5132027B2 (ja) | 2004-05-12 | 2004-05-12 | ケイ素含有硬化性組成物、及びこれを熱硬化させた硬化物 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200613450A true TW200613450A (en) | 2006-05-01 |
Family
ID=35320212
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094115459A TW200613450A (en) | 2004-05-12 | 2005-05-12 | Silicon-containing curable composition and its thermally cured material |
Country Status (7)
Country | Link |
---|---|
US (1) | US7939614B2 (zh) |
EP (1) | EP1746132B1 (zh) |
JP (1) | JP5132027B2 (zh) |
KR (1) | KR101178632B1 (zh) |
CN (1) | CN1930245B (zh) |
TW (1) | TW200613450A (zh) |
WO (1) | WO2005108496A1 (zh) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006206721A (ja) * | 2005-01-27 | 2006-08-10 | Kansai Electric Power Co Inc:The | 高耐熱合成高分子化合物及びこれで被覆した高耐電圧半導体装置 |
JP2007277505A (ja) * | 2006-03-16 | 2007-10-25 | Jsr Corp | 酸化物微粒子分散体およびその製造方法 |
JP2007277073A (ja) * | 2006-03-16 | 2007-10-25 | Jsr Corp | 酸化物微粒子分散体およびその製造方法 |
JP2007291324A (ja) * | 2006-03-31 | 2007-11-08 | Jsr Corp | 酸化物微粒子含有ポリシロキサン組成物およびその製造方法 |
KR20080111480A (ko) * | 2006-03-16 | 2008-12-23 | 제이에스알 가부시끼가이샤 | 산화물 미립자 함유 폴리실록산 조성물 및 그의 제조 방법 |
JP2007277072A (ja) * | 2006-03-16 | 2007-10-25 | Jsr Corp | 酸化物微粒子分散体およびその製造方法 |
JP2007270055A (ja) * | 2006-03-31 | 2007-10-18 | Jsr Corp | 多官能ポリシロキサンおよび金属酸化物微粒子含有ポリシロキサン組成物、ならびにそれらの製造方法 |
JP2007270056A (ja) * | 2006-03-31 | 2007-10-18 | Jsr Corp | 金属酸化物微粒子含有ポリシロキサン組成物およびその製造方法 |
RU2401846C2 (ru) * | 2006-04-25 | 2010-10-20 | Учреждение Российской академии наук Институт синтетических полимерных материалов им. Н.С. Ениколопова РАН (ИСПМ РАН) | Функциональные полиорганосилоксаны и композиция, способная к отверждению на их основе |
WO2008123252A1 (ja) * | 2007-03-26 | 2008-10-16 | Nippon Steel Chemical Co., Ltd. | レンズ |
US8026035B2 (en) * | 2007-03-30 | 2011-09-27 | Cheil Industries, Inc. | Etch-resistant disilane and saturated hydrocarbon bridged silicon-containing polymers, method of making the same, and method of using the same |
JP5248034B2 (ja) * | 2007-04-23 | 2013-07-31 | 株式会社Adeka | ケイ素含有化合物、硬化性組成物及び硬化物 |
JP5248033B2 (ja) | 2007-04-23 | 2013-07-31 | 株式会社Adeka | ケイ素含有化合物、硬化性組成物及び硬化物 |
JP2009091547A (ja) * | 2007-09-21 | 2009-04-30 | Shin Etsu Chem Co Ltd | 付加硬化型シリコーンゴム組成物及びその硬化物並びに架橋剤 |
JP5393373B2 (ja) * | 2009-09-16 | 2014-01-22 | 関西電力株式会社 | 半導体装置 |
JP5801208B2 (ja) * | 2010-07-27 | 2015-10-28 | 株式会社Adeka | 半導体封止用硬化性組成物 |
JP2012097225A (ja) * | 2010-11-04 | 2012-05-24 | Daicel Corp | 硬化性樹脂組成物及び硬化物 |
US9297950B2 (en) * | 2011-05-10 | 2016-03-29 | Sumitomo Electric Industries, Ltd. | Optical fiber |
JP6011230B2 (ja) | 2011-10-25 | 2016-10-19 | セントラル硝子株式会社 | シロキサン系組成物およびその硬化物ならびにその用途 |
JP6213257B2 (ja) | 2013-01-25 | 2017-10-18 | セントラル硝子株式会社 | シリコーンを含む硬化性組成物およびその硬化物 |
JP2016169358A (ja) * | 2014-07-24 | 2016-09-23 | セントラル硝子株式会社 | 硬化性シリコーン樹脂組成物およびその硬化物、並びにこれらを用いた光半導体装置 |
WO2016013421A1 (ja) * | 2014-07-24 | 2016-01-28 | セントラル硝子株式会社 | 硬化性シリコーン樹脂組成物およびその硬化物、並びにこれらを用いた光半導体装置 |
TWI738743B (zh) | 2016-03-23 | 2021-09-11 | 美商道康寧公司 | 金屬-聚有機矽氧烷 |
EP3555213B1 (en) | 2016-12-19 | 2022-01-26 | Saint-Gobain Performance Plastics Corporation | Silicone-based composition and article made therefrom |
WO2019131872A1 (ja) * | 2017-12-28 | 2019-07-04 | 国立研究開発法人産業技術総合研究所 | ポリマーブラシ形成用基体及び該基体の製造方法並びに該方法に用いる前駆液 |
CN110330653B (zh) * | 2019-07-05 | 2020-10-23 | 北京化工大学 | 一种耐高温高折射率的主链含亚苯基的钛杂化硅树脂、其制备方法及应用 |
WO2024123606A1 (en) * | 2022-12-05 | 2024-06-13 | Dow Silicones Corporation | Uv curable silicone composition |
Family Cites Families (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3284406A (en) | 1963-12-18 | 1966-11-08 | Dow Corning | Organosiloxane encapsulating resins |
US4310678A (en) * | 1980-12-02 | 1982-01-12 | Dow Corning Corporation | Liquid copolymeric organopolysiloxanes comprising SiO2 and method therefor |
US5217811A (en) * | 1989-05-18 | 1993-06-08 | At&T Bell Laboratories | Devices featuring silicone elastomers |
US5215801A (en) * | 1990-08-22 | 1993-06-01 | At&T Bell Laboratories | Silicone resin electronic device encapsulant |
JP3134333B2 (ja) * | 1991-03-27 | 2001-02-13 | ジェイエスアール株式会社 | 導電性エラストマー用組成物 |
JP2623380B2 (ja) * | 1991-06-03 | 1997-06-25 | 信越化学工業株式会社 | 熱伝導性に優れたシリコーン組成物 |
JP3615784B2 (ja) * | 1994-04-21 | 2005-02-02 | ダウ コーニング アジア株式会社 | 光学素子用樹脂組成物及び光学素子 |
JPH07306301A (ja) * | 1994-05-13 | 1995-11-21 | Dow Corning Kk | 光学素子及びその製造方法 |
US5536803A (en) * | 1994-06-06 | 1996-07-16 | Shin-Etsu Chemical Co., Ltd. | Adhesive silicone compositions |
US5623030A (en) * | 1994-12-01 | 1997-04-22 | Kanegafuchi Kagaku Kogyo Kabushiki Kaisha | Curable composition and process for producing molded articles using the same |
US6307081B1 (en) * | 1997-11-24 | 2001-10-23 | Dow Corning Silicone Company, Ltd. | Hyperbranched polymers and methods for the preparation, cure, and stabilization thereof |
JP2000231001A (ja) * | 1999-02-10 | 2000-08-22 | Konica Corp | 光学用レンズ |
JP2000231002A (ja) * | 1999-02-10 | 2000-08-22 | Konica Corp | 光学用レンズ |
DE19957276A1 (de) * | 1999-11-29 | 2001-10-11 | Abb Research Ltd | Additionsvernetzende Siliconkautschukmischungen |
CA2387806A1 (en) * | 2000-08-17 | 2002-02-21 | Koichiro Nakamura | Adhesive composition and optical device making use of the same |
JP2002173661A (ja) * | 2000-09-13 | 2002-06-21 | Nippon Sheet Glass Co Ltd | 接着剤組成物およびそれを用いた光学装置 |
JP3718123B2 (ja) * | 2000-12-18 | 2005-11-16 | 信越化学工業株式会社 | 型取り用オルガノポリシロキサン組成物 |
JP4009067B2 (ja) * | 2001-03-06 | 2007-11-14 | 信越化学工業株式会社 | 付加硬化型シリコーン樹脂組成物 |
JP3757264B2 (ja) * | 2001-03-27 | 2006-03-22 | 独立行政法人産業技術総合研究所 | シルセスキオキサン系ポリマー成形体及びその製造方法 |
JP2002348473A (ja) * | 2001-05-23 | 2002-12-04 | Asahi Denka Kogyo Kk | 硬化性組成物 |
JP5225528B2 (ja) * | 2001-05-30 | 2013-07-03 | 株式会社Adeka | ケイ素含有重合体の製造方法 |
JP3865639B2 (ja) * | 2002-01-28 | 2007-01-10 | 信越化学工業株式会社 | 半導体封止用シリコーン組成物および半導体装置 |
EP1472305A1 (en) * | 2002-02-08 | 2004-11-03 | Ophtec B.V. | High refractive index flexible silicone |
WO2003080753A1 (en) * | 2002-03-22 | 2003-10-02 | Dow Corning Corporation | Silicone resins and their preparation |
US6907176B2 (en) * | 2002-06-24 | 2005-06-14 | Dow Corning Corporation | Planar optical waveguide assembly and method of preparing same |
JP4663969B2 (ja) * | 2002-07-09 | 2011-04-06 | 東レ・ダウコーニング株式会社 | 硬化性シリコーンレジン組成物およびその硬化物 |
JP3919001B2 (ja) * | 2002-08-08 | 2007-05-23 | 信越化学工業株式会社 | 付加反応硬化型オルガノポリシロキサン組成物 |
JP4409160B2 (ja) * | 2002-10-28 | 2010-02-03 | 東レ・ダウコーニング株式会社 | 硬化性オルガノポリシロキサン組成物および半導体装置 |
JP2004186168A (ja) * | 2002-11-29 | 2004-07-02 | Shin Etsu Chem Co Ltd | 発光ダイオード素子用シリコーン樹脂組成物 |
US7241823B2 (en) * | 2002-12-11 | 2007-07-10 | Shin-Etsu Chemical Co., Ltd. | Radiation curing silicone rubber composition, adhesive silicone elastomer film formed from same, semiconductor device using same, and method of producing semiconductor device |
JP3912525B2 (ja) * | 2002-12-12 | 2007-05-09 | 信越化学工業株式会社 | 付加硬化型シリコーンゴム組成物及び粘着ゴムシート |
US7160972B2 (en) * | 2003-02-19 | 2007-01-09 | Nusil Technology Llc | Optically clear high temperature resistant silicone polymers of high refractive index |
JP2004359756A (ja) * | 2003-06-03 | 2004-12-24 | Wacker Asahikasei Silicone Co Ltd | Led用封止剤組成物 |
TWI373150B (en) * | 2003-07-09 | 2012-09-21 | Shinetsu Chemical Co | Silicone rubber composition, light-emitting semiconductor embedding/protecting material and light-emitting semiconductor device |
JP2005272697A (ja) * | 2004-03-25 | 2005-10-06 | Shin Etsu Chem Co Ltd | 硬化性シリコーン樹脂組成物、光半導体用封止材および光半導体装置 |
JP4494077B2 (ja) * | 2004-04-22 | 2010-06-30 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | 光学材料封止用硬化性組成物 |
-
2004
- 2004-05-12 JP JP2004142607A patent/JP5132027B2/ja not_active Expired - Fee Related
-
2005
- 2005-05-10 WO PCT/JP2005/008490 patent/WO2005108496A1/ja not_active Application Discontinuation
- 2005-05-10 CN CN2005800079614A patent/CN1930245B/zh not_active Expired - Fee Related
- 2005-05-10 EP EP05739080.9A patent/EP1746132B1/en not_active Expired - Fee Related
- 2005-05-10 KR KR1020067018727A patent/KR101178632B1/ko not_active IP Right Cessation
- 2005-05-10 US US10/594,221 patent/US7939614B2/en not_active Expired - Fee Related
- 2005-05-12 TW TW094115459A patent/TW200613450A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
CN1930245A (zh) | 2007-03-14 |
US20070197755A1 (en) | 2007-08-23 |
JP5132027B2 (ja) | 2013-01-30 |
EP1746132A1 (en) | 2007-01-24 |
EP1746132B1 (en) | 2013-07-10 |
US7939614B2 (en) | 2011-05-10 |
CN1930245B (zh) | 2010-05-05 |
WO2005108496A1 (ja) | 2005-11-17 |
JP2005325174A (ja) | 2005-11-24 |
EP1746132A4 (en) | 2009-12-16 |
KR20070007313A (ko) | 2007-01-15 |
KR101178632B1 (ko) | 2012-08-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW200613450A (en) | Silicon-containing curable composition and its thermally cured material | |
DE60224696D1 (de) | Kompatibilisierte polyamidharze enthaltende thermoplastische silkonelastomere | |
ATE442417T1 (de) | Silikonzusammensetzung und gehärtetes silikonharz | |
WO2008139679A1 (ja) | 光及び/又は熱硬化性共重合体、硬化性樹脂組成物及び硬化物 | |
MX2007005600A (es) | Resinas epoxicas endurecidas con copolimero de bloque anfifilico y revestimientos con un alto contenido de solidos de curacion ambiental hechos a partir de las mismas. | |
DE60106086D1 (de) | Aus polyesterharzen hergestellte thermoplastische silikonelastomere | |
DE602005019608D1 (de) | Mit amphiphilem blockcoplymer gehärtete epoxidharze und daraus hergestellte pulverbeschichtungen | |
GB0606599D0 (en) | Extenders for organosiloxane compositions | |
WO2001072903A3 (en) | Thermoplastic silicone polyamide elastomers | |
WO2007009871A3 (en) | Organosiloxane compositions | |
EP1489113A4 (en) | fluorocopolymer; PROCESS FOR PREPARING FLUORO COPOLYMER, HARDENABLE FLUOROPOLYMER COMPOSITION AND HARDENED SUBJECT | |
TW200609282A (en) | Heat-conductive silicone rubber composition and molded article | |
ATE444994T1 (de) | Thermoplastische silikonelastomere aus verträglich gemachten polyesterharzen | |
MY140964A (en) | Addition-curable organopolysiloxane resin composition and an optical material | |
WO2003076507A3 (en) | High fracture toughness hydrosilyation cured silicone resin | |
WO2008133229A1 (ja) | ケイ素含有化合物、硬化性組成物及び硬化物 | |
ATE453688T1 (de) | Mit amphiphilem blockcopolymer schlagzäh modifizierte epoxidharze und daraus hergestellte elektrische laminate | |
TW200641055A (en) | Addition-curable silicone rubber composition and pressure-sensitive adhesive rubber sheet | |
WO2008045417A3 (en) | Extenders for organosiloxane compositions | |
ATE376033T1 (de) | Silikonzusammensetzung und gehärtetes produkt daraus | |
WO2006055232A3 (en) | Organohydrogenpoly siloxane resin and silicon composition | |
DE602005019574D1 (de) | Härtbare organopolysiloxanzusammensetzung | |
ATE412706T1 (de) | Härtbare organopolysiloxanzusammensetzung | |
EP1806618A4 (en) | POSITIVE PHOTOSENSITIVE INSULATION RESIN COMPOSITION AND CURED PRODUCT FORMED THEREFROM | |
NO20026169D0 (no) | Beleggsammensetning som herder ved omgivelsestemperatur |