TW200604246A - Thermosetting resin composition and multi-layer printed circuit board used thereof - Google Patents

Thermosetting resin composition and multi-layer printed circuit board used thereof

Info

Publication number
TW200604246A
TW200604246A TW094106326A TW94106326A TW200604246A TW 200604246 A TW200604246 A TW 200604246A TW 094106326 A TW094106326 A TW 094106326A TW 94106326 A TW94106326 A TW 94106326A TW 200604246 A TW200604246 A TW 200604246A
Authority
TW
Taiwan
Prior art keywords
resin composition
thermosetting resin
circuit board
printed circuit
layer printed
Prior art date
Application number
TW094106326A
Other languages
English (en)
Chinese (zh)
Other versions
TWI367226B (cs
Inventor
Rieko Yamamoto
Masao Arima
Original Assignee
Taiyo Ink Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Ink Mfg Co Ltd filed Critical Taiyo Ink Mfg Co Ltd
Publication of TW200604246A publication Critical patent/TW200604246A/zh
Application granted granted Critical
Publication of TWI367226B publication Critical patent/TWI367226B/zh

Links

Classifications

    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61G—TRANSPORT, PERSONAL CONVEYANCES, OR ACCOMMODATION SPECIALLY ADAPTED FOR PATIENTS OR DISABLED PERSONS; OPERATING TABLES OR CHAIRS; CHAIRS FOR DENTISTRY; FUNERAL DEVICES
    • A61G17/00—Coffins; Funeral wrappings; Funeral urns
    • A61G17/08—Urns
    • A—HUMAN NECESSITIES
    • A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
    • A47G—HOUSEHOLD OR TABLE EQUIPMENT
    • A47G33/00—Religious or ritual equipment in dwelling or for general use
    • A47G33/02—Altars; Religious shrines; Fonts for holy water; Crucifixes
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61G—TRANSPORT, PERSONAL CONVEYANCES, OR ACCOMMODATION SPECIALLY ADAPTED FOR PATIENTS OR DISABLED PERSONS; OPERATING TABLES OR CHAIRS; CHAIRS FOR DENTISTRY; FUNERAL DEVICES
    • A61G17/00—Coffins; Funeral wrappings; Funeral urns
    • A61G17/007—Coffins; Funeral wrappings; Funeral urns characterised by the construction material used, e.g. biodegradable material; Use of several materials

Landscapes

  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Animal Behavior & Ethology (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Paints Or Removers (AREA)
TW094106326A 2004-04-26 2005-03-02 Thermosetting resin composition and multi-layer printed circuit board used thereof TW200604246A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004129141A JP4620967B2 (ja) 2004-04-26 2004-04-26 永久穴埋め用熱硬化性樹脂組成物

Publications (2)

Publication Number Publication Date
TW200604246A true TW200604246A (en) 2006-02-01
TWI367226B TWI367226B (cs) 2012-07-01

Family

ID=35345891

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094106326A TW200604246A (en) 2004-04-26 2005-03-02 Thermosetting resin composition and multi-layer printed circuit board used thereof

Country Status (4)

Country Link
JP (1) JP4620967B2 (cs)
KR (1) KR101212389B1 (cs)
CN (1) CN100509951C (cs)
TW (1) TW200604246A (cs)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20090098837A (ko) 2006-11-29 2009-09-17 도요 보세키 가부시키가이샤 옥세탄 함유 수지, 이를 사용한 접착제 및 레지스트제
JP5221893B2 (ja) * 2007-05-07 2013-06-26 協立化学産業株式会社 積層フィルムの製造方法
JP5344394B2 (ja) * 2008-07-10 2013-11-20 山栄化学株式会社 硬化性樹脂組成物、並びにハロゲンフリー樹脂基板及びハロゲンフリービルドアッププリント配線板
JP2010180355A (ja) 2009-02-06 2010-08-19 Taiyo Ink Mfg Ltd 熱硬化性樹脂組成物、ドライフィルムおよびプリント配線板とその製造方法
JP5889568B2 (ja) 2011-08-11 2016-03-22 メルク、パテント、ゲゼルシャフト、ミット、ベシュレンクテル、ハフツングＭｅｒｃｋ Ｐａｔｅｎｔ ＧｍｂＨ 酸化タングステン膜形成用組成物およびそれを用いた酸化タングステン膜の製造法
JP5876758B2 (ja) * 2012-03-23 2016-03-02 東京応化工業株式会社 インク組成物およびパターン形成方法
US9315636B2 (en) 2012-12-07 2016-04-19 Az Electronic Materials (Luxembourg) S.A.R.L. Stable metal compounds, their compositions and methods
US9201305B2 (en) 2013-06-28 2015-12-01 Az Electronic Materials (Luxembourg) S.A.R.L. Spin-on compositions of soluble metal oxide carboxylates and methods of their use
US9296922B2 (en) 2013-08-30 2016-03-29 Az Electronic Materials (Luxembourg) S.A.R.L. Stable metal compounds as hardmasks and filling materials, their compositions and methods of use
US9418836B2 (en) 2014-01-14 2016-08-16 Az Electronic Materials (Luxembourg) S.A.R.L. Polyoxometalate and heteropolyoxometalate compositions and methods for their use
US9409793B2 (en) * 2014-01-14 2016-08-09 Az Electronic Materials (Luxembourg) S.A.R.L. Spin coatable metallic hard mask compositions and processes thereof
JP6374434B2 (ja) * 2016-04-21 2018-08-15 山栄化学株式会社 熱硬化性樹脂組成物及び電子部品搭載基板
CN111051570B (zh) 2017-09-06 2022-05-10 默克专利股份有限公司 具有改善的热稳定性可用作硬掩膜的含旋涂式无机氧化物的组合物和填充材料
CN107960035A (zh) * 2017-11-13 2018-04-24 广东欧珀移动通信有限公司 壳体制作方法、壳体及移动终端
CN112126274A (zh) * 2020-09-16 2020-12-25 四川乐凯新材料有限公司 含链烯基醚和/或氧杂环丁烷类化合物的pcb用光固化性组合物

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4177013B2 (ja) * 2002-04-03 2008-11-05 ダイセル化学工業株式会社 熱硬化型エポキシ樹脂組成物の硬化方法、硬化物及びその用途
JP4204814B2 (ja) * 2002-06-28 2009-01-07 ヘンケル コーポレイション 熱硬化性液状樹脂組成物
JP2004285125A (ja) * 2003-03-19 2004-10-14 Daicel Chem Ind Ltd エポキシ樹脂組成物及びその硬化物
JP4492070B2 (ja) * 2003-09-12 2010-06-30 住友化学株式会社 硬化性樹脂組成物及び該組成物からなる保護膜

Also Published As

Publication number Publication date
TWI367226B (cs) 2012-07-01
JP2005307101A (ja) 2005-11-04
CN100509951C (zh) 2009-07-08
KR101212389B1 (ko) 2012-12-13
CN1690119A (zh) 2005-11-02
KR20060047455A (ko) 2006-05-18
JP4620967B2 (ja) 2011-01-26

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