TW200506001A - Thermosoftening heat-conductive member - Google Patents

Thermosoftening heat-conductive member

Info

Publication number
TW200506001A
TW200506001A TW093124383A TW93124383A TW200506001A TW 200506001 A TW200506001 A TW 200506001A TW 093124383 A TW093124383 A TW 093124383A TW 93124383 A TW93124383 A TW 93124383A TW 200506001 A TW200506001 A TW 200506001A
Authority
TW
Taiwan
Prior art keywords
component
heat
conductive member
electronic apparatus
mass
Prior art date
Application number
TW093124383A
Other languages
English (en)
Other versions
TWI352102B (zh
Inventor
Yoshitaka Aoki
Akio Nakano
Hiroaki Tetsuka
Kunihiko Mita
Tsutomu Yoneyama
Original Assignee
Shinetsu Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Chemical Co filed Critical Shinetsu Chemical Co
Publication of TW200506001A publication Critical patent/TW200506001A/zh
Application granted granted Critical
Publication of TWI352102B publication Critical patent/TWI352102B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0812—Aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2296—Oxides; Hydroxides of metals of zinc
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/16—Applications used for films

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
TW093124383A 2003-08-14 2004-08-13 Thermosoftening heat-conductive member TW200506001A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003293312A JP3932125B2 (ja) 2003-08-14 2003-08-14 熱軟化性熱伝導性部材

Publications (2)

Publication Number Publication Date
TW200506001A true TW200506001A (en) 2005-02-16
TWI352102B TWI352102B (zh) 2011-11-11

Family

ID=34370316

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093124383A TW200506001A (en) 2003-08-14 2004-08-13 Thermosoftening heat-conductive member

Country Status (4)

Country Link
JP (1) JP3932125B2 (zh)
KR (1) KR101064023B1 (zh)
CN (1) CN1268712C (zh)
TW (1) TW200506001A (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4901327B2 (ja) * 2005-07-25 2012-03-21 信越化学工業株式会社 放熱部材
JP5570077B2 (ja) * 2009-04-22 2014-08-13 協和化学工業株式会社 柱状酸化亜鉛粒子およびその製造方法
JP6815143B2 (ja) * 2016-09-14 2021-01-20 東洋アルミニウム株式会社 外科用固定材の製造方法
EP3708613B1 (en) * 2017-11-09 2022-11-23 Shin-Etsu Chemical Co., Ltd. Thermally conductive silicone grease composition
CN115244138A (zh) * 2020-03-11 2022-10-25 住友金属矿山株式会社 导热性组合物
EP4119615A4 (en) * 2020-03-11 2024-04-17 Sumitomo Metal Mining Co THERMALLY CONDUCTIVE COMPOSITION
EP4120337A4 (en) * 2020-03-11 2024-04-10 Sumitomo Metal Mining Co THERMOCONDUCTIVE PASTE
JP7286575B2 (ja) * 2020-03-24 2023-06-05 信越化学工業株式会社 熱軟化性付加硬化型熱伝導性シリコーン組成物

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3948642B2 (ja) * 1998-08-21 2007-07-25 信越化学工業株式会社 熱伝導性グリース組成物及びそれを使用した半導体装置
JP3072491U (ja) * 2000-04-13 2000-10-20 富士高分子工業株式会社 保護フィルム付きシリコーンゲル放熱シート
JP3580358B2 (ja) * 2000-06-23 2004-10-20 信越化学工業株式会社 熱伝導性シリコーン組成物及び半導体装置
JP2002084083A (ja) * 2000-07-06 2002-03-22 Fuji Kobunshi Kogyo Kk 放熱シート製品
US20040094293A1 (en) * 2001-04-23 2004-05-20 Kunihiko Mita Heat radiating member
JP3580366B2 (ja) * 2001-05-01 2004-10-20 信越化学工業株式会社 熱伝導性シリコーン組成物及び半導体装置
JP2002329989A (ja) * 2001-05-02 2002-11-15 Shin Etsu Chem Co Ltd 熱軟化性放熱シート
JP3844125B2 (ja) * 2002-01-22 2006-11-08 信越化学工業株式会社 放熱部材、その製造方法及びその敷設方法

Also Published As

Publication number Publication date
JP2005064281A (ja) 2005-03-10
KR20050017389A (ko) 2005-02-22
JP3932125B2 (ja) 2007-06-20
CN1590500A (zh) 2005-03-09
TWI352102B (zh) 2011-11-11
KR101064023B1 (ko) 2011-09-08
CN1268712C (zh) 2006-08-09

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