TW200610204A - Semiconductor device and manufacturing method thereof - Google Patents

Semiconductor device and manufacturing method thereof

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Publication number
TW200610204A
TW200610204A TW094125987A TW94125987A TW200610204A TW 200610204 A TW200610204 A TW 200610204A TW 094125987 A TW094125987 A TW 094125987A TW 94125987 A TW94125987 A TW 94125987A TW 200610204 A TW200610204 A TW 200610204A
Authority
TW
Taiwan
Prior art keywords
connection terminal
external connection
electronic component
mounting electrode
chip
Prior art date
Application number
TW094125987A
Other languages
English (en)
Other versions
TWI272734B (en
Inventor
Hiroyuki Nakanishi
Shinji Suminoe
Original Assignee
Sharp Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Kk filed Critical Sharp Kk
Publication of TW200610204A publication Critical patent/TW200610204A/zh
Application granted granted Critical
Publication of TWI272734B publication Critical patent/TWI272734B/zh

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    • H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW094125987A 2004-07-29 2005-07-29 Semiconductor device and manufacturing method thereof TWI272734B (en)

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KR101315173B1 (ko) * 2009-12-28 2013-10-08 후지쯔 가부시끼가이샤 배선 구조 및 그 형성 방법
JP2011204894A (ja) * 2010-03-25 2011-10-13 Casio Computer Co Ltd 半導体装置およびその製造方法
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JP6361374B2 (ja) 2014-08-25 2018-07-25 日亜化学工業株式会社 発光装置及びその製造方法
JP6319026B2 (ja) 2014-09-29 2018-05-09 日亜化学工業株式会社 発光装置及びその製造方法
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JP2017050350A (ja) * 2015-08-31 2017-03-09 日亜化学工業株式会社 発光装置及びその製造方法
JP6764666B2 (ja) * 2016-03-18 2020-10-07 新光電気工業株式会社 半導体装置及び半導体装置の製造方法
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KR20060048884A (ko) 2006-05-18

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