TW200608095A - Motherboard cutting method, motherboard scribing apparatus, program and recording medium - Google Patents

Motherboard cutting method, motherboard scribing apparatus, program and recording medium

Info

Publication number
TW200608095A
TW200608095A TW094116639A TW94116639A TW200608095A TW 200608095 A TW200608095 A TW 200608095A TW 094116639 A TW094116639 A TW 094116639A TW 94116639 A TW94116639 A TW 94116639A TW 200608095 A TW200608095 A TW 200608095A
Authority
TW
Taiwan
Prior art keywords
motherboard
cutting method
program
recording medium
scribing apparatus
Prior art date
Application number
TW094116639A
Other languages
English (en)
Other versions
TWI377381B (zh
Inventor
Yoshitaka Nishio
Original Assignee
Mitsuboshi Diamond Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Ind Co Ltd filed Critical Mitsuboshi Diamond Ind Co Ltd
Publication of TW200608095A publication Critical patent/TW200608095A/zh
Application granted granted Critical
Publication of TWI377381B publication Critical patent/TWI377381B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • C03B33/105—Details of cutting or scoring means, e.g. tips
    • C03B33/107—Wheel design, e.g. materials, construction, shape
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/027—Scoring tool holders; Driving mechanisms therefor
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/04—Cutting or splitting in curves, especially for making spectacle lenses
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133351—Manufacturing of individual cells out of a plurality of cells, e.g. by dicing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/307—Combined with preliminary weakener or with nonbreaking cutter
    • Y10T225/321—Preliminary weakener
    • Y10T225/325—With means to apply moment of force to weakened work

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
TW094116639A 2004-05-20 2005-05-20 Motherboard cutting method, motherboard scribing apparatus, program and recording medium TW200608095A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004149948 2004-05-20

Publications (2)

Publication Number Publication Date
TW200608095A true TW200608095A (en) 2006-03-01
TWI377381B TWI377381B (zh) 2012-11-21

Family

ID=35428304

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094116639A TW200608095A (en) 2004-05-20 2005-05-20 Motherboard cutting method, motherboard scribing apparatus, program and recording medium

Country Status (7)

Country Link
US (1) US20080286943A1 (zh)
EP (1) EP1747867A1 (zh)
JP (1) JP4777881B2 (zh)
KR (1) KR101181707B1 (zh)
CN (1) CN100577386C (zh)
TW (1) TW200608095A (zh)
WO (1) WO2005113212A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI508926B (zh) * 2011-10-04 2015-11-21 Mitsuboshi Diamond Ind Co Ltd 玻璃基板之劃線方法

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JP2007175997A (ja) * 2005-12-28 2007-07-12 Hitachi Media Electoronics Co Ltd スクライブカッター、基板加工方法、基板加工装置、それらを用いた基板、及び一枚板脆性材料部品。
JP2008132616A (ja) * 2006-11-27 2008-06-12 Shibuya Kogyo Co Ltd 脆性材料の割断方法とその装置
JP5508847B2 (ja) * 2007-04-12 2014-06-04 三星ダイヤモンド工業株式会社 スクライブ装置及び方法
DE102007045383A1 (de) * 2007-09-22 2008-07-17 Bohle Ag Verfahren zur Herstellung von Schneidrädchen
KR100889308B1 (ko) * 2007-11-21 2009-03-18 세메스 주식회사 스크라이빙 장치 및 방법 및 이를 이용한 기판 절단 장치
KR100848854B1 (ko) * 2008-04-21 2008-07-30 주식회사 탑 엔지니어링 취성기판의 스크라이빙 장치 및 그 방법
CN101269907B (zh) * 2008-05-06 2011-02-16 上海耀华皮尔金顿玻璃股份有限公司 切割玻璃的刀头座结构
WO2009154022A1 (ja) * 2008-06-18 2009-12-23 三星ダイヤモンド工業株式会社 基板加工システム
JP5192977B2 (ja) * 2008-10-10 2013-05-08 三星ダイヤモンド工業株式会社 貼り合せ基板のスクライブ方法
US8656738B2 (en) * 2008-10-31 2014-02-25 Corning Incorporated Glass sheet separating device
KR101104078B1 (ko) * 2008-11-24 2012-01-11 주식회사 탑 엔지니어링 취성기판의 브레이킹 장치 및 그 방법
KR20100107253A (ko) * 2009-03-25 2010-10-05 삼성모바일디스플레이주식회사 기판 절단 장치 및 이를 이용한 기판 절단 방법
KR101041137B1 (ko) * 2009-03-25 2011-06-13 삼성모바일디스플레이주식회사 기판 절단 장치 및 이를 이용한 기판 절단 방법
JP5349550B2 (ja) * 2011-07-20 2013-11-20 三星ダイヤモンド工業株式会社 スクライブ装置
US20130082997A1 (en) * 2011-09-30 2013-04-04 Apple Inc. System and method for detection of dimensions of display panel or other patterned device
JP2013112534A (ja) * 2011-11-25 2013-06-10 Mitsuboshi Diamond Industrial Co Ltd 脆性材料基板の分断方法
TWI488824B (zh) * 2011-12-05 2015-06-21 Mitsuboshi Diamond Ind Co Ltd The method and scribing device of glass substrate
CN103359925B (zh) * 2012-03-27 2016-04-27 三星钻石工业股份有限公司 强化玻璃基板的刻划方法及刻划装置
TWI511939B (zh) * 2012-03-28 2015-12-11 Mitsuboshi Diamond Ind Co Ltd A scribing line, a scribing device, a scribing method, a manufacturing method for a display panel, and a display panel
TWI481576B (zh) * 2012-05-02 2015-04-21 Taiwan Mitsuboshi Diamond Ind Co Ltd 切割玻璃之方法及切割設備
JP5991860B2 (ja) * 2012-06-19 2016-09-14 三星ダイヤモンド工業株式会社 ガラス基板の加工方法
US8669166B1 (en) * 2012-08-15 2014-03-11 Globalfoundries Inc. Methods of thinning and/or dicing semiconducting substrates having integrated circuit products formed thereon
CN103896483B (zh) * 2014-03-27 2016-08-17 深圳市华星光电技术有限公司 一种玻璃基板切割设备及切割方法
CN104280922B (zh) * 2014-10-27 2017-05-03 京东方科技集团股份有限公司 一种液晶屏玻璃切割方法和装置
JP6589362B2 (ja) * 2015-05-08 2019-10-16 三星ダイヤモンド工業株式会社 薄膜太陽電池の加工装置、および、薄膜太陽電池の加工方法
TWI605024B (zh) * 2015-08-07 2017-11-11 Mitsuboshi Diamond Ind Co Ltd Breaking method of brittle substrate
JP2019023146A (ja) * 2015-12-08 2019-02-14 Ａｇｃ株式会社 ガラス板およびガラス板の製造方法
TWI595599B (zh) * 2016-06-23 2017-08-11 友達光電股份有限公司 面板及其製造方法
CN106738359B (zh) * 2016-12-30 2019-02-01 惠科股份有限公司 一种残材去除装置
TWI681241B (zh) * 2018-12-04 2020-01-01 友達光電股份有限公司 顯示裝置製作方法及使用該方法製作的顯示裝置

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JPH02204337A (ja) * 1989-01-31 1990-08-14 Ichikoh Ind Ltd 板ガラス整形方法およびその装置
JPH06183762A (ja) * 1992-12-18 1994-07-05 Fuji Xerox Co Ltd 脆性基板割断方法
JP2000264657A (ja) * 1999-03-17 2000-09-26 Mitsuboshi Diamond Kogyo Kk ガラススクライバー
US6562698B2 (en) * 1999-06-08 2003-05-13 Kulicke & Soffa Investments, Inc. Dual laser cutting of wafers
JP3368876B2 (ja) * 1999-11-05 2003-01-20 株式会社東京精密 半導体チップ製造方法
JP2002087836A (ja) 2000-09-13 2002-03-27 Sanyo Electric Co Ltd 脆性非金属材料加工方法
JP5065551B2 (ja) * 2001-01-12 2012-11-07 坂東機工株式会社 ガラス板切断ヘッド及びこれを具備しているガラス板加工装置
CN1486285B (zh) * 2001-01-17 2013-01-16 三星宝石工业株式会社 划线分断设备及其系统
SG121700A1 (en) * 2001-12-28 2006-05-26 Jetsis Int Pte Ltd A method and related apparatus for cutting a product from a sheet material
CN100418718C (zh) * 2002-11-22 2008-09-17 三星钻石工业股份有限公司 基板分断方法以及采用该方法的面板制造方法
WO2005028172A1 (ja) * 2003-09-24 2005-03-31 Mitsuboshi Diamond Industrial Co., Ltd. 基板分断システム、基板製造装置および基板分断方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI508926B (zh) * 2011-10-04 2015-11-21 Mitsuboshi Diamond Ind Co Ltd 玻璃基板之劃線方法

Also Published As

Publication number Publication date
KR20070010173A (ko) 2007-01-22
EP1747867A1 (en) 2007-01-31
KR101181707B1 (ko) 2012-09-19
CN1953857A (zh) 2007-04-25
JP4777881B2 (ja) 2011-09-21
WO2005113212A1 (ja) 2005-12-01
TWI377381B (zh) 2012-11-21
US20080286943A1 (en) 2008-11-20
JPWO2005113212A1 (ja) 2008-03-27
CN100577386C (zh) 2010-01-06

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees