ATE376033T1 - Silikonzusammensetzung und gehärtetes produkt daraus - Google Patents

Silikonzusammensetzung und gehärtetes produkt daraus

Info

Publication number
ATE376033T1
ATE376033T1 AT02789154T AT02789154T ATE376033T1 AT E376033 T1 ATE376033 T1 AT E376033T1 AT 02789154 T AT02789154 T AT 02789154T AT 02789154 T AT02789154 T AT 02789154T AT E376033 T1 ATE376033 T1 AT E376033T1
Authority
AT
Austria
Prior art keywords
composition
silicone
product
silicone composition
parts
Prior art date
Application number
AT02789154T
Other languages
English (en)
Inventor
Bizhong Zhu
Original Assignee
Dow Corning
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning filed Critical Dow Corning
Application granted granted Critical
Publication of ATE376033T1 publication Critical patent/ATE376033T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/5403—Silicon-containing compounds containing no other elements than carbon or hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
AT02789154T 2001-08-21 2002-07-30 Silikonzusammensetzung und gehärtetes produkt daraus ATE376033T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/934,215 US6509423B1 (en) 2001-08-21 2001-08-21 Silicone composition and cured silicone product

Publications (1)

Publication Number Publication Date
ATE376033T1 true ATE376033T1 (de) 2007-11-15

Family

ID=25465177

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02789154T ATE376033T1 (de) 2001-08-21 2002-07-30 Silikonzusammensetzung und gehärtetes produkt daraus

Country Status (10)

Country Link
US (1) US6509423B1 (de)
EP (1) EP1419198B1 (de)
JP (1) JP2005523345A (de)
KR (1) KR20040030983A (de)
CN (1) CN1229439C (de)
AT (1) ATE376033T1 (de)
AU (1) AU2002353773A1 (de)
CA (1) CA2457963A1 (de)
DE (1) DE60223048T2 (de)
WO (1) WO2003022930A2 (de)

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WO2009111196A1 (en) * 2008-03-04 2009-09-11 Dow Corning Corporation Silicone composition, silicone adhesive, coated and laminated substrates
US20100273011A1 (en) * 1996-12-20 2010-10-28 Bianxiao Zhong Silicone Composition, Silicone Adhesive, Coated and Laminated Substrates
US6310146B1 (en) * 1999-07-01 2001-10-30 Dow Corning Corporation Silsesquioxane resin with high strength and fracture toughness and method for the preparation thereof
US6646039B2 (en) * 2002-03-05 2003-11-11 Dow Corning Corporation Hydrosilyation cured silicone resin containing colloidal silica and a process for producing the same
US6689859B2 (en) * 2002-03-05 2004-02-10 Dow Corning Corporation High fracture toughness hydrosilyation cured silicone resin
US20040068048A1 (en) * 2002-10-07 2004-04-08 Giles Sanford F. Low abrasive rubber composition and associated method of manufacturing the same
JP2005089671A (ja) * 2003-09-19 2005-04-07 Shin Etsu Chem Co Ltd 硬化性シリコーン樹脂組成物
GB0328236D0 (en) * 2003-12-05 2004-01-07 Dow Corning Method of making kaolin containing silicone rubber compositions
JP5128044B2 (ja) * 2003-12-10 2013-01-23 東京応化工業株式会社 シリコン基板又は金属配線パターンが設けられたシリコン基板被覆用シリカ系被膜形成用材料の製造方法
JP5101788B2 (ja) * 2003-12-22 2012-12-19 東レ・ダウコーニング株式会社 半導体装置の製造方法および半導体装置
WO2005068569A1 (en) * 2003-12-22 2005-07-28 Dow Corning Corporation Silicone compositions and their use in controlling the release or transfer of printed or molded patterns and transferring processes therefore
KR101338924B1 (ko) * 2004-01-22 2013-12-10 다우 코닝 코포레이션 첨가양생재에 대한 부착성을 향상시킨 조성물과 이 조성물과 일체화된 복합물
JP4676735B2 (ja) * 2004-09-22 2011-04-27 東レ・ダウコーニング株式会社 光半導体装置の製造方法および光半導体装置
JP5049789B2 (ja) * 2004-11-19 2012-10-17 ダウ・コーニング・コーポレイション オルガノハイドロジェンポリシロキサン樹脂及びシリコーン組成物
WO2006055231A1 (en) * 2004-11-19 2006-05-26 Dow Corning Corporation Silicone composition and cured silicone resin
WO2006073696A1 (en) * 2005-01-04 2006-07-13 Dow Corning Corporation Siloxanes and silanes cured by organoborane amine complexes
CN101163748B (zh) * 2005-05-26 2011-04-13 陶氏康宁公司 用于模塑小的型材的方法和有机硅封装剂组合物
US7588967B2 (en) * 2005-05-27 2009-09-15 Shin-Etsu Chemical Co., Ltd. Curable silicone rubber composition and semiconductor device
US7021147B1 (en) * 2005-07-11 2006-04-04 General Electric Company Sensor package and method
JP2009509026A (ja) * 2005-09-21 2009-03-05 ダウ・コーニング・コーポレイション 有機ボランアミン錯体を使用しての、常温リトグラフィー方法
US7767754B2 (en) * 2005-11-08 2010-08-03 Momentive Performance Materials Inc. Silicone composition and process of making same
US7479522B2 (en) * 2005-11-09 2009-01-20 Momentive Performance Materials Inc. Silicone elastomer composition
CN101356214B (zh) * 2006-01-17 2011-05-18 陶氏康宁公司 热稳定的透明有机硅树脂组合物及其制备方法和用途
JP2009525507A (ja) * 2006-02-01 2009-07-09 ダウ・コーニング・コーポレイション 耐衝撃性光導波路およびその製造方法
KR20080104279A (ko) * 2006-02-24 2008-12-02 다우 코닝 코포레이션 실리콘으로 캡슐화된 발광 장치 및 실리콘 제조용의 경화성실리콘 조성물
WO2007107485A1 (en) 2006-03-17 2007-09-27 Akzo Nobel N.V. Process for preparing a rubber composition, rubber composition obtained therefrom, and use thereof
JP5281001B2 (ja) * 2006-06-20 2013-09-04 ダウ・コーニング・コーポレーシヨン 硬化可能な有機ケイ素組成物
WO2008027280A2 (en) 2006-08-28 2008-03-06 Dow Corning Corporation Optical devices and silicone compositions and processes fabricating the optical devices
EP2125652A1 (de) * 2006-12-20 2009-12-02 Dow Corning Corporation Mit gehärteten silikonharzzusammensetzungen beschichtete oder laminierte glassubstrate
CN101600664B (zh) * 2006-12-20 2013-02-06 陶氏康宁公司 用多层固化的有机硅树脂组合物涂覆或层合的玻璃基材
WO2008103411A1 (en) * 2007-02-22 2008-08-28 Dow Corning Corporation Composite article having excellent fire resistance
EP2254934A1 (de) * 2008-03-04 2010-12-01 Dow Corning Corporation Borsiloxanzusammensetzung, borsiloxanklebstoff, beschichtete und laminierte substrate
CN102046371B (zh) * 2008-05-27 2013-11-06 陶氏康宁公司 粘合带和层压玻璃
TW201004795A (en) * 2008-07-31 2010-02-01 Dow Corning Laminated glass
JP2010106243A (ja) * 2008-09-30 2010-05-13 Shin-Etsu Chemical Co Ltd 光半導体装置用シリコーン樹脂組成物
JP2012509393A (ja) * 2008-11-19 2012-04-19 ダウ コーニング コーポレーション シリコーン組成物およびその製造方法
JP5793824B2 (ja) * 2009-06-02 2015-10-14 Jnc株式会社 有機ケイ素化合物、該有機ケイ素化合物を含む熱硬化性組成物、および光半導体用封止材料
US8133423B2 (en) * 2009-10-20 2012-03-13 The Hong Kong Polytechnic University Method for fabrication of silicone composite with antimicrobial coating
EP2573129B1 (de) * 2010-05-18 2016-08-17 JNC Corporation Neue organosiliciumverbindung und wärmehärtende harzzusammensetzung, gehärtetes harz und halbleiterdichtungsmaterial mit dieser organosiliciumverbindung
WO2012064534A1 (en) 2010-11-09 2012-05-18 Dow Corning Corporation Hydrosilylation cured silicone resins plasticized by organophosphorous compounds
EP2655057A2 (de) * 2010-12-22 2013-10-30 Dow Corning Corporation Silikonzusammensetzung, silikonhaftmittel sowie beschichtete und laminierte substrate
CN103756255A (zh) * 2013-12-26 2014-04-30 东莞市广海大橡塑科技有限公司 一种led灯
CN107722632A (zh) * 2017-11-10 2018-02-23 中国人民解放军国防科技大学 太空环境下低挥发份多功能弹性连接件制备方法
WO2020019277A1 (zh) * 2018-07-27 2020-01-30 湖州五爻硅基材料研究院有限公司 一种球形粉体填料的制备方法、由此得到的球形粉体填料及其应用
JP7147500B2 (ja) * 2018-11-19 2022-10-05 信越化学工業株式会社 感光性樹脂組成物、パターン形成方法、及び反射防止膜
CN110791101B (zh) * 2019-11-19 2021-07-06 广州信粤新材料科技有限公司 一种有机硅防水耐老化材料及其制备方法

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Publication number Priority date Publication date Assignee Title
GB1065249A (en) 1963-01-17 1967-04-12 Boeing Co Power spectrum adapter
US5623030A (en) * 1994-12-01 1997-04-22 Kanegafuchi Kagaku Kogyo Kabushiki Kaisha Curable composition and process for producing molded articles using the same
US5747608A (en) 1996-12-31 1998-05-05 Dow Corning Corporation Rubber-modified rigid silicone resins and composites produced therefrom
US6310146B1 (en) * 1999-07-01 2001-10-30 Dow Corning Corporation Silsesquioxane resin with high strength and fracture toughness and method for the preparation thereof

Also Published As

Publication number Publication date
CN1531574A (zh) 2004-09-22
EP1419198A2 (de) 2004-05-19
DE60223048D1 (de) 2007-11-29
WO2003022930A2 (en) 2003-03-20
AU2002353773A1 (en) 2003-03-24
WO2003022930A3 (en) 2003-05-01
US6509423B1 (en) 2003-01-21
EP1419198B1 (de) 2007-10-17
CA2457963A1 (en) 2003-03-20
JP2005523345A (ja) 2005-08-04
KR20040030983A (ko) 2004-04-09
DE60223048T2 (de) 2008-07-24
CN1229439C (zh) 2005-11-30

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